Understood: routing only—no component placement or movement. Switch to Agent mode to route the existing placement and verify all airwires and routing DRC.
Auto-routing converged with the existing placement: all nets are routed. I’m running the final airwire and DRC verification now; no components were moved.
External regulated +5 V source; no battery/runtime requirement.
Logic GND is common only to ESP32, MCP6002, PS2, and J4/J5 signal GND.
Power Tree and Power Budget
+5V -> ESP32 VIN and MCP6002 VDD.
ESP32 +3V3 -> PS2 connector and DAT pull-up.
L12V and R12V are externally supplied isolated contact-side nets and are not board power rails.
Manufacturing and Assembly Expectations
JLCPCB prototype target; later PCB: 2 layer, 1.6 mm FR-4, 1 oz copper, maximum 127 x 127 mm.
Through-hole axial 1/4 W, 1% resistors and through-hole ceramic capacitors.
DIP sockets and ESP32 female socket headers are assembly intent and must be included in the final BOM/assembly notes.
Firmware-Relevant Hardware Requirements
PS2 GPIOs: 19 DAT, 23 CMD, 27 ATT, 18 CLK.
Analog GPIOs: 25 left DAC, 26 right DAC.
Direction GPIOs: 21 LF, 22 LR, 32 RF, 33 RR.
Firmware must command zero throttle and all direction outputs low during boot, invalid input, or fault.
Physical Design Expectations
Public nominal DevKit footprint: 30 pins, 15 per side, 2.54 mm vertical pitch, 25.4 mm row spacing, 1.0 mm drills, 1.8 mm pads.
Public board-size references vary; verify the delivered module before fabrication, especially body width, USB overhang, antenna end, and button clearance.
Keep the four PhotoMOS contact-side paths physically separated from logic and from the opposite controller's isolated domain.
Important Design Decisions
MCP6002-I/P and AQY212EH identities are fixed.
Phoenix Contact 1729160 (6-position) and 1702558 (5-position) are used where exact KEFA 5/6-position library parts were unavailable; J1 uses KEFA KF128-5.08-2P-AA.
No PCB layout was started in this revision.
Assumptions and Remaining Risk
The DOIT DevKit ecosystem has clone-to-clone mechanical variation. The carrier footprint uses public nominal geometry and requires a physical fit check against the user's actual board before ordering.
Generic through-hole resistors and C2/C3 currently express value/package/rating but do not have final manufacturer MPNs assigned.
Change Notes
Completed the full schematic, test points, mounting holes, socket intent, no-connect markings, ERC, isolation checks, and analog DC simulation.