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Power Distribution Network Review

flux

1:45

Running design review.

Below is a focused PDN (Power Distribution Network) schematic review based on your current schematic nets and parts. I’ve organized it rail-by-rail, mapping sources to loads, noting decoupling/bulk practices, ground/reference strategy, sequencing/supervision, and basic protection. I also highlight critical gaps flagged by the DRC “Airwires” results, since many power nodes are still not fully wired.
High-level summary
  • Primary source/input power: USB-C VBUS via TYPE-C-31-M-12 and BAT60JFILM Schottky, feeding PMIC DA9062-00AM2 and system 3.3 V rail.
  • Regulators/References:
    • PMIC DA9062-00AM2: Buck1/Buck2/Buck3/Buck4 and LDOs, plus reference pins (VREF, IREF) and power-good/enable pins.
    • Precision reference + buffer for ADC VREF: REF3140AQDBZRQ1 feeding OPA350UA, creating Net 3 VREF = 4.096 V.
  • Major loads:
    • STM32F745VEH6: VDD, VDDA, VDDUSB, VCAPs, I/O pullups.
    • ICE40UP5K-UWG30ITR1K: VCC, VCCPLL, VCCIO rails.
    • DDC232CKZXGT X-ray DAS ADC: AVDD/DVDD, VREF, QGND.
    • Peripherals: AT25SL321-UUE-T SPI flash, BME280, USB-C, oscillator ASDM1-10.000MHZ-LC-T, LEDs, etc.
Note on connectivity status
  • The DRC shows 222 “Airwires” errors, including many power pins and decouplers. Many observations below are about intent and what’s placed, with recommendations to finish connections and align values/layout to best practices.
Rail-by-rail findings
  1. USB input / VBUS front-end (Net 25, Net 45, Net 117)
  • Source: TYPE-C-31-M-12 VBUS pins to BAT60JFILM (Net 25), providing reverse protection and ORing.
  • CC pins: R7, R15 are present; ensure correct values for device role and current advertisement. Airwires indicate incomplete connections to J1 pins.
  • Bulk & decoupling: Bulk tantalums are placed (C2, C5, C6, C8 around input nodes). Good start, but ensure ESR/voltage rating and that they sit physically tight at the power-entry and PMIC input.
  • ESD/EMI: No dedicated USB ESD diodes on DP/DM detected; consider adding a USB data-line ESD array and a TVS diode for VBUS. A common-mode choke on DP/DM is often used in noisy systems.
  • Recommendation:
    • Complete J1 wiring (VBUS, CC1/CC2 to Rp/Rd per role, shield and ground stitching).
    • Add input TVS (SMBJ5.0A class) on VBUS and an upstream fuse/limiter.
    • Ensure D+ / D− have ESD arrays and controlled-impedance routing.
  1. PMIC core rails (U5 DA9062) Likely rails from U5 mapping (based on nets):
  • 1.1 V core (Net 9 via L1 to VCC1V1, feeding ICE40UP5K-UWG30ITR1K VCC and decoupling C45, C46).
  • 1.8 V (Net 10 via L2 to VCCINT/AVCC1V8 portals), powering U4 VPP_2V5? and possibly I/O ref nets via LDO2 (Net 20).
  • 3.3 V (Net 115 via L4 and L5 filters), feeding U8 VDD/VDDUSB and most 3.3 V loads.
  • 1.8 V I/O (Net 40 via L3), feeding U4 SPI_Vccio1, VPP_2V5, plus BME280 VDDIO and U8 VDD/VDDA portals shown on that net; this looks inconsistent (see below). Observations:
  • Many DA9062 pins (VLX, VBUCKx, VDD_BUCKx, VBBAT, etc.) have placed inductors and capacitors but numerous incomplete connections per Airwires. Ensure every buck has:
    • Correct inductor value/current rating and saturation headroom.
    • Input and output capacitors sized per DA9062 datasheet for stability and transient response.
    • Short loops and shared grounds via solid planes.
  • Net 40 labeling/mapping issue: It carries 1.8 V buck output but also tags U8 VDD, VDDA, and many decouplers. STM32 VDD/VDDA are 3.3 V typical; mixing them on a 1.8 V net is a logical error. This looks like either mislabeled portals or unintended connections. Needs correction before layout.
  • Net 18 looks like a 3.3 V digital rail feeding U4 I/O banks, oscillator VDD, and multiple decouplers. Confirm rail intent (name it VCC3V3_DIG) and separate from analog 3.3 V (AVCC3V3) with RC/inductor as needed.
  • Recommendations:
    • Resolve net intent and naming: separate 3.3 V digital (MCU/FPGA I/O), 3.3 V analog (ADC analog), 1.8 V rails (core or I/O), and 1.1 V core. Rename nets to explicit names and remap portals.
    • For each DA9062 buck: finalize L/C values per load and stability tables; place output bulk close to inductor, multiple 0.1 uF/1 uF ceramics near each IC VDD pin cluster.
    • Add test points (already a PMIC_TP exists) on each rail for probing and bring-up.
  1. 3.3 V rail(s) (Net 115, Net 18, AVCC3V3 portals)
  • Net 115 includes U8 VDDUSB, U5 VDDIO, BME280 VDD, multiple bulk/decoupling caps, and L4/L5 filters. Likely the main 3.3 V.
  • Net 18 shows DVDD for ADC [DDC232], FPGA VCCIO banks, oscillator, and many decouplers. This is also 3.3 V digital by content.
  • AVCC3V3 portals feed U1 DVDD and other analog sections through LC and bulk ([C7], [C8], [C41], [C42], [C38] etc.).
  • Good practice: isolate analog 3.3 V for ADC with an LC or RC filter from the noisy 3.3 V digital domain; you have inductors [L5] and LC here. Ensure the inductor values and output capacitance meet the ADC PSRR and transient needs.
  • Recommendations:
    • Consolidate naming to VCC3V3_DIG and AVCC3V3_ANA; verify that U8 VDDA is on the analog-clean 3.3 V rail with its own RC filter per STM32F7 datasheet.
    • Confirm total 3.3 V current budget: MCU (worst-case), FPGA I/O, sensors, oscillators, LEDs, plus ADC digital. Validate PMIC Buck capacity with margin.
    • Provide local 0.1 uF + 1 uF at each device VDD pin cluster; add 10 uF near rail distribution branches.
  1. 1.1 V core (Net 9 → VCC1V1)
  • Feeds ICE40UP5K-UWG30ITR1K VCC and has multiple local caps ([C45], [C46], [C33], [C34]) shown around U4.
  • Recommendation:
    • Verify U4 core current draw vs buck rating; ensure minimum output caps and low ESL/ESR ceramic near U4 pins.
    • Ensure VCCPLL decoupling ([C33], [C34]) is on the recommended rail (often 1.2 V/1.1 V clean with small RC). Airwires report VCCPLL blocked by auto-layout; ensure this rail is separate from noisy domains and has dedicated local decouplers.
  1. 1.8 V rails (Net 10, Net 20, Net 40)
  • Net 10 appears as a 1.8 V core/logic rail (VCCINT portal), sourced by Buck1 via [L2]; supplies U4 VPP_2V5? and LDO2 branch (Net 20 → AVCC1V8).
  • Net 20 shows U5 VLDO2 feeding AVCC1V8; good pattern for a cleaner analog 1.8 V branch.
  • Net 40 currently conflates 1.8 V with U8 VDD/VDDA and other nodes: this must be corrected.
  • Recommendations:
    • Keep analog 1.8 V (if used) on an LDO-filtered branch separate from digital 1.8 V.
    • Correct any accidental ties of U8 VDD/VDDA to 1.8 V; STM32F745 VDD/VDDA should be 3.3 V nominal.
  1. Precision reference and ADC front-end (Net 3 VREF = 4.096 V)
  • Chain: REF3140AQDBZRQ1 → OPA350UA buffering VREF to ADC DDC232CKZXGT VREF. Bypass and output caps present ([C3], [C1], [C4], [C5], [C10]) with LC filtering around AV rails feeding this subsystem.
  • The ADC also has QGND net separated via portal QGND and tied at U1 QGND pin: excellent. Ensure single-point tie to main GND near ADC per datasheet.
  • Recommendations:
    • Complete the exact decoupling topology per REF3140 and OPA350 datasheets (input/output caps, any stability constraints at the op-amp output with capacitive load).
    • Route VREF as a guarded, quiet trace with Kelvin connection to ADC VREF pin; place local 0.1 uF and 1 uF at the ADC VREF pin to ground (per ADC datasheet).
    • Ensure VREF source derives from the analog-clean 3.3 V rail and is not contaminated by digital transients.
  1. STM32F745 power (U8)
  • VDD, VDDA, VDDUSB on nets Net 40, Net 115; VCAP_1/2 with [C53], [C54], [C55], [C63], [C59]-[C62]. Airwires show some VCAP pins are not fully connected to their dedicated caps yet.
  • Recommendation:
    • Ensure all VCAP pins have the exact capacitance and ESR requirements per STM32F745 datasheet and are wired only to their caps and ground.
    • VDDA should have an RC filter from VDD and its own decoupling cluster.
    • VDDUSB must be 3.3 V; confirm it’s only on the 3.3 V rail with sufficient local decoupling.
  1. FPGA power (U4)
  • VCC (core) on Net 9 (1.1 V), VCCPLL (Airwires warnings), VCCIO banks on Net 18 and Net 40. Clock/oscillator [ASDM1-10MHz] powered from Net 18; ensure its decoupling caps close.
  • Recommendation:
    • Match VCCIO levels to interfacing devices (MCU, Flash, ADC digital). If MCU is 3.3 V, most VCCIO should be 3.3 V unless level-shifting is used.
    • Isolate VCCPLL with RC and give it dedicated 100 nF close to pins.
    • Ensure core rail transient capacity near the FPGA: add multiple 0.1 uF 0402 caps around the device perimeter plus 4.7–10 uF bulk nearby.
  1. SPI flash and sensor rails
  • AT25SL321-UUE-T VCC on Net 40 currently (intended 3.3 V); move it to the proper 3.3 V rail if Net 40 is 1.8 V.
  • BME280 VDD on Net 115 (3.3 V), VDDIO on Net 40 (likely 3.3 V too). Keep sensor on the quietest 3.3 V branch you can afford (post-LC if available), with local 100 nF and 1 uF.
  1. Ground and references
  • Single GND net is used widely with some analog discipline: QGND for ADC is separated and tied at U1. USB shield to ground via RC/ESD path indicated ([C17], [R12]).
  • Recommendation:
    • Confirm single-point connection strategy for QGND to GND and keep analog star-point near ADC reference return.
    • Stitch grounds generously around PMIC and high di/dt paths; keep VREF and ADC inputs away from switching current loops.
    • USB shield should connect to chassis/earth strategy; if not using chassis, use RC/ESD to signal ground as you’ve started.
  1. Sequencing, enables, supervision
  • DA9062 has many control pins present: ~ONKEY, ~RESET, ~RESETREQ, GPIOs; MCU BOOT0 and NRST nets are present with pull-ups/pull-downs.
  • Recommendations:
    • Use PMIC power-good rails to gate sensitive loads (e.g., release ADC and FPGA only after rails are in regulation).
    • Ensure MCU NRST pull and caps follow datasheet; verify BOOT0 resistor network for intended boot mode.
    • Consider adding a rail supervisor on the 3.3 V digital rail if PMIC doesn’t already assert a system-level reset with proper sequencing.
  1. Protection and EMC
  • USB input has Schottky but no upstream fuse or TVS; add polyfuse and VBUS TVS.
  • Add ESD diodes on all external connectors (USB D+/D−, CC, any user IO headers like SM06B-SRSS-TB(LF)(SN)).
  • Consider common-mode chokes for sensitive clock/USB lines.
  • If CT DAS is a noisy environment, consider LC/T filters per rail branches that feed analog domains (ADC, VREF, sensors).
Key issues to resolve next
  1. Fix net intent/naming and misconnections:
    • Net 40 currently ties 1.8 V nodes and STM32 VDD/VDDA; split and correct.
    • Explicitly name rails: VDD_3V3_DIG, VDD_3V3_ANA, VDD_1V1_CORE, VDD_1V8_DIG, VDD_1V8_ANA, etc.
  2. Close all airwires on power pins and decouplers:
    • Especially U5 buck in/out loops, U8 VCAP pins, U4 VCCPLL and VCCIO banks, ADC DVDD/AVDD and VREF decouplers.
  3. Validate PMIC L/C selections and rail capacity:
    • Confirm peak and average current per rail (MCU, FPGA, ADC digital, IOs).
    • Confirm loop stability per DA9062 datasheet with your chosen inductors/caps.
  4. Strengthen input protection:
    • Add VBUS TVS, polyfuse, data-line ESD, and consider input LC.
  5. Analog cleanliness:
    • Keep VREF and ADC analog rails isolated via LC/RC filters, with star-ground at ADC.
    • Ensure STM32 VDDA has its RC and local caps.
  6. Decoupling completeness:
    • Per device pin clusters, place 1× 0.1 uF per power pin (or per pair) plus 1–4.7 uF bulk per side of large ICs; place as close as possible to pins.
If you want, I can propose exact L/C values per DA9062 rail and a decoupling spreadsheet for each device pin cluster, and then wire the nets accordingly.
Calculate buck LC
Find input TVS
Rename power nets
Compute RC cutoff
Plot PDN impedance
255 days

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    CT Scanner DAS Board [Net Type]

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    CT Scanner DAS board design based on DDC232 ADC, iCE40 UltraPlus FPGA, and STM32F745 MCU integration. Designed for efficient data acquisition and processing #scanner #ice40 #computedTomography #STM32F745

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