BoomPack Audio Project Overview

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3:27

Thought for 16 sec — Considering tool usage
Looking up Flux PCB routing cleanup delete all traces vias fl....
Checking 4 design areas.
Getting a layout overview.
Completed 4 design checks — found 224 issues.
Reading layout details.
Editing layout rules.
Reading layout details.
Editing layout rules.
Checking 4 design areas.

flux

  • Set Smart Via's active to "false"
  • Set Smart Via's active to "false"
  • Set Smart Via's active to "false"

flux

Work done
  • Verified the board is still 75×75mm with a 4-layer stackup and component placements intact.
  • Confirmed stale routing geometry remains: 476 trace segments, 39 smart vias, 92 vias, and 1 fill.
  • Checked DRC status: airwire/dangling routing errors are still present, so the board is not yet clean or rerouted.
Success criteria review
  • ❌ Stale routing fully removed: not met.
  • ✅ Board size/stackup/placement preserved: met.
  • ❌ Board rerouted from scratch and manufacturable: not met.
Next steps
A bulk PCB rip-up/delete operation and autorouting pass are required next. The routing guidance specifically calls for deleting dangling/stale traces before autorouting, then verifying airwires/DRC afterward .
Delete stale routing
Define net classes
Check cleanup DRC
Review stackup usage
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Files

Schematic

Layout

Preview

Boost Replacement Notes
Summary
  • Replaced the original U_BOOST LT1302CS8-5 boost converter with U_BOOST FP6276XR-G1.
  • Removed the external Schottky diode D_BOOST because FP6276 is a synchronous boost converter with VO pins.
  • Replaced the original 4.7 uH / 2.3 A L_BOOST with FXL0630-2R2-M, a shielded 2.2 uH inductor rated 9.5 A. This is within the FP6276 datasheet recommended 1.5 uH to 4.7 uH inductor range.
  • Added feedback divider and snubber parts required by the FP6276 datasheet-style application circuit.
Selected replacement
  • U_BOOST: FP6276XR-G1, LCSC C114313, SOP-8 with exposed pad.
  • Reason: Higher current margin than MT3608 for the audio pod 5V rail. FP6276 datasheet content indicates 5V operation at around 2.1 A load and a 6 A switch current limit. MT3608 is a smaller SOT-23-6 4 A-switch boost option.
Updated boost circuit
  • VBAT_SW connects to U_BOOST:VIN, U_BOOST:EN, and L_BOOST:1.
  • BOOST_SW connects to U_BOOST:LX::1, U_BOOST:LX::2, L_BOOST:2, and R_BOOST_SNUB:P1.
  • 5V_BOOST connects to U_BOOST:VO::7, U_BOOST:VO::8, output capacitors, U_3V3:VIN, and MAX98357A VDD pins.
  • BOOST_FB connects to U_BOOST:FB, R_BOOST_FB_TOP:P2, and R_BOOST_FB_BOT:P1.
  • GND connects to U_BOOST:GND, U_BOOST:EP, R_BOOST_FB_BOT:P2, and C_BOOST_SNUB:P2.
  • BOOST_SNUB connects R_BOOST_SNUB:P2 to C_BOOST_SNUB:P1.
New/changed values
  • R_BOOST_FB_TOP: 73.2 kΩ, 1%, 0603.
  • R_BOOST_FB_BOT: 10 kΩ, 1%, 0603.
  • Feedback output setting: VOUT = 0.6 V × (1 + 73.2 kΩ / 10 kΩ) = 4.992 V.
  • R_BOOST_SNUB: 1.5 Ω, 5%, 0603.
  • C_BOOST_SNUB: 2.2 nF, 25 V, X7R, 0603.
  • Existing output capacitance preserved: C_BOOST_OUT 47 uF and C_5V_BULK 47 uF on 5V_BOOST, plus downstream local amplifier/LDO capacitors.
Load compatibility assessment
  • The 5V rail powers the MAX98357A amplifier VDD pins and the AMS1117-3.3 input.
  • FP6276 was selected because its documented 5V/2.1 A operating example provides more margin than MT3608 for the combined class-D audio amplifier and ESP32/LDO load.
  • The configured feedback target is 4.992 V, effectively preserving the previous 5V boost rail.
PCB layout update
  • Placed the new U_BOOST, L_BOOST, feedback divider, and snubber in the existing boost-converter area.
  • L_BOOST is placed close to the LX pins.
  • Feedback resistors are placed close to FB and away from the switching node.
  • Snubber is placed close to LX/GND.
  • Placement pass reports no component overlap, out-of-bounds, or boost-cluster spacing issues.
Current validation status
  • Schematic connectivity for the new boost stage is verified.
  • BOM shows U_BOOST FP6276XR-G1 available through LCSC and L_BOOST FXL0630-2R2-M available through LCSC/HQonline.
  • Current layout review still reports routing/copper issues from stale or missing physical traces around the replaced boost cluster: 12 airwire errors, 13 overlapping-copper errors, and 2 dangling-trace warnings.
  • These remaining PCB issues require trace cleanup and re-routing before fabrication. The required routing/trace-deletion action is not available in the current tool set, so this run cannot make the PCB DRC clean.

  • Summary

  • Selected replacement

  • Updated boost circuit

  • New/changed values

  • Load compatibility assessment

  • PCB layout update

  • Current validation status