Clonación de Proyecto Electrónico


  • Connected U9:DIO2, R35:P2 to ^LORA_M0
  • Connected U9:BUSY, R36:P2 to ^LORA_M1
  • Connected U9:DIO1 to ^LORA_AUX
  • Connected U9:RXEN to ^LORA_RXD
  • Connected U9:TXEN to ^LORA_TXD
Trabajo realizado
  • Completé las conexiones de CAN (U7), FRAM I2C (U8) y LoRa (U9) con alimentación, señales, desacoplos, pull-ups, terminación DNP, TVS y conectores requeridos.
  • Añadí las notas de diseño y el estado ERC en Communication Block Notes.
  • Verifiqué las nets clave: 3V3, GND, CAN_TX, CAN_RX, CANH, CANL, I2C_SDA, I2C_SCL, SPI_CLK, SPI_MOSI, SPI_MISO, SPI_CS_LORA, LORA_M0, LORA_M1, LORA_AUX, LORA_RXD, LORA_TXD y ANT_LORA.
Revisión de criterios
  • ✅ Bloques CAN/FRAM/LoRa conectados con los componentes especificados.
  • ✅ Pasivos, TVS, conectores y notas de diseño añadidos.
  • ✅ ERC objetivo para U7/U8/U9 y nets LoRa revisado sin errores/advertencias nuevas; el proyecto completo aún tiene advertencias preexistentes fuera de estos bloques.
Siguientes pasos
Puedo continuar con el layout PCB: colocar estos nuevos pasivos/conectores cerca de sus ICs, ubicar J_CAN/J_ANT_LORA en borde de placa y preparar la ruta RF de 50Ω para ANT_LORA.
Cómo puedo clonar este proyecto?
Puedes clonarlo desde este enlace: Clonar proyecto en tu cuenta.
En Flux, el enlace de clonación usa el formato cloneProject?documentUid=&prompt=; para este proyecto el documentUid es 81283b3c-dbf1-405c-a286-c776234efc09 .
Clonar y cablear AFE
Revisar ERC/DRC
Ubicar clon
Preparar layout

U2
Manufacturer Part Number
AMS1117-3.3
U3
Manufacturer Part Number
ESP32-S3-WROOM-1-N16R8
U10
Manufacturer Part Number
ATGM336H-5N31
IC1
Manufacturer Part Number
BQ25185DLHR
U11
J_ANT_LORA
D1
J1
Q2
Q1
J2
U7
Manufacturer Part Number
SN65HVD230DR
R21
Resistance
200 kΩ
U_AFE_CA
Manufacturer Part Number
OPA2314AIDR
R20
Resistance
10 kΩ
R16
Resistance
1 kΩ
R36
Resistance
10kΩ
NT1
R12
Resistance
1 kΩ
R_HV1
Resistance
100 kΩ
R91
Resistance
4.7kΩ
R_LV1
Resistance
4.7 kΩ
R10
Resistance
1 kΩ
R11
Resistance
1 kΩ
R22
Resistance
10 kΩ
R13
Resistance
1 kΩ
R35
Resistance
10kΩ
R14
Resistance
1 kΩ
R15
Resistance
1 kΩ
R2
Resistance
10kΩ
R1
Resistance
2kΩ
R90
Resistance
4.7kΩ
R_TERM
Resistance
120Ω
R17
Resistance
1 kΩ
U_AFE_NA
Manufacturer Part Number
OPA2314AIDR
R23
Resistance
200 kΩ
TVS_CAN2
U9
Manufacturer Part Number
E22-900M22S
U8
Manufacturer Part Number
FM24CL64B-GTR
TVS_CAN1
C33
Capacitance
10 nF
C30
Capacitance
10 nF
C22
Capacitance
100 nF
C_F_CA
Capacitance
100 pF
C55
Capacitance
100nF
C28
Capacitance
10 uF
C20
Capacitance
100 nF
C36
Capacitance
10 nF
J_CAN
C29
Capacitance
10 uF
C42
Capacitance
1uF
C_F_NA
Capacitance
100 pF
C40
Capacitance
100 nF
C26
Capacitance
100 nF
C38
Capacitance
100 nF
C35
Capacitance
10 nF
C24
Capacitance
100 nF
U4
Manufacturer Part Number
ADS131M04IPWR
C_CAN1
Capacitance
100nF
C37
Capacitance
10 nF
C56
Capacitance
100nF
C25
Capacitance
100 nF
C39
Capacitance
100 nF
C23
Capacitance
100 nF
C32
Capacitance
10 nF
C31
Capacitance
10 nF
C34
Capacitance
10 nF
U1
Manufacturer Part Number
LM2596S-5.0/NOPB
C52
Capacitance
100nF
C27
Capacitance
100 nF
C41
Capacitance
100 nF
C_CAN2
Capacitance
100nF
C21
Capacitance
100 nF
L1
Inductance
100uH
C2
Capacitance
220uF
C1
Capacitance
100uF
Communication Block Notes
CAN - SN65HVD230DR
  • U7 is powered from 3V3 with local 100nF decoupling capacitors C_CAN1 and C_CAN2 to GND.
  • RS is tied to GND for always-active high-speed mode.
  • D/R are labeled CAN_TX/CAN_RX.
  • CANH/CANL go to J_CAN with pinout: GND, CANH, CANL, GND.
  • R_TERM is 120Ω and DNP: populate only on the last node in the CAN bus.
  • CANH/CANL: maintain 100Ω differential impedance in PCB layout.
  • TVS_CAN1 and TVS_CAN2 provide line-to-GND transient protection.
FRAM I2C - FM24CL64B-GTR
  • U8 VDD is powered from 3V3 with C52 100nF/10V decoupling to GND.
  • SDA/SCL are connected to I2C_SDA/I2C_SCL.
  • A0/A1/A2 are tied to GND, selecting I2C address 0x50.
  • WP is tied to GND, write protect disabled.
  • R90/R91 are 4.7kΩ pull-ups to 3V3.
  • I2C pull-ups shared across all I2C devices: FM24CL64B, SSD1309, BQ25185, EZO-EC. Only one pair of pull-ups for the whole bus.
LoRa - EBYTE E22-900M22S
  • U9 VCC is powered from 3V3 with C55/C56 100nF/10V decoupling to GND.
  • SCK/MOSI/MISO are connected to SPI_CLK/SPI_MOSI/SPI_MISO shared with ADS131M04.
  • NSS is connected to SPI_CS_LORA. SPI_CLK/MOSI/MISO shared with ADS131M04. CS pins independent.
  • ANT is connected to ANT_LORA and J_ANT_LORA U.FL.
  • 50Ω trace to U.FL. Keep short and away from switching regulators.
  • LORA_RXD/TXD: connect to available UART3 on ESP32 or buffer. Verify in firmware.
  • Note: the current E22-900M22S symbol exposes SPI-control pins (RXEN, TXEN, DIO1, DIO2, BUSY, NRST) rather than pins named M0, M1, AUX, RXD, TXD. The schematic uses the requested net labels on the closest available symbol pins: DIO2→LORA_M0, BUSY→LORA_M1, DIO1→LORA_AUX, RXEN→LORA_RXD, TXEN→LORA_TXD. Verify this pin mapping against the exact EBYTE variant before PCB release.
ERC check - 2026-05-11
  • Targeted ERC checks for U7, U8, U9, LORA_RXD, and J_ANT_LORA reported no matching errors or warnings after wiring.
  • Full project ERC still reports unrelated pre-existing floating-pin warnings in other blocks (GPS/LTE/MCU/etc.). No target communication-block ERC issues were found.
  • CAN - SN65HVD230DR

  • FRAM I2C - FM24CL64B-GTR

  • LoRa - EBYTE E22-900M22S

  • ERC check - 2026-05-11