Hardware Prototype Planning


The connector-placement pass previously established these intended orientations:
  • J1/JD: 270°, outward left
  • J3–J6: 90°, outward right
  • J8/J9: 180°, outward top
  • J2/J7: 0°, outward bottom
  • Both Ethernet jacks oriented consistently toward their assigned outside edge
  • All components remain top-side assembly only
Since then, the authoritative stackup was finalized as custom-4-layer:
  • Top: 0.070 mm / 2 oz
  • Mid-Layer 1: 0.035 mm / 1 oz, ground plane
  • Mid-Layer 2: 0.035 mm / 1 oz, power plane
  • Bottom: 0.070 mm / 2 oz
I cannot perform the requested live reconciliation or continue mutations because no ACUs are currently available.
Remaining work:
  • Verify connector layers, rotations, mating faces, edge clearances, and 3D seating in the live PCB.
  • Confirm JD’s correct physical part/land pattern; preserve its existing electrical pin mapping.
  • Apply custom-4-layer to the board.
  • Complete the component Layout/footprint metadata audit.
  • Verify 170 top-side and 0 bottom-side components.
  • Run placement DRC and correct overlaps/courtyard violations.
  • Apply the supplied JLCPCB rules, then proceed to routing and manufacturing export.
Reconcile connector placement
Audit connector fit
Confirm JD footprint
Apply four-layer stackup
Check placement violations

Schematic Completion Gaps
Fresh status check: 2026-08-20
Current design: 169 components, 168 nets.
Bottom line
The logical schematic is fully wired and the fresh ERC is clean, but it is not yet production-complete because sourcing metadata and power-stage validation remain open.
1. Unresolved or stale nets
Two empty net objects remain and should be deleted as cleanup:
  • +12V_FUSED — 0 connected pins.
  • U1_GATE — 0 connected pins. The active gate-drive connection is correctly named GATE_DRV.
No connected single-pin nets, floating pins, undriven nets, or unconnected wire endpoints remain.
2. Unwired stages
None. All defined stages are represented and electrically connected:
  • Power entry, +5 V and +3.3 V rails
  • ATmega core and ESP32 orchestration
  • Both W5500 Ethernet interfaces and magnetics/connectors
  • F-RAM, RTC/CR2032, ATECC608B
  • USB-C and service/debug paths
  • SAS and both switched COM isolation paths
  • J8/J9 optocoupled machine I/O
  • LM5155 54 V boost and TPS23861 Mode-B PSE port
  • J7 ISP/UART/power/test header
  • ESP32 remote ATmega ISP/reset path
3. ERC and automated review status
Fresh electrical review returned zero ERROR, WARNING, OPEN, or UNCERTAIN findings for:
  • Floating pins
  • Single-pin nets
  • No-connect handling
  • Missing/undriven power pins
  • Driver conflicts
  • Pin-to-pin conflicts
  • Shorted components
  • Undriven nets
  • Unconnected wire endpoints
  • Annotation/label similarity and multi-unit consistency
Passive/component checks also have no open electrical findings. The missing-footprint check is clean.
4. Missing manufacturing MPNs — review count discrepancy
The manufacturing review category header reports 85 parts without an MPN, but the individual findings enumerate 88 designators: 24 resistors, 63 capacitors, and TP1. Use the enumerated designators as the actionable source and re-run the check after assignments. This does not break connectivity, but it blocks calling the BOM manufacturing-ready.
Resistors — 24
R1, R2, R3, R4, R6, R9, R10, R11, R12, R13, R14, R15, R16, R17, R19, R20, R68, R69, R70, R71, R72, R73, R74, R75
Capacitors — 63
C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, C11, C12, C13, C14, C15, C16, C17, C18, C19, C20, C21, C22, C23, C24, C25, C26, C27, C28, C29, C30, C31, C32, C33, C34, C35, C36, C37, C38, C39, C40, C41, C42, C43, C44, C45, C46, C47, C48, C49, C50, C60, C62, C63, C64, C65, C66, C67, C68, C69, C74, C75, C76, C77
Four LM5155 capacitors (C70-C73) already have exact reference-design MPNs and are intentionally excluded.
Test point — 1
  • TP1
Highest-priority sourcing selections
  • C74, C75: 4.7 µF, 100 V output ceramics with DC-bias-effective capacitance verified at 54 V.
  • C76: 100 µF, 100 V low-ESR bulk output capacitor with adequate ripple-current rating.
  • C77: 100 µF, 25 V input bulk capacitor with adequate ripple-current and hot-plug rating.
  • C66, C69: 100 nF, 100 V X7R parts for TPS23861 VPWR/port use.
  • R16, R17: 0.51 Ω, 1%, 0.25 W Kelvin shunt pair in 0805.
  • TP1: assign the intended manufactured test-point MPN or explicitly mark as a copper-pad test feature excluded from BOM.
5. Newly confirmed component conflict
F2 response type
F2 = Littelfuse 045101.5MRL is rated 1.5 A and 125 V, so its voltage/current ratings are suitable. However, its datasheet identifies it as very fast-acting. The TPS23861 reference guidance calls for a slow-blow fuse rated at least 60 VDC and above approximately 2× ICUT(max).
This is a real datasheet conflict. Before release, either:
  1. Replace F2 with a 1.5 A-class, ≥60 VDC time-delay fuse, or
  2. Explicitly approve the very-fast fuse after inrush/startup testing proves nuisance opening will not occur.
6. Power-stage validation still required
The LM5155 circuit is adapted from TI's 24 V / 48 W reference to 54 V using a 106 kΩ / 2 kΩ feedback divider and 100 V switch/rectifier/output parts. It still requires validation across the approved 10.8–13.2 V ATX range:
  • Startup and hot-plug behavior
  • 54 V regulation and ripple
  • Peak switch/inductor/shunt current
  • Current-limit margin
  • MOSFET, diode, inductor, and shunt temperature rise
  • Output-capacitor ripple current and DC-bias derating
  • Compensation/loop stability and transient response
  • TPS23861 detection/classification/inrush with the selected PSE supply
This is a validation task, not an unwired schematic gap.
7. Explicit design choices awaiting review sign-off
  • Q2: currently source=USB_VBUS, drain=+5V, gate pulled to GND through R13=100 kΩ, creating automatic USB-powered +5 V with PMOS reverse blocking. This was intentionally flagged for review.
  • D2/TP1: D2 cathode=+5V, anode=TEST_CLAMP_NODE, with TP1 on the protected node. This was intentionally flagged for review.
Exact finish checklist
  1. Delete empty nets +12V_FUSED and U1_GATE.
  2. Resolve F2 fast-acting versus required time-delay behavior.
  3. Assign the 88 individually enumerated missing MPNs, prioritizing high-voltage/high-current parts, then re-run the manufacturing check to resolve its 85-versus-88 count discrepancy.
  4. Approve or revise the Q2 and D2/TP1 review-note choices.
  5. Validate the LM5155/TPS23861 power stage electrically and thermally.
  6. Re-run ERC, passive/component checks, BOM review, and netlist/domain audit.
  7. Stop before PCB layout until those items pass.
  • Bottom line

  • 1. Unresolved or stale nets

  • 2. Unwired stages

  • 3. ERC and automated review status

  • 4. Missing manufacturing MPNs — review count discrepancy

  • Resistors — 24

  • Capacitors — 63

  • Test point — 1

  • Highest-priority sourcing selections

  • 5. Newly confirmed component conflict

  • F2 response type

  • 6. Power-stage validation still required

  • 7. Explicit design choices awaiting review sign-off

  • Exact finish checklist