Hardware Prototype Planning

Thought for 2 sec

flux

The connector-placement pass previously established these intended orientations:

J1/JD: 270°, outward left
J3–J6: 90°, outward right
J8/J9: 180°, outward top
J2/J7: 0°, outward bottom
Both Ethernet jacks oriented consistently toward their assigned outside edge
All components remain top-side assembly only

Since then, the authoritative stackup was finalized as custom-4-layer:

Top: 0.070 mm / 2 oz
Mid-Layer 1: 0.035 mm / 1 oz, ground plane
Mid-Layer 2: 0.035 mm / 1 oz, power plane
Bottom: 0.070 mm / 2 oz

I cannot perform the requested live reconciliation or continue mutations because no ACUs are currently available.

Remaining work:

Verify connector layers, rotations, mating faces, edge clearances, and 3D seating in the live PCB.
Confirm JD’s correct physical part/land pattern; preserve its existing electrical pin mapping.
Apply custom-4-layer to the board.
Complete the component Layout/footprint metadata audit.
Verify 170 top-side and 0 bottom-side components.
Run placement DRC and correct overlaps/courtyard violations.
Apply the supplied JLCPCB rules, then proceed to routing and manufacturing export.

Reconcile connector placement

Audit connector fit

Confirm JD footprint

Apply four-layer stackup

Check placement violations

Files

Schematic

Layout

Preview

Schematic and PCB Handoff Package Template

Purpose: This package provides the requirements and source evidence needed to create, verify, lay out, and release a fabrication-ready PCB. Replace every bracketed instruction. Use TBD for unresolved items—never leave an important field silently blank.

Document Control

Table

Field	Entry
Project name	[Project name]
Product / assembly number	[Number]
Hardware revision	[Rev]
Document revision	[Rev]
Prepared by	[Name / organization]
Date	[YYYY-MM-DD]
Approval authority	[Name / role]
Intended fab / assembler	[Company or TBD]
Confidentiality	[Public / confidential / export-controlled, etc.]

Revision History

Table

Document Rev	Date	Author	Changes	Approved By
A	[Date]	[Name]	Initial release	[Name]

Requirement Language

MUST: mandatory and acceptance-critical.
SHOULD: preferred; deviations require documentation.
MAY: optional.
Every assumption must be marked ASSUMPTION and resolved before manufacturing release.

1. Package Manifest

List every supplied file and identify which file is authoritative if sources conflict.

Table

File / Folder	Format	Revision	Purpose	Authority / Priority
This specification	Markdown	[Rev]	Requirements and design intent	Primary for requirements
BOM	CSV/XLSX	[Rev]	Approved components	Primary for MPNs
Connectivity	CSV	[Rev]	Pin-level electrical connections	Primary for netlist
Board outline	DXF	[Rev]	PCB perimeter, slots, holes	Primary for 2D geometry
Enclosure	STEP	[Rev]	Mechanical fit	Primary for 3D fit
Datasheets	PDF	[Rev/date]	Component constraints	Primary for component limits

Conflict rule: [Example: latest manufacturer datasheet governs electrical and land-pattern constraints; released mechanical drawing governs connector position; this specification governs product requirements.]

2. Product Overview and Theory of Operation

2.1 Purpose

[One concise paragraph describing what the product does, who or what uses it, and its primary operating environment.]

2.2 Theory of Operation

Describe operation from power application through normal use and shutdown. Include:

Power entry and protection.
Rail generation and sequencing.
Controller startup and programming.
Sensor, actuator, communications, and user-interface behavior.
Fault detection and safe-state behavior.
Shutdown and energy-discharge behavior.

2.3 Functional Block Diagram

[Insert or link a diagram. Label every power rail and inter-block interface.]

2.4 Operating Modes

Table

Mode	Entry Condition	Active Blocks	Typical Current	Peak Current	Exit Condition	Safe State
Off	[Condition]	[Blocks]	[A]	[A]	[Condition]	[State]
Startup	[Condition]	[Blocks]	[A]	[A]	[Condition]	[State]
Normal	[Condition]	[Blocks]	[A]	[A]	[Condition]	[State]
Fault	[Condition]	[Blocks]	[A]	[A]	[Condition]	[State]

2.5 Breadboard / Prototype Evidence

Table

Test	Configuration	Input Conditions	Measured Result	Pass Criterion	Evidence File
[Test]	[Setup]	[Conditions]	[Result]	[Criterion]	[File/photo/log]

List known differences between the breadboard and intended PCB:

Table

Difference	PCB Risk	Required Mitigation / Verification
[Long jumper wires vs PCB traces]	[Risk]	[Action]

3. Scope, Constraints, and Acceptance

3.1 Included Scope

[Schematic capture]
[PCB stackup and board outline]
[Placement and routing]
[ERC/DRC review]
[Gerber, drill, BOM, and pick-and-place outputs]
[Other]

3.2 Excluded Scope

[Firmware]
[Enclosure changes]
[Certification testing]
[Other]

3.3 Product-Level Requirements

Table

ID	Requirement	Priority	Verification Method	Pass Criterion
SYS-001	[Requirement]	MUST	[Inspection/test/analysis]	[Measurable criterion]

3.4 Open Decisions

Table

ID	Question / Decision	Options	Decision Owner	Due Before	Status
TBD-001	[Question]	[Options]	[Owner]	[Schematic/layout/release]	Open

4. Environmental, Reliability, and Regulatory Requirements

Table

Parameter	Minimum	Nominal	Maximum	Units	Notes / Standard
Operating temperature	[ ]	[ ]	[ ]	°C	[Ambient or board]
Storage temperature	[ ]	[ ]	[ ]	°C
Relative humidity	[ ]	[ ]	[ ]	%RH	[Condensing/non-condensing]
Altitude	[ ]	[ ]	[ ]	m
Shock / vibration	[ ]	[ ]	[ ]	[Units]	[Standard/profile]
Pollution degree	[ ]	—	[ ]	—
Expected service life	[ ]	—	[ ]	years/hours

Applicable Standards

Table

Standard / Requirement	Edition	Applicable Section	Design Impact	Evidence Required
IPC-2221	[Edition]	[Section]	General PCB design	DRC / review
IPC-7351	[Edition]	[Section]	Land patterns	Footprint review
[UL/IEC/FCC/CE/etc.]	[Edition]	[Section]	[Impact]	[Evidence]

Materials and Compliance

Table

Requirement	Required?	Evidence / Notes
RoHS	[Yes/No]	[Declaration]
REACH	[Yes/No]	[Declaration]
Halogen-free	[Yes/No]	[Requirement]
Lead-free assembly	[Yes/No]	[Process]
Conformal coating	[Yes/No]	[Keepout/coverage]

5. Electrical Interfaces and Performance

5.1 External Interfaces

Table

Interface ID	Connector	Direction	Protocol / Signal	Voltage	Frequency / Data Rate	Cable / Mating Part	Hot-Plug?	Protection Required
IF-001	J1	Input	[Power/USB/etc.]	[V]	[Rate]	[MPN]	[Yes/No]	[ESD/surge/etc.]

5.2 Connector Pinout

Table

Connector	Pin	Signal / Net	Direction	Voltage / Logic Standard	Max Current	Mate-First / Last	Notes
J1	1	[Net]	[In/Out/Bidir]	[Standard]	[A]	[If applicable]	[Notes]

5.3 Signal Requirements

Table

Net / Bus	Source	Destination(s)	Standard	Frequency / Edge Rate	Impedance	Length / Skew Limit	Layer / Via Limit	Termination
[USB_DP/DM]	[Source]	[Destination]	[USB 2.0]	[Rate]	[90 Ω diff]	[Limits]	[Limits]	[Type]

5.4 Analog Requirements

Table

Signal	Range	Bandwidth	Source Impedance	Required Accuracy / Noise	ADC/DAC Reference	Routing / Guarding Notes
[Signal]	[Range]	[Hz]	[Ω]	[Requirement]	[Reference]	[Notes]

5.5 Clocks and Timing

Table

Clock	Source	Consumers	Frequency	Accuracy / Jitter	Routing Constraint	Datasheet Source
[Clock]	[Source]	[Loads]	[Hz]	[ppm/ps]	[Constraint]	[PDF/page]

6. Power Architecture and Power Budget

6.1 Power Sources

Table

Source	Connector / Component	Min Voltage	Nominal	Max Voltage	Continuous Current	Peak Current / Duration	Reverse Polarity?	Transient / Surge
[Source]	[J/U]	[V]	[V]	[V]	[A]	[A/ms]	[Yes/No]	[Requirement]

6.2 Power Rails

Table

Rail	Source / Regulator	Voltage Min/Nom/Max	Load Typical	Load Peak	Ripple Limit	Startup Order	Power-Good Use	Shutdown / Discharge
+3V3	[U#]	[V/V/V]	[A]	[A]	[mVpp]	[Order]	[Use]	[Method]

6.3 Load Budget

Table

Load RefDes / Block	Rail	Mode	Typical Current	Maximum Current	Duty Cycle	Source / Evidence
[U1]	+3V3	Normal	[A]	[A]	[%]	[Datasheet/test]

6.4 Protection and Grounding

Table

Location / Net	Hazard	Protection	Rating	Placement Requirement	Return Path / Ground Domain
Power input	[Reverse/surge]	[Fuse/TVS/MOSFET]	[Rating]	[Constraint]	[Return]

Describe ground strategy, chassis connection, shield termination, analog/digital partitioning, and any intentional net ties: [Description].

7. Approved Bill of Materials

Supply a separate BOM.csv using these exact columns:

CSV Data
RefDes Qty Manufacturer MPN Description Value Package Mounting Datasheet_File Datasheet_URL Lifecycle_Status Temperature_Grade Voltage_Rating Current_Rating Tolerance Approved_Alternate_MPN Substitution_Policy Supplier_SKU Assembly_Notes Critical_Part Notes

BOM Rules

RefDes may contain a comma-separated set only for truly identical fitted components.
MPN must be the manufacturer part number; distributor SKUs are supplemental.
Mark each part No substitutions, Approved alternates only, or Equivalent allowed.
Include DNI/DNP items and clearly identify their assembly state.
Identify safety, RF, precision, thermal, connector, crystal, and power-path parts as critical.

BOM Review Table

Table

RefDes	MPN Verified	Symbol Verified	Pinout Verified	Footprint Verified	3D / Height Verified	Lifecycle Verified	Reviewer
[U1]	[ ]	[ ]	[ ]	[ ]	[ ]	[ ]	[Name]

8. Pin-Level Connectivity and Net Definition

Supply a separate CONNECTIVITY.csv using these exact columns:

CSV Data
Net_Name Endpoint_1 Endpoint_2 Additional_Endpoints Net_Class Voltage_Min Voltage_Nominal Voltage_Max Typical_Current Maximum_Current Direction Source_Block Destination_Block Criticality Pull_or_Termination Test_Point Routing_Notes Verification_Source

Endpoint syntax must be RefDes.PinNumber, for example U1.14. Use manufacturer pin numbers, not only pin names.

Connectivity Rules

Every physical connector pin must appear.
Every IC power and ground pin must appear.
Each decoupling capacitor must identify the specific pin/rail it supports.
Define unused pins as NC, reserved, tied high/low, or test-only according to the datasheet.
Explicitly identify net ties, chassis ground, shields, Kelvin sense connections, and analog references.
Include programming, debug, test, manufacturing, and fixture nets.
Preserve polarity suffixes consistently: _P/_N or +/-.

Net Class Table

Table

Net Class	Included Nets	Width Rule	Clearance Rule	Via Rule	Layer Rule	Impedance / Pairing	Notes
POWER_HIGH	[Nets]	[mm]	[mm]	[Via size/count]	[Layers]	N/A	[Notes]
SIGNAL_STD	[Nets]	[mm]	[mm]	[Rule]	[Layers]	[If any]
DIFF_[NAME]	[Pair]	[Derived]	[Derived]	[Rule]	[Layers]	[Ω]

Unused Pin Table

Table

RefDes	Pin	Pin Name	Required Treatment	Datasheet Page / Section	Implemented Net
[U1]	[#]	[Name]	[NC/tie/pull]	[Citation]	[Net]

9. Component Datasheet Constraint Register

Attach the exact PDF revision for every critical component. Use this table to make layout-critical requirements explicit.

Table

RefDes	MPN	Datasheet File / Rev	Constraint Type	Exact Requirement	Page / Figure / Section	Mandatory?	Implementation / Verification
U1	[MPN]	[PDF]	Decoupling	[Requirement]	[Page]	MUST	[Method]
U1	[MPN]	[PDF]	Thermal vias	[Pattern]	[Page]	MUST	[Method]
J1	[MPN]	[PDF]	Edge placement	[Dimension]	[Page]	MUST	[Method]

Capture at least:

Recommended land pattern and solder-mask/paste guidance.
Exposed-pad connection and thermal-via pattern.
Decoupling values, pin association, and maximum placement distance.
Switching-current loop, switch-node, bootstrap, feedback, and compensation placement.
Crystal/resonator placement and guard/return guidance.
Antenna, RF, magnetics, and isolation keepouts.
Thermal, airflow, heatsink, and copper-area requirements.
Connector board-edge datum, mating envelope, and insertion/removal access.
Creepage, clearance, isolation slot, and high-voltage restrictions.

10. Mechanical Definition

10.1 Coordinate System

Table

Item	Definition
Units	Millimeters
Origin	[Example: lower-left board-outline corner]
X direction	[Definition]
Y direction	[Definition]
Z direction	[Definition]
Viewed side	[Top / bottom]
Rotation convention	[Clockwise/counterclockwise]
Datum hierarchy	[Primary/secondary/tertiary]

10.2 Board Geometry

Table

Requirement	Value / File	Tolerance	Mandatory?	Notes
Board outline	`board-outline.dxf`	[mm]	MUST	[Notes]
Finished thickness	[mm]	[mm]	MUST
Maximum dimensions	[X × Y mm]	[mm]	MUST
Corner radius / chamfer	[Value]	[mm]	[ ]
Edge plating / castellations	[Requirement]	[mm]	[ ]

10.3 Holes, Slots, and Cutouts

Table

ID	Type	X	Y	Finished Size	Plated?	Tolerance	Copper Keepout	Component Keepout	Purpose
H1	[Hole/slot]	[mm]	[mm]	[mm]	[Yes/No]	[mm]	[mm]	[mm]	[Purpose]

10.4 Enclosure and Mating Geometry

Table

Item	Mating Part / File	Location Datum	Required Clearance	Insertion / Service Envelope	Notes
[Connector]	[MPN/STEP]	[Datum]	[mm]	[Envelope]	[Notes]

11. Placement Requirements

Supply PLACEMENT_CONSTRAINTS.csv using these exact columns:

CSV Data
Constraint_ID RefDes_or_Group Constraint_Type Target_or_Datum X_mm Y_mm Rotation_deg Side Tolerance_mm Maximum_Distance_mm Minimum_Distance_mm Maximum_Height_mm Priority Reason Source Verification_Method

Allowed Constraint_Type examples: Fixed, Board edge, Near, Away from, Aligned, Grouped, Ordered, Same side, Height limit, Thermal, Symmetry, Test access.

Placement Table

Table

ID	RefDes / Group	Constraint	Target / Datum	Limit / Tolerance	Priority	Engineering Reason	Source
PLC-001	J1	Fixed position and rotation	Board datum	[±mm/deg]	MUST	Enclosure mating	Drawing
PLC-002	C1, C2	Near associated U1 pins	U1.[pins]	[max mm]	MUST	High-frequency bypass	Datasheet

Placement Order

Board-edge and mechanically fixed components.
Mounting holes, cutouts, and mating components.
Antennas, isolation barriers, and mandatory keepouts.
Power converters and critical current loops.
Clocks, high-speed interfaces, and sensitive analog circuits.
Controllers and functional groups.
Decoupling, pull components, test points, and remaining passives.

Component Height Zones

Table

Zone	Polygon / Drawing Reference	Side	Maximum Height	Measurement Datum	Notes
HZ-1	[Reference]	Top	[mm]	PCB top surface	[Notes]

12. Keepout and Restricted-Area Register

Supply KEEPOUTS.csv using these exact columns:

CSV Data
Keepout_ID Name Source_RefDes Geometry_File_or_Definition Datum Side_or_Layers Prohibits_Components Prohibits_Copper Prohibits_Traces Prohibits_Vias Prohibits_Pours Height_Limit_mm Clearance_mm Priority Reason Source_Citation Verification_Method

Table

ID	Region	Geometry / Datum	Layers	Components	Copper / Pours	Traces	Vias	Clearance / Height	Source
KO-001	Antenna	[Drawing]	All	No	No	No	No	[mm]	Datasheet page [ ]
KO-002	Mounting hole	H1 center	All	No	No	No	No	[mm radial]	Mechanical drawing
KO-003	Switch node	U1/L1 region	[Layers]	[Rule]	[Rule]	Restricted	No	[mm]	Regulator datasheet

For each region, distinguish among:

Component-body keepout.
Courtyard / assembly-tool access.
Copper-pour keepout.
Trace keepout.
Via keepout.
Solder-mask or paste restriction.
Height restriction.
RF/antenna keepout.
High-voltage isolation barrier.
Enclosure or fastener sweep envelope.

13. PCB Stackup and Fabrication Capabilities

13.1 Four-Layer Stackup

Do not finalize controlled-impedance widths until the intended fabricator confirms dielectric thickness and material properties.

Table

Layer	Fabricator Layer Name	Type	Copper Weight / Thickness	Dielectric to Next Layer	Material / Dk	Primary Use
L1	Top	Signal	[oz/µm]	[mm]	[Material/Dk]	Components / signals
L2	Inner 1	Plane	[oz/µm]	[mm]	[Material/Dk]	Continuous ground
L3	Inner 2	Plane/signal	[oz/µm]	[mm]	[Material/Dk]	Power / slow signals
L4	Bottom	Signal	[oz/µm]	—	—	Signals / components

13.2 Fabricator Capability Table

Table

Parameter	Preferred	Allowed Maximum / Minimum	Fabricator Confirmed?	Source
Minimum trace width	[mm]	[mm]	[Yes/No]	[Capability page]
Minimum spacing	[mm]	[mm]	[Yes/No]
Minimum drill	[mm]	[mm]	[Yes/No]
Minimum annular ring	[mm]	[mm]	[Yes/No]
Copper-to-edge	[mm]	[mm]	[Yes/No]
Solder-mask dam	[mm]	[mm]	[Yes/No]
Board thickness tolerance	[mm]	[mm]	[Yes/No]

13.3 Surface Finish and Construction

Table

Item	Requirement
Base material	[FR-4 grade/Tg]
Surface finish	[ENIG/HASL/etc.]
Solder mask	[Color/type]
Silkscreen	[Color/sides]
Copper weight	[Outer/inner]
Via fill / cap	[Requirement]
Controlled impedance coupon	[Yes/No]
Panelization	[Fab/assembler/user]

14. Routing, Width, Clearance, and Via Rules

14.1 Trace and Clearance Rules

Table

Rule ID	Net / Net Class	Width	Clearance	Layer(s)	Maximum Length	Maximum Vias	Return-Path Requirement	Calculation / Source
RT-001	[Class]	[mm]	[mm]	[Layers]	[mm]	[#]	[Requirement]	[IPC/current/impedance]

14.2 Differential Pair Rules

Table

Pair	P Net	N Net	Differential Impedance	Single-Ended Impedance	Width	Gap	Intra-Pair Skew	Max Length	Via Symmetry	Reference Plane
[Pair]	[Net]	[Net]	[Ω]	[Ω]	[Fab-derived]	[Fab-derived]	[mm/ps]	[mm]	[Rule]	[Plane]

14.3 Power Trace / Plane Sizing

Table

Rail	Maximum Current	Allowed Temperature Rise	Copper Thickness	External/Internal	Minimum Width / Area	Via Count	Calculation Method
[Rail]	[A]	[°C]	[µm]	[Location]	[mm/mm²]	[#]	[IPC-2152/analysis]

14.4 Via Definitions

Table

Via Type	Drill	Finished Hole	Pad Diameter	Annular Ring	Layers	Fill / Cap	Allowed Uses	Prohibited Uses
Signal through-via	[mm]	[mm]	[mm]	[mm]	L1-L4	[None]	[Use]	[Restriction]
Thermal via	[mm]	[mm]	[mm]	[mm]	[Layers]	[Tent/fill]	[Use]	[Restriction]

14.5 Critical Routing Topologies

Table

Circuit / Net	Required Topology	Placement Dependency	Forbidden Geometry	Return Path	Verification
Regulator feedback	Kelvin sense from output	[Constraint]	Near switch node	Quiet ground	Layout review
Crystal	Short, symmetric	[Constraint]	Vias/stubs	Local ground	Layout review

15. Footprint and Land-Pattern Requirements

Table

RefDes	Package	Authoritative Drawing	Land Pattern Source	Density Level	Thermal Pad	Paste Reduction	Courtyard	Pin-1 Verification	Deviations
[U1]	[Package]	[PDF/page]	[Manufacturer/IPC]	[A/B/C]	[Details]	[%/window]	[mm]	[Method]	[None/list]

Footprint acceptance requires verification of:

Pin count, numbering, orientation, and pin-1 marking.
Pad dimensions and pitch.
Exposed-pad dimensions and connectivity.
Solder-mask expansion and paste apertures.
Courtyard and component-body dimensions.
Board-edge relation, locating pegs, shield tabs, and mounting posts.
3D body size, seating plane, height, and mating envelope.

16. Thermal Design

Table

Component / Region	Dissipation Typical	Dissipation Worst Case	Junction Limit	Ambient	Allowed Rise	Thermal Path	Copper / Via Requirement	Verification Method
[U1]	[W]	[W]	[°C]	[°C]	[°C]	[Path]	[Requirement]	[Analysis/test]

Include airflow direction, enclosure thermal constraints, heat-source separation, heatsinks, thermal interface materials, and temperature-sensor placement: [Details].

17. Test, Programming, and Manufacturing Access

17.1 Test Points

Table

Test Point	Net	Purpose	Side	Minimum Pad / Probe Type	Required Clearance	Fixture Coordinates Required?
TP1	[Net]	[Purpose]	[Top/bottom]	[Size/type]	[mm]	[Yes/No]

17.2 Programming / Debug

Table

Interface	Connector / Pads	Pinout	Voltage	Access Method	Boot-Strap Requirements	Production Use
[SWD/JTAG/etc.]	[RefDes]	[Reference]	[V]	[Cable/pogo]	[Details]	[Method]

17.3 Assembly Constraints

Table

Constraint	Requirement	Source / Reason
Component side	[Top only / both]	[Reason]
Hand soldering	[Components]	[Access]
Rework access	[Requirement]	[Reason]
Fiducials	[Global/local requirements]	[Assembler]
Tooling holes	[Requirement]	[Assembler]
Panel rails	[Requirement]	[Assembler]

18. Silkscreen, Marking, and Traceability

Table

Marking	Required Text / Format	Layer	Minimum Size	Location Constraint
Board name	[Text]	Top silk	[mm]	[Location]
Hardware revision	[Format]	[Layer]	[mm]	[Location]
Serial / lot code	[Format]	[Layer]	[mm]	[Location]
Connector labels	[Labels]	[Layer]	[mm]	Adjacent and visible
Pin 1 / polarity	[Requirement]	[Layer]	[mm]	Unambiguous

State logo, certification, date-code, barcode/QR, and company-mark requirements: [Details].

19. Schematic Capture Requirements

The schematic must:

Be organized by functional block and left-to-right signal/power flow.
Use consistent, meaningful net names matching this package.
Show connector pin numbers and external signal direction.
Show all power pins, grounds, hidden pins, and unused-pin treatment.
Place bypass parts near the IC section they support and label their role.
Annotate critical values, tolerances, ratings, MPNs, and package information.
Show net ties, shields, chassis ground, analog ground, and isolation boundaries explicitly.
Include programming, test, and manufacturing interfaces.
Include design notes for layout-critical circuits.
Pass electrical-rule review with every exception documented.

Schematic Review Checklist

Table

Check	Pass / Fail	Reviewer
Every BOM part represented	[ ]	[Name]
Connectivity matches source table	[ ]	[Name]
Pin numbers verified against PDFs	[ ]	[Name]
Power and ground pins complete	[ ]	[Name]
Unused pins treated correctly	[ ]	[Name]
Decoupling and support circuits complete	[ ]	[Name]
Net names and polarities consistent	[ ]	[Name]
ERC errors resolved or waived	[ ]	[Name]

20. PCB Verification and Release Criteria

20.1 Layout Review Checklist

Table

Check	Pass / Fail	Evidence / Report	Reviewer
Board outline and holes match authoritative geometry	[ ]	[File]	[Name]
All fixed components match datums	[ ]	[Report]	[Name]
Component bodies/courtyards do not overlap	[ ]	[DRC]	[Name]
Height zones and enclosure fit pass	[ ]	[3D review]	[Name]
All keepouts are implemented	[ ]	[Rule review]	[Name]
Critical loops and return paths reviewed	[ ]	[Review]	[Name]
Controlled-impedance geometry matches fab stackup	[ ]	[Fab data]	[Name]
Differential-pair skew and continuity pass	[ ]	[Report]	[Name]
Power paths meet current/thermal requirements	[ ]	[Calculation]	[Name]
Antenna/RF/isolation requirements pass	[ ]	[Review]	[Name]
Test/programming access verified	[ ]	[Review]	[Name]
No unintended unrouted connections	[ ]	[Report]	[Name]
DRC passes; waivers documented	[ ]	[DRC]	[Name]

20.2 DRC / ERC Waiver Register

Table

Waiver ID	Violation	Location	Reason Accepted	Risk	Approved By	Date
WVR-001	[Violation]	[Location]	[Reason]	[Risk]	[Name]	[Date]

20.3 Release Deliverables

Table

Deliverable	Required Format	Naming Convention	Generated?	Reviewed?
Fabrication layers	Gerber X2 or fab-required	[Convention]	[ ]	[ ]
Drill files	Excellon	[Convention]	[ ]	[ ]
Drill map	PDF/Gerber	[Convention]	[ ]	[ ]
Board drawing / fab notes	PDF	[Convention]	[ ]	[ ]
Assembly drawing	PDF	[Convention]	[ ]	[ ]
BOM	CSV/XLSX	[Convention]	[ ]	[ ]
Pick-and-place	CSV	[Convention]	[ ]	[ ]
Schematic	PDF/native	[Convention]	[ ]	[ ]
PCB source	Native	[Convention]	[ ]	[ ]
3D board model	STEP	[Convention]	[ ]	[ ]
Readme / release notes	TXT/MD/PDF	[Convention]	[ ]	[ ]

20.4 Manufacturing Release Approval

Table

Role	Name	Approval	Date
Electrical design	[Name]	[ ]	[Date]
PCB layout	[Name]	[ ]	[Date]
Mechanical	[Name]	[ ]	[Date]
Manufacturing	[Name]	[ ]	[Date]
Product owner	[Name]	[ ]	[Date]

21. Assumptions, Risks, and Deviations

21.1 Assumptions

Table

ID	Assumption	Design Impact	Owner	Resolution Required By	Status
ASM-001	[Assumption]	[Impact]	[Owner]	[Milestone]	Open

21.2 Risk Register

Table

Risk ID	Risk	Cause	Probability	Severity	Mitigation	Verification	Owner	Status
RSK-001	[Risk]	[Cause]	[L/M/H]	[L/M/H]	[Action]	[Test/review]	[Owner]	Open

21.3 Approved Deviations

Table

Deviation ID	Requirement	Deviation	Technical Justification	Approval	Date
DEV-001	[Requirement]	[Deviation]	[Reason]	[Name]	[Date]

22. Appendix A — Recommended Folder Structure

Text
/PCB-Handoff
  PCB_DESIGN_SPEC.md
  BOM.csv
  CONNECTIVITY.csv
  PLACEMENT_CONSTRAINTS.csv
  KEEPOUTS.csv
  /datasheets
    manufacturer-part-number_rev.pdf
  /mechanical
    board-outline.dxf
    enclosure.step
    connector-and-mating-drawings.pdf
  /stackup
    fabricator-stackup.pdf
    impedance-table.pdf
  /references
    theory-of-operation.pdf
    block-diagram.pdf
    breadboard-photos/
    prototype-test-results/
    firmware-pin-map.csv
  /release
    [generated manufacturing outputs]

23. Appendix B — Final Intake Checklist

Before schematic work begins, confirm:

Schematic and PCB Handoff Package Template
Document Control
Revision History
Requirement Language
1. Package Manifest
2. Product Overview and Theory of Operation
2.1 Purpose
2.2 Theory of Operation
2.3 Functional Block Diagram
2.4 Operating Modes
2.5 Breadboard / Prototype Evidence
3. Scope, Constraints, and Acceptance
3.1 Included Scope
3.2 Excluded Scope
3.3 Product-Level Requirements
3.4 Open Decisions
4. Environmental, Reliability, and Regulatory Requirements
Applicable Standards
Materials and Compliance
5. Electrical Interfaces and Performance
5.1 External Interfaces
5.2 Connector Pinout
5.3 Signal Requirements
5.4 Analog Requirements
5.5 Clocks and Timing
6. Power Architecture and Power Budget
6.1 Power Sources
6.2 Power Rails
6.3 Load Budget
6.4 Protection and Grounding
7. Approved Bill of Materials
BOM Rules
BOM Review Table
8. Pin-Level Connectivity and Net Definition
Connectivity Rules
Net Class Table
Unused Pin Table
9. Component Datasheet Constraint Register
10. Mechanical Definition
10.1 Coordinate System
10.2 Board Geometry
10.3 Holes, Slots, and Cutouts
10.4 Enclosure and Mating Geometry
11. Placement Requirements
Placement Table
Placement Order
Component Height Zones
12. Keepout and Restricted-Area Register
13. PCB Stackup and Fabrication Capabilities
13.1 Four-Layer Stackup
13.2 Fabricator Capability Table
13.3 Surface Finish and Construction
14. Routing, Width, Clearance, and Via Rules
14.1 Trace and Clearance Rules
14.2 Differential Pair Rules
14.3 Power Trace / Plane Sizing
14.4 Via Definitions
14.5 Critical Routing Topologies
15. Footprint and Land-Pattern Requirements
16. Thermal Design
17. Test, Programming, and Manufacturing Access
17.1 Test Points
17.2 Programming / Debug
17.3 Assembly Constraints
18. Silkscreen, Marking, and Traceability
19. Schematic Capture Requirements
Schematic Review Checklist
20. PCB Verification and Release Criteria
20.1 Layout Review Checklist
20.2 DRC / ERC Waiver Register
20.3 Release Deliverables
20.4 Manufacturing Release Approval
21. Assumptions, Risks, and Deviations
21.1 Assumptions
21.2 Risk Register
21.3 Approved Deviations
22. Appendix A — Recommended Folder Structure
23. Appendix B — Final Intake Checklist