The exact selected footprints occupy 1093 mm² on a 1350 mm² board—81% top-side fill. The placement engine determined that the design requires either:
At least 49 × 33 mm, or
Bottom-side passive placement.
The latter conflicts with preserving the bottom as an uninterrupted GND plane. Per the requirement to report before resizing, I did not enlarge the board.
Uncompleted because of blocker
Final component placement and mounting holes
Bottom GND zone and via fence
RF/VTUNE routing and zero-airwire closure
Final ERC/DRC remediation
Gerber, BOM, pick-and-place, and schematic PDF exports
Current DRC consequently reports 41 airwires; no warning or error was waived or suppressed.Completed the datasheet-backed schematic, exact Crystek VCO footprint, 45 × 30 mm two-layer setup, transfer-function verification, Design Verification and Assumptions, and Board Bring-Up Plan.
Layout and exports remain blocked: the footprints consume 81% of the board and require at least 49 × 33 mm to retain a continuous bottom ground plane; the account also has no available ACUs for further execution. No violations were waived—41 expected airwires remain until placement/routing; approve the 49 × 33 mm resize after restoring ACUs to continue.
I can’t analyze or run auto-layout because the account currently has no available ACUs, so AI project operations are unavailable.
Current known state indicates both placement and routing are needed: final placement is incomplete and approximately 41 airwires remain. The 45 × 30 mm outline is also likely too constrained; prior analysis recommended resizing to at least 49 × 33 mm while keeping the bottom ground plane continuous. Once ACUs are available, the next operation should resize/confirm the outline, run placement, route, and finish with DRC verification.
Manufacturer datasheet pinout and recommended land pattern required.
+5 V VCC with 100 nF and 10 uF bypass; 100 nF immediately at VCC.
RF OUT directly to edge-mount SMA, no attenuation/amplification.
Interfaces and Connections
SERVO_IN: PCB-mount BNC, high impedance.
RF OUT: Edge-mount 50-ohm SMA.
Power header: +12 V, +5 V, GND, with silkscreen labels.
Test: VTUNE test point.
Power and Runtime Expectations
Externally supplied regulated +12 V and +5 V.
No onboard DC/DC conversion.
Source-current requirements will be documented from exact active-part datasheets and clamp bias calculations.
Power Tree and Power Budget
Diagram
Final typical/maximum current estimates will use manufacturer datasheets.
The 10 V Zener branch nominal current is approximately (12 V - 10 V) / 1 kohm = 2 mA before clamp loading.
Manufacturing and Assembly Expectations
Two copper layers.
Approximately 45 mm x 30 mm.
Components on top where practical; bottom maintained as a continuous GND plane.
0805 resistors and capacitors where practical.
Exact VCO footprint must be datasheet-backed and must not be substituted.
Editable schematic, routed PCB, BOM with MPNs, Gerber/drill, pick-and-place, and schematic PDF required.
Firmware-Relevant Hardware Requirements
None; no programmable device.
Physical Design Expectations
Left-to-right order: BNC -> op amp -> VCO -> SMA.
BNC and SMA at board edges.
Four corner mounting holes.
Short VTUNE route, separated from RF OUT and never parallel/beneath it.
Short 50-ohm top microstrip over continuous bottom GND.
Ground-via fence around VCO and SMA region.
Important Design Decisions
No 50-ohm input termination.
No RF output attenuator or amplifier.
Single-supply OPA197 implementation.
Dedicated 10 V Zener clamp rail.
Continuous bottom GND plane prioritized over bottom-layer signal routing.
Assumptions
External +12 V and +5 V rails are regulated and share GND.
Standard FR-4 fabrication is intended unless the selected fabricator stackup requires an RF trace-width adjustment.
Exact connector MPNs may be selected based on library availability while preserving PCB-mount BNC and edge-mount 50-ohm SMA requirements.
Mounting-hole diameter and edge inset may use standard prototype defaults unless constrained by a supplied enclosure.
Every final assumption, selected connector, stackup-dependent RF geometry, and unresolved ERC/DRC warning will be recorded in a separate assumptions/report file.
Change Notes
Initial specification created from the supplied design brief.