The current two-layer layout uses entirely through‐hole parts (for example, the JST connectors, mounting holes, and most passive components). In a standard two-layer through‐hole design, both the top and bottom sides are accessible for soldering. In other words, if the solder mask is configured properly and the PCB manufacturing process supports it, back soldering is generally feasible.
Before sending the board for production, please verify the following with your PCB manufacturer and assembly process:
Solder Mask and Paste Stencil:
Ensure that solder mask openings are designed so that pads are accessible from the backside. The stencil and solder paste application must be optimized for soldering parts from the back when needed.
Board Thickness and Footprint Support:
Confirm that pad geometries and via designs (if any) allow for thermal relief and proper solder reflow on the board’s reverse side.
Component Orientation and Accessibility:
Check that none of the component leads or overhanging elements obstruct access for soldering on the bottom side.
If these conditions are met according to your manufacturer’s fabrication guidelines, the current layout should support back soldering.
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant
A momentary or non-latching switch which causes a temporary change in the state of an electrical circuit only while the switch is physically actuated. SWITCH TACTILE SPST-NO 0.05A 24V