MP2667 Guide


I’ll research the manufacturer’s datasheet and sourcing information, then create an application guide covering wiring, layout, pitfalls, and verified alternatives.
I verified the core wiring and ratings, including the distinction between the 1 A charging limit and 1.6 A system current. I’m finishing the sourcing and alternatives sections; package pitch and some alternative-part datasheet details remain unverified and will be flagged.
Created a project doc

MP2667 Application and Usage Guide

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MP2667 Application and Usage Guide
The Monolithic Power Systems MP2667 is a single-cell Li-ion/Li-polymer linear battery charger with I²C-programmable charging parameters and system power-path management. Its common use is a compact USB-powered portable device that must operate while charging its battery; the recommended operating limits are 1 A charging current and 1.6 A system current, which are not interchangeable ratings.
1. Quick Specifications
Absolute maximum ratings are stress limits. Normal operation is not guaranteed outside the recommended operating conditions.
2. Pinout & Connections
Created the MP2667 Application and Usage Guide with all seven requested sections, technical citations, wiring guidance, and sourcing details. No cross-manufacturer drop-in replacement was verified; the guide labels functional alternatives and flags unresolved package and interface specifications for verification before production use.

MP2667 Application and Usage Guide
The Monolithic Power Systems MP2667 is a single-cell Li-ion/Li-polymer linear battery charger with I²C-programmable charging parameters and system power-path management. Its common use is a compact USB-powered portable device that must operate while charging its battery; the recommended operating limits are 1 A charging current and 1.6 A system current, which are not interchangeable ratings.
1. Quick Specifications

Table


ParameterRating classValuePractical interpretation
Input supply, INRecommended operating4.35–5.5 VIntended for a nominal 5 V USB supply.
IN relative to GNDAbsolute maximum−0.3 to +13 VStress rating, not a permitted continuous charging input.
All other pins relative to GNDAbsolute maximum−0.3 to +6.0 VDoes not establish valid logic levels or functional operating conditions.
Input current, IINRecommended operating maximum1 ABudget the system and charger against the source together.
Battery charge current, ICHGRecommended operating maximum1 AActual sustained current depends on input budget and thermal conditions.
System current, ISYSRecommended operating maximum1.6 ANot a 1.6 A battery-charge rating.
Battery voltage, VBATTRecommended operating upper limit4.545 VSelect the charge voltage for the actual cell; this upper limit is not a universal Li-ion setpoint.
Junction temperature, TJRecommended operating−40 to +125°CJunction temperature, not ambient temperature.
Junction temperatureAbsolute maximum150°CDo not use as the continuous design target.
Storage temperatureAbsolute maximum−65 to +150°CUnpowered storage rating.
Continuous power dissipationAbsolute maximum, TA = 25°C1.25 WBoard- and temperature-dependent; not a guaranteed dissipation allowance for any PCB.
PackageMechanicalQFN-10, 2 × 2 mmConfirm pin 1 and the manufacturer's land pattern.
Terminal pitchVerification incompleteNot independently verifiedCheck the dimensioned package drawing before authoring or approving a footprint; do not infer pitch from body size.
Thermal resistanceDatasheet characterizationθJA = 80°C/W; θJC = 16°C/WThese are reference test-condition values, not measurements of your PCB.
Absolute maximum ratings are stress limits. Normal operation is not guaranteed outside the recommended operating conditions.
2. Pinout & Connections
Pin numbering and functions below follow the manufacturer's pin-functions table.

Table


Pin NumberPin NameDescriptionBest Practice
1INInput powerConnect to the nominal 5 V input. Fit at least 1 µF to GND immediately beside the pin.
2NTCBattery-temperature sense inputUse a VDD-referenced resistor/thermistor network and a thermistor thermally coupled to the cell; do not casually ground or leave this input floating.
3INTOpen-drain interrupt outputConnect to an MCU interrupt input if required. Use an external pull-up greater than 100 kΩ to satisfy the pin-table guidance; select a host-compatible rail and verify logic thresholds. A specific INT pull-up voltage was not verified.
4VDDInternal control supplyFit 100 nF ceramic to GND close to the pin. Do not use VDD to supply an external system load; the documented NTC bias network is a specific supported connection.
5GNDGroundConnect to a low-impedance ground plane and short capacitor returns.
6SCLI²C clockConnect to the host clock and pull up to the logic rail through 10 kΩ as directed in the pin table. Check bus capacitance and rise time rather than assuming this value suits every bus.
7SDAI²C dataConnect to the host data line and pull up to the logic rail through 10 kΩ. Account for any existing parallel bus pull-ups.
8, 9BATTBattery terminalsConnect both pins to cell positive; fit at least 10 µF ceramic from BATT to GND close to the IC.
10SYSSystem power outputConnect the application power input here, not to BATT. Fit at least 2.2 µF X5R/X7R ceramic to GND using thick, short traces.
Exposed paddle: The package drawing includes an exposed paddle, but its electrical assignment and dimensions were not independently established in this research. Do not assign it an invented pin number or net; verify the manufacturer's package/assembly information before releasing the footprint.
3. Standard Application Circuit
USB-powered single-cell charger with a separate system rail
Connect the nominal 5 V source to IN, the battery positive terminal to both BATT pins, the battery negative terminal to GND, and the device's power input to SYS. Keeping the load on SYS preserves the intended separation between load current and battery-charge current; confirm that every downstream regulator can tolerate both input-powered and battery-powered SYS conditions.
Use the following local ceramic capacitors:

Table


ConnectionMinimum / reference valuePlacement and selection
IN–GND1 µF minimumPut beside IN with a short ground return.
SYS–GND2.2 µF minimum, X5R/X7RSmall loop area and thick traces.
BATT–GND10 µF minimum, X5R/X7RPut beside the battery pins, even when the cell is attached.
VDD–GND100 nFLocal internal-supply bypass only.
The datasheet reference BOM specifies 16 V, 0603, X5R/X7R ceramic capacitors for these four values. Check the selected manufacturer's capacitance-versus-DC-bias data so the installed parts retain the required effective capacitance.
Battery-temperature monitoring
Use the VDD-to-NTC-to-GND sensing divider and connect the battery thermistor from NTC to GND. The reference circuit lists RT1 and RT2 as 10 kΩ, 1% resistors; verify the exact network against the battery thermistor's resistance curve and the manufacturer's temperature-window equations before copying those values into a production design.
NTC monitoring can be disabled by clearing EN_NTC, bit 3 of register 0x06. That is a configuration capability, not a recommendation to remove battery-temperature protection.
Host integration and charging configuration
  • The I²C slave address is 0x09; distinguish the slave address from the internal register addresses.
  • Fit the SDA/SCL pull-ups and, if used, the high-value INT pull-up described above. Confirm the host logic rail against the IC's electrical characteristics; the retrieved SDA/SCL characterization includes a 1.8 V pull-up condition, but that condition alone does not establish the entire allowable logic-supply range.
  • At startup, read back and deliberately configure input current limit, charge current, battery regulation voltage, temperature monitoring, timer policy, and battery UVLO to match the cell and source. Do not assume the part powers up at maximum charging current.
  • The documented default configuration includes a 470 mA input-current-limit setting, 4.2 V battery-regulation setting, and disabled I²C watchdog. The input-current-limit setting is a register selection, not an exact guaranteed measured current. Custom ordering configuration codes can change the default register settings.
This is a charger IC, not a USB connector or USB-PD controller. No differential data pair, CC-pin wiring, shielding network, or indicator LED resistor is required by the IC itself; design those separately only if the application includes the corresponding connector or indicator. Do not interpret a distributor's “USB interface” tag as evidence of USB data enumeration or permission to draw unrestricted current.
4. PCB Layout & Routing Guidelines
  • Place all four local capacitors beside their pins. Minimize input inductance and ground impedance; especially keep the VDD bypass loop short.
  • Make IN, SYS, BATT, and power-ground paths short and wide. Size copper and vias for the applicable 1 A input/charge and 1.6 A system limits, allowable voltage drop, copper thickness, and temperature rise. No universal trace width is verified; avoid long narrow necks between BATT pins and the battery connector.
  • Provide heat-spreading copper and validate the thermal path. A linear charger dissipates voltage-drop power; use solid power/ground connections where thermal spreading is required rather than restrictive thermal-relief spokes. Verify the exposed-paddle assignment before connecting it or adding thermal vias. Thermal regulation reduces charging current when junction temperature reaches its selected limit.
  • Keep the I²C reference ground clean. MPS recommends routing SDA and SCL in parallel. These remain separate single-ended signals: they are not a controlled-impedance differential pair and need no differential-pair matching.
  • Protect the temperature-sense measurement. Route NTC away from large current loops and place the sensing thermistor at the battery, not beside the hot charger package. Verify the final QFN land pattern, paste openings, and pin-1 orientation against the manufacturer's drawing.
The routing and thermal-spreading recommendations beyond the cited manufacturer instructions are engineering implementation guidance, not manufacturer-specified numeric design rules.
5. Common Pitfalls / Things to Watch Out For
  1. Confusing stress limits, charge-current limits, and thermal capability. The 13 V IN absolute maximum does not make this a 13 V operating charger, and 1.6 A system current does not mean 1.6 A battery charging. Even a legal 1 A charge setting can be reduced by thermal regulation; validate sustained charging at the lowest battery voltage and highest ambient temperature.
  2. Treating the control pins and defaults as generic. A common 10 kΩ pull-up is appropriate for the documented SDA/SCL connections, but not for INT, whose pin-table guidance calls for greater than 100 kΩ. Do not power external circuitry from VDD, copy an unverified thermistor network, or assume an ordering-code variant has the same startup registers.
No cross-manufacturer drop-in replacement was verified. The following are functionally similar alternatives for a redesign, not interchangeable BOM substitutions. Both require new schematic connections, footprint review, firmware, power budgeting, and charging validation; neither is an equivalent replacement for an application that requires 1 A charging.

Table


AlternativeVerified functional overlapCompatibility and trade-off
Texas Instruments BQ25120ALinear battery charger with power-path management; maximum charging current 300 mA. TI's product page also identifies I²C control and integrated regulators.Functionally similar only; not pin-compatible or footprint-compatible. Suitable for a lower-current wearable redesign. Exact package details were not independently validated in this datasheet lookup; consult TI's product information.
Analog Devices / Maxim MAX77650ADI's manufacturer product page confirms a configurable linear charger, Smart Power Selector power path, and I²C interface.Functionally similar only; not pin-compatible or footprint-compatible. A substantially different PMIC architecture with integrated SIMO supplies. Datasheet verification of its charge-current range and package bump count remains pending, so those numeric claims are intentionally omitted. Validate these before selection.
The Flux links above are library searches, not claims that specific purchasable library entries or drop-in models have been verified. Functional overlap for MAX77650 is supported by the manufacturer's product page; its detailed PDF verification remains unresolved.
7. Sourcing & Purchasing Guide

Table


AttributeDetails
Primary DistributorsA specific DigiKey MP2667GG-0000-P listing was verified. For direct supply, contact MPS and confirm its currently franchised channel. JLCPCB also lists assembly stock, but that is not proof of distributor authorization or loose-part availability. Mouser, Arrow, and LCSC loose-part availability were not verified.
Packaging OptionsDigiKey lists tape & reel, cut tape, and Digi-Reel for MP2667GG-0000-P. The MPS product page states that -P and -Z identify the same device with different reel sizes. Neither suffix inherently means loose cut tape.
Standard MOQDigiKey's cut-tape listing starts at 1 unit. JLCPCB's -P listing reports 500 units/full reel, while its -Z listing reports 5,000 units/full reel. These are channel-reported reel quantities; confirm the supplier's quote and factory pack quantity before committing. MOQ varies by channel and stock status.
Ordering CodeMP2667GG-xxxx identifies the QFN variant and a four-digit hexadecimal configuration code for register settings; the default identifier is 0000. The datasheet instructs customers to contact an MPS FAE to establish the configuration identifier, even for 0000.
Sourcing AdvicePrefer MPS or a confirmed franchised distributor with traceable lot/date codes. Avoid treating anonymous marketplace stock as authenticated. Match GG package, configuration code, and -P/-Z packaging suffix on the purchase order. Distributor parameter tables encountered during research mislabel 1.6 A as charging current; the manufacturer's recommended charging limit is 1 A.
Stock / Lead TimeStock, pricing, and lead times are dynamic. No dated stock quantity or guaranteed lead time is asserted here; confirm directly at ordering. JLCPCB states that purchased assembly components remain in its parts library and cannot be shipped separately.
Sources
  • Monolithic Power Systems, MP2667 datasheet, Rev. 1.0, May 8, 2019. Manufacturer datasheet document URL. The manufacturer's dynamic viewer could not be downloaded automatically; the technical citations in this guide resolve to a retrieved mirrored copy of the MPS-authored document, not to distributor specification tables.
  • MPS MP2667 product page, manufacturer ordering information. Used for -P/-Z suffix meaning; webpage revision not stated.
  • Texas Instruments BQ25120A, manufacturer product and datasheet landing page. Product page identifies the linked datasheet as Rev. A; its revision date was not independently verified. Datasheet evidence used for charging current and power-path operation.
  • Analog Devices MAX77650, manufacturer product and datasheet landing page. Product page lists the MAX77650/MAX77651 datasheet as Rev. 7, dated October 11, 2018. Detailed PDF evidence extraction remained pending; only explicitly attributed manufacturer product-page capabilities are used here.
  • DigiKey, MP2667GG-0000-P purchasing page. Used for offered packaging and one-unit cut-tape quantity; commercial terms require reconfirmation.
  • JLCPCB, MP2667GG-0000-P and MP2667GG-0000-Z assembly-part pages. Used only for channel-reported reel quantities and assembly purchasing restrictions.
Research date: October 6, 2026. Unresolved verification items: terminal pitch, exposed-paddle assignment/dimensions, exact supported pull-up voltage range and I²C timing limits, and detailed MAX77650 charge-current/package data. These are not claims of missing manufacturer documentation; they are limits of this research and must be resolved for a production design.
  • 1. Quick Specifications

  • 2. Pinout & Connections

  • 3. Standard Application Circuit

  • USB-powered single-cell charger with a separate system rail

  • Battery-temperature monitoring

  • Host integration and charging configuration

  • 4. PCB Layout & Routing Guidelines

  • 5. Common Pitfalls / Things to Watch Out For

  • 6. Popular Alternatives & Equivalents

  • 7. Sourcing & Purchasing Guide

  • Sources