Designing PeakNode 1 Specifications

Started implementing a plan

Create an updated brief to execute the PeakNode 1 PCB routing pass on a 90×60mm 4-layer board (Top Signal / L2 GND solid / L3 3V3 Power plane / Bottom Signal), preserving RF/GNSS keepouts and SMA placements, and then run DRC to flag airwires, copper overlaps, RF keepout violations, power width violations, and missing decoupling.

What has been done so far

- Confirmed board setup: 90mm × 60mm rectangle and 4-layer stackup with L2 as Ground Plane and L3 as Power Plane.

- Applied baseline global layout rules: min trace width 0.127mm (5 mil), preferred widths 0.127mm/0.508mm/1.016mm (5/20/40 mil), hole size 0.3mm, via options noted (0.3/0.6 and 0.2/0.4 for fanout), minimum corner radius 0.25mm.

- Neckdown polygon generation attempted; persistent 3V3 neckdown collisions for U1/IC1/U3 were remediated by skipping those neckdowns after multiple attempts.

- Placement refined to preserve the intended floorplan zones (GNSS top-left, LoRa+SMA top-right, LTE+SMA bottom-right, MCU center, power+USB bottom-left/bottom edge) while reducing overlaps and improving routing channels; all components are now within the board outline.

- Latest DRC status still shows unresolved errors: overlapping copper remains (pads 68ec3f7c and b229b54f) and 44 unrouted connections (airwires).

Implementation plan

1. Re-run DRC to get current, precise overlap and airwire locations (do not rely on cached results) and identify which components/nets correspond to pads 68ec3f7c and b229b54f.

2. Clear remaining overlapping-copper errors by re-routing or adjusting local copper around the specific offending pads/nets (do not change board size or move RF connectors). Re-validate overlapping copper until zero.

3. Route power nets first (VBUS, VBAT/battery+charge path, 3V3) using width rules: 40 mil for battery/charge path, 20 mil for power distribution; prioritize short/wide paths in the power section and adequate via stitching for thermal/current return.

4. Route RF-critical traces second:

- Route LoRa RF from SX1262 matching network to LoRa SMA with no vias, no 90° bends, and maintain the CPWG geometry target; keep copper pours cleared under/around the RF feed as required.

- Route LTE RF to LTE SMA similarly with no vias and smooth bends.

- Add GND stitching via fences around RF keep-out regions at ~5mm pitch.

5. Route MCU-to-radio/control buses third:

- Route SX1262 SPI (SCK/MOSI/MISO/NSS) and control lines (BUSY/DIO1/NRESET) and ensure SPI length matching within 2mm.

- Route USB D+/D- from MCU to modem/USB-C as applicable with tight coupling and minimal stubs.

6. Route remaining audio, UI, and low-speed nets last, maintaining audio/RF isolation; ensure the NAU8810 analog ground island connection strategy is preserved.

7. Re-run full DRC and flag (and fix if possible): unconnected nets/airwires, RF keep-out violations, power trace width violations, and any new copper overlaps.

8. Run a decoupling audit: verify each IC has 100nF + 10uF where required and that caps are placed within 0.5mm of the associated power pins on the same layer; list any missing/too-far decouplers for manual correction.

Task completed.

1:00

Thought for 6 sec — Retrieving skills information
Looking up PeakNode 1 PCB routing pass RF GNSS keepouts DRC d....
Created the updated routing execution brief for PeakNode 1 and saved it as PeakNode 1 PCB Routing Pass Brief. It captures the 90×60 mm 4-layer stackup, current DRC state, routing order, RF/GNSS/SMA preservation requirements, DRC checklist, and decoupling audit criteria.
After routing, re-run checks for airwires, copper overlaps, RF keepout infringement, power-width mismatches, and decoupling placement
I re-ran the checks: the board is not clean yet — current results show 32 airwire errors, 6 overlapping-copper errors, 1 floating-copper error, and 21 dangling-trace warnings. No specific RF-keepout or power-width violation was returned by the checked DRC set, and no decoupling error/warning was returned, but the 0.5 mm same-layer decoupling requirement still needs physical placement inspection; details are saved in Post-Routing DRC Checks.
Fix routing errors
Locate airwires
Check decoupling placement
Check power widths
Document fixes
IC4
MK2
End of Life
J5
R23
Resistance
33 Ω
R16
Resistance
10kΩ
R3
Resistance
10kΩ
R15
Resistance
10kΩ
R1
Resistance
5.1kΩ
R22
Resistance
33 Ω
R25
Resistance
33 Ω
R19
Resistance
10kΩ
R12
Resistance
1kΩ
R26
Resistance
33 Ω
R9
Resistance
1kΩ
R2
Resistance
5.1kΩ
R20
Resistance
10kΩ
R27
Resistance
5.1kΩ
R28
Resistance
5.1kΩ
R6
Resistance
10kΩ
R14
Resistance
1kΩ
R7
Resistance
10kΩ
R8
Resistance
10kΩ
R24
Resistance
33 Ω
R13
Resistance
1kΩ
R11
Resistance
1kΩ
R4
Resistance
10kΩ
R10
Resistance
1kΩ
R21
Resistance
33 Ω
R18
Resistance
10kΩ
R5
Resistance
10kΩ
R17
Resistance
10kΩ
IC3 ISO_Sx - U4 VIN
U4 VOUT - C1 P1
J1 VBUS__1 - IC3 VINx
IC3 VINx - R1 P1
IC1 PA13 - J4 2
IC3 ISO_Sx - U4 VIN
IC1 PA5 - U2 SCK
IC1 PA7 - U2 MOSI
U4 VOUT - C1 P1
U4 L2 - L3 P1
IC1 PA9 - U1 RXD
U4 VOUT - C1 P1
U4 VOUT - C1 P1
U4 VOUT - C1 P1
IC1 PB3 - J4 6
U3 VDDD - U3 VDDSPK
U1 V_IO - U3 VDDA
U4 VOUT - C1 P1
U4 VOUT - C1 P1
U4 VOUT - C1 P1
IC3 ISO_Bx - U5 1
IC1 PA5 - U2 SCK
U4 L2 - L3 P1
IC1 PA7 - U2 MOSI
IC1 PA2 - IC2 UART1_RXD
J1 VBUS__1 - IC3 VINx
IC1 PA9 - U1 RXD
U4 VOUT - C1 P1
IC1 PA11 - IC2 USB_DM
IC1 PA2 - IC2 UART1_RXD
IC1 PA11 - IC2 USB_DM
U4 VOUT - C1 P1
U4 VOUT - C1 P1
IC3 ISO_Bx - U5 1
U4 VOUT - C1 P1
U4 VOUT - C1 P1
U1 V_IO - U3 VDDA
IC1 PA14 - J4 4
IC1 PA10 - U1 TXD
IC1 PA10 - U1 TXD
IC1 PB3 - J4 6
U4 VOUT - C1 P1
U4 VOUT - C1 P1
IC1 PA13 - J4 2
3V3_FB
U4 VOUT - C1 P1
IC1 NRST - J4 10
IC3 VINx - R1 P1
IC3 ISO_Bx - U5 1
IC1 PA3 - IC2 UART1_TXD
IC3 VINx - R1 P1
IC1 PA12 - IC2 USB_DP
IC3 VINx - R1 P1
U3 VDDD - U3 VDDSPK
U4 VOUT - C1 P1
IC1 PA14 - J4 4
IC1 PA3 - IC2 UART1_TXD
IC1 PA12 - IC2 USB_DP
IC3 ISO_Sx - U4 VIN
IC1 NRST - J4 10
IC3 EP - U4 GND
J4
J4 9 - C1 P2
C25
Capacitance
10uF
C18
Capacitance
10uF
C43
Capacitance
100nF
IC3 EP - U4 GND
IC2 GND_10 - IC2 GND_11
C42
Capacitance
100nF
C10
Capacitance
100nF
J4 9 - C1 P2
IC2 GND_10 - IC2 GND_11
C9
Capacitance
100nF
J4 9 - C1 P2
C36
Capacitance
100nF
C56
Capacitance
1pF
C1
Capacitance
100nF
C13
Capacitance
10uF
C27
Capacitance
10uF
U3 VSSD - U3 VSSSPK
C28
Capacitance
10uF
C53
Capacitance
100nF
U3 VSSD - U3 VSSSPK
C30
Capacitance
10uF
C8
Capacitance
100nF
C3
Capacitance
100nF
GND
IC3 EP - U4 GND
C26
Capacitance
10uF
C35
Capacitance
100nF
U2 GND_2 - U2 GND_3
C24
Capacitance
10uF
C17
Capacitance
10uF
C20
Capacitance
100uF
C7
Capacitance
100nF
U2 GND_2 - U2 GND_3
C48
Capacitance
100nF
IC2 GND_23 - U1 GND
J4 9 - C1 P2
C44
Capacitance
100nF
C52
Capacitance
100nF
U1 GND__8 - U2 GND_1
IC2 GND_23 - U1 GND
J4 9 - C1 P2
C29
Capacitance
10uF
J4 9 - C1 P2
C55
Capacitance
1pF
C49
Capacitance
100nF
C22
Capacitance
100uF
C40
Capacitance
100nF
IC2 GND_10 - IC2 GND_11
J4 9 - C1 P2
U2 GND_2 - U2 GND_3
C14
Capacitance
10uF
C4
Capacitance
100nF
C2
Capacitance
100nF
C5
Capacitance
100nF
C33
Capacitance
10uF
C11
Capacitance
100nF
J4 9 - C1 P2
C6
Capacitance
100nF
C37
Capacitance
100nF
J4 9 - C1 P2
J4 9 - C1 P2
C15
Capacitance
10uF
C38
Capacitance
100nF
C12
Capacitance
100nF
J4 9 - C1 P2
J4 9 - C1 P2
J4 9 - C1 P2
C51
Capacitance
100nF
C39
Capacitance
100nF
J4 9 - C1 P2
J4 9 - C1 P2
U3 VSSD - U3 VSSSPK
U1 GND__8 - U2 GND_1
C16
Capacitance
10uF
IC3 EP - U4 GND
J1 SHIELD__3 - R1 P2
C41
Capacitance
100nF
C32
Capacitance
10uF
C19
Capacitance
100uF
C45
Capacitance
100nF
J1 SHIELD__3 - R1 P2
C23
Capacitance
10uF
J4 9 - C1 P2
J4 9 - C1 P2
C31
Capacitance
10uF
U2 GND_5 - U3 VSSA
C54
Capacitance
100nF
C21
Capacitance
100uF
C47
Capacitance
100nF
U2 GND_5 - U3 VSSA
C50
Capacitance
100nF
J1 SHIELD__3 - R1 P2
J1 SHIELD__3 - R1 P2
J4 9 - C1 P2
C46
Capacitance
100nF
C34
Capacitance
10uF
U2
L3
Inductance
2.2uH
D2
U5
J6
SW2
SW1
D3
J1
Q1
U6
LS1
IC2
D1
L4
Inductance
3.9nH
J7
SW3
U3
U1
IC6
U4
IC5
MK1
End of Life
IC3
IC1

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Design Notes
Architecture decisions
  • MCU default: STM32U575 selected as the primary low-power Cortex-M33 MCU for strong low-power support, wide ecosystem, and easier external modem/radio integration.
  • LTE modem default: SIM7080G selected for Cat-M1/NB-IoT plus GNSS coexistence support and broad distributor availability.
  • GNSS default: u-blox M10 family selected for low-power positioning and mature ecosystem.
  • Audio path default: NAU8810 selected as the codec path for LPCNet-capable audio front end.
  • Power tree: USB-C 5V input -> protected VBUS -> BQ25628 charger / power-path -> battery / VSYS -> TPS63036 3.3V rail -> secondary 1.8V rail for IO domains where needed.
Constraints
  • Layout size: 90 mm x 60 mm
  • Stackup: 4-layer
  • IPC target: Class 2
  • Sleep current target: under 10 uA at the system level
  • RF constraints: keep-out zones under SX1262 RF region and LTE antenna region; separate noisy switching power loops from RF/GNSS sections
  • Sourcing: prefer Mouser and Digi-Key, with LCSC alternates where practical
Immediate next tasks
  • Find exact Flux library parts for MCU, charger, regulators, modem, GNSS, LoRa radio, audio codec, USB-C, battery connector, SMA connectors, LEDs, buttons, and required passives.
  • Build schematic by subsystem and wire named power and interface nets.
  • Configure board size and 4-layer stackup with conservative proto rules.
  • Architecture decisions

  • Constraints

  • Immediate next tasks

PeakNode 1

PeakNode 1 thumbnail
Ruggedized battery-powered PeakNode 1 LoRa PWAN node with SX1262 LoRa mesh over SPI, LTE Cat-M1/NB-IoT modem, GNSS, LPCNet-capable audio path, USB-C charging and LiFePO4 power management. Targets a 4-layer 90 mm x 60 mm IPC Class 2 layout with 3.3 V main and 1.8 V I/O rails, dual SMA antennas, two RGB status LEDs, three tactile buttons, low-leakage power architecture for sub-10 uA sleep, and defined RF keep-out zones under the LoRa and LTE antenna regions.

Properties

3.3V main, 1.8V IO

Mouser, Digi-Key, LCSC alternate

4-layer 90x60mm board with RF keep-out zones under SX1262 and LTE antenna regions; dual SMA connectors; LoRa SPI, LTE UART/USB, GNSS UART, audio codec path, two RGB LEDs, three buttons

2 RGB LEDs, 3 tactile buttons, audio I/O

1-cell LiFePO4 input, USB-C charging, 3.3V main rail, 1.8V LTE/modem IO target, sleep current under 10uA

-40C to 85C

IPC Class 2 rugged field node

LoRa mesh, LTE Cat-M1/NB-IoT, GNSS

Pricing & Availability

Distributor

Qty 1

Arrow

$43.64–$47.41

Digi-Key

$67.78–$87.35

LCSC

$116.56

Mouser

$66.56

TME

$2.26

Verical

$33.88–$44.34

Controls