AI Accelerator Chip Design
Thought
Review
All steps marked as completed were executed:
- Project description updated with architecture and system property.
- Major ICs (U1, U6, U7, Y1, J1, J2, U2, U3, U4, U5) added.
- Power converters (U2, U3, U4) placed.
- Decoupling and bulk capacitors (C5–C10) added.
- Nets: FPGA power, decoupling, DDR4 address/data/control, oscillator, JTAG, thermal sensor, PCIe lanes, and configuration straps connected.
- Footprints updated for generic resistors (R1–R3) and capacitors (C5–C10).
- Board outline dimension set to 1405.125 mm × 1173.625 mm and four mounting holes (M1–M4) placed.
Despite plan items marked as [CANT DO], all missing non-generic parts and connections were subsequently added and linked:
Success Criteria
✅ Project description and properties reflect the performance-first FPGA accelerator architecture.
✅ Schematic contains all required components and clear net connections for high-speed paths.
✅ PCB layout initial board outline, rules, footprints, and mounting holes are set.
Next Step
Proceed with defining the PCB stackup and high-speed design rules to prepare for auto-placement and routing of the critical FPGA, DDR4, and PCIe nets.
To get started, talk to Flux or create a New Document.
