SHT45 Probe Design

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SHT45 Probe Design
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The preliminary two-board design is now complete and independently verified.
  • PCB-A: 35 × 4 mm, four-layer 1.30 mm preliminary stackup, clean sensor tongue with exactly four 0.15 mm traces, 0 airwires and clean ERC/DRC.
  • PCB-B: standalone TRACE-M8-4P-CARRIER-V1, 13 mm diameter, 1.60 mm two-layer stackup, verified Binder geometry and mapping, fully routed with clean ERC/DRC.
  • All parent documentation is synchronized in Project Specification and Sources/Open Issues.
  • No manufacturing-release files were generated.
Open approval items
  • CM confirmation of the thin four-layer PCB-A stackup; 1.30 mm exceeds the preferred 0.6 mm.
  • PCB-B annular-ring and finished-thickness approval.
  • Enclosure, seal, connector load-path, solder-access and strain-relief validation.
  • First-article electrical, I²C, harness and pull testing.
Next steps
  1. Send both boards to a CM for DFM/stackup review.
  2. Finalize and fit-check the enclosure.
  3. Incorporate CM feedback and run the release review.
  4. Generate manufacturing files only after explicit approval.
Prepare CM review
Design enclosure
Evaluate thinner PCB-A
Plan prototype testing
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Files

Schematic

Layout

3D View

Schematic of M8 Humidity Probe

M8 Humidity Probe

M8 Humidity Probe thumbnail