SHT45 Probe Design

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The preliminary two-board design is now complete and independently verified.
  • PCB-A: 35 × 4 mm, four-layer 1.30 mm preliminary stackup, clean sensor tongue with exactly four 0.15 mm traces, 0 airwires and clean ERC/DRC.
  • PCB-B: standalone TRACE-M8-4P-CARRIER-V1, 13 mm diameter, 1.60 mm two-layer stackup, verified Binder geometry and mapping, fully routed with clean ERC/DRC.
  • All parent documentation is synchronized in Project Specification and Sources/Open Issues.
  • No manufacturing-release files were generated.
Open approval items
  • CM confirmation of the thin four-layer PCB-A stackup; 1.30 mm exceeds the preferred 0.6 mm.
  • PCB-B annular-ring and finished-thickness approval.
  • Enclosure, seal, connector load-path, solder-access and strain-relief validation.
  • First-article electrical, I²C, harness and pull testing.
Next steps
  1. Send both boards to a CM for DFM/stackup review.
  2. Finalize and fit-check the enclosure.
  3. Incorporate CM feedback and run the release review.
  4. Generate manufacturing files only after explicit approval.
Prepare CM review
Design enclosure
Evaluate thinner PCB-A
Plan prototype testing
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Files

Schematic

Layout

3D View

PCB-B Controlled Geometry
Controlled provenance
Binder identifies 86 6119 1100 00004 as the current order number and 09 3391 81 04 as the alternative/old number. The controlled CAD package retains vendor filename 09-3391-81-04.STP; this filename is kept for traceability and does not change the current ordering reference.
Final preliminary PCB-B state
  • Board: 13.0 mm circular, two copper layers.
  • Active layout thickness read-back: 1.60 mm.
  • Finish intent: ENIG, pending CM fabrication definition.
  • Components/interfaces: J1 Binder connector footprint and J2 four-pad harness interface.
  • Routing-state read-back: 0 airwires, 0 dangling traces.
  • Refreshed electrical/design-rule review: 0 error, warning, open or uncertain ERC/DRC findings.
  • This is a preliminary approval-gate design, not a manufacturing release.
Controlled connector geometry and mapping
Datum is the connector mechanical axis at PCB XY (0,0). Coordinates are the component/plug-in-side view:

Table

PinX (mm)Y (mm)Finished holeCopper padNet / colour
1-1.700-0.500Ø1.3 mmØ1.8 mm preliminary+3V3 / brown
2-1.075+1.450Ø1.3 mmØ1.8 mm preliminarySCL / white
3+1.700-0.500Ø1.3 mmØ1.8 mm preliminaryGND / blue
4+1.075+1.450Ø1.3 mmØ1.8 mm preliminarySDA / black
  • Connector tails are Ø0.6 mm.
  • Component/plug-in-side orientation is 2–4 / 1–3.
  • The physical tail-side view appears 4–2 / 3–1; terminal numbers are not mirrored or renumbered.
  • The Ø1.8 mm pad around the Ø1.3 mm finished hole gives a 0.25 mm nominal radial annular ring, which remains a CM approval item.
Verified STEP registration
  • Vendor STEP is used unchanged at scale 1.
  • Model rotation: 0, -90°, 0; model Z position: +2.0 mm.
  • Coordinate relation: Xpcb=-Zstep, Ypcb=Ystep, Zboard=Xstep+2.0 mm.
  • Tail tips near raw STEP X≈−4.5 mm map to board Z≈−2.5 mm. Against the 1.60 mm board, nominal protrusion is approximately 0.9 mm.
  • Rear-body datum near raw X≈0 maps near board Z≈+2.0 mm. This verifies registration; it is not a claim that the connector shoulder seats on the PCB.
13.0 mm carrier clearance read-back
  • Board radius: 6.500 mm; configured 0.250 mm inset boundary radius: 6.250 mm.
  • Maximum connector body/hex envelope Ø11.547 mm: 0.7265 mm to physical board edge, 0.4765 mm to inset boundary.
  • Rear-body Ø8.0 mm envelope: 2.500 mm to physical edge, 2.250 mm to inset boundary.
  • J1 connector pads: minimum copper clearance 3.795 mm to physical edge, 3.545 mm to inset boundary.
  • J2 outer harness pads: minimum copper clearance 1.180 mm to physical edge, 0.930 mm to inset boundary.
  • J2 conservative footprint-corner bound: 0.752 mm to physical edge, 0.502 mm to inset boundary.
  • Read-back shows no component-outside-board, copper-overlap or keepout finding after the 13.0 mm geometry was finalized.
Panel, enclosure and load path
  • Rear mounting uses the controlled Ø8.1 mm panel hole with 0.5 × 45° chamfer.
  • Controlled mounting-wall range is 2.0–3.5 mm; panel fastening torque is 1 N·m.
  • Panel/enclosure must carry mating, torque, axial and cable loads. PCB-B and its solder joints are electrical interconnects, not structural load paths.
  • Enclosure approval must verify the maximum connector envelope, PCB edge clearances, solder-tool/inspection access, axial stops and harness bend/strain-relief space.
Remaining approval gates
  1. CM approval of the nominal 1.60 mm finished-thickness convention and tolerance.
  2. CM approval of Ø1.8 mm connector pads and the 0.25 mm radial annular ring.
  3. Connector/seal tolerance, material, hardness/compression and service/replacement data.
  4. Enclosure mechanical capture, load path, solder/inspection access and complete physical fit.
  5. Connector and harness joint solder wetting and inspection criteria.
  6. Enclosure-based strain relief and qualified pull-test requirement.
  7. First-article mating-face continuity/polarity and system I2C/cordset tests with PCB-A.
  8. Production sourcing and materials/change-control approval.
  9. Final human release authorization.
No Gerbers, drill files, IPC test netlists, pick-and-place/CPL or other manufacturing exports were generated.

  • Controlled provenance

  • Final preliminary PCB-B state

  • Controlled connector geometry and mapping

  • Verified STEP registration

  • 13.0 mm carrier clearance read-back

  • Panel, enclosure and load path

  • Remaining approval gates