Predictive Maintenance Device

I’ll freeze the modular interface standard, select the carrier components, calculate the verified power budget, build and wire the complete carrier schematic, then run connectivity/ERC checks and resolve concrete issues.
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Block Diagram

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Block Diagram Carrier Architecture Functional Groups and Sourcing Gate Inter-block Nets
Power: 24V_RAW, 24V_PROT, FIELD24V_S1..S4, 5V, MODEM_VBAT, 3V3, GND, ISO_5V, ISO_GND.
Buses: I2C_SDA/SCL, SPI_SCK/MOSI/MISO, per-slot SLOTn_CS/INT/EN, CELL_TX/RX, RS485_TX/RX/DE, USB_D+/D-.
Execution is blocked because the account has no available ACUs. The universal POC/MVP requirements and modular architecture are documented, but no schematic components or nets were added.
Remaining work:
  • Finalize component selections and module connector pinout
  • Calculate the datasheet-based power budget
  • Build and wire the carrier schematic
  • Run ERC/connectivity verification
  • Create firmware starter and board bring-up files
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Project Specification
Project Overview
  • Status: Draft POC/MVP requirements
  • Device: Universal industrial data-acquisition and predictive-maintenance gateway.
  • Purpose: Connect to diverse retrofit sensors, collect and locally retain equipment data, upload it to an online platform, and support baseline, anomaly-detection, and prediction workflows.
  • Initial validation case: HVAC/glycol chiller, using a dedicated harness configuration rather than constraining the carrier architecture.
  • Product strategy: One reusable carrier board plus swappable, labelled sensor harnesses and configurable interface modules for different equipment classes.
Intended Use
  • Prototype and small-batch proof-of-concept deployments on HVAC/chillers, boilers, generators, transformers, gasifiers, pumps, motors, printers, and other industrial equipment.
  • Non-invasive or minimally invasive retrofit monitoring where practical.
  • Installed by appropriately qualified electrical, mechanical, refrigeration, or gas personnel according to the equipment involved.
  • The MVP is a data and diagnostics platform; it must not replace, bypass, or duplicate machinery safety controls.
POC/MVP Goals
  1. Prove that one common carrier can acquire useful data from multiple industrial sensor types.
  2. Prove reliable Wi-Fi/cellular transmission and store-and-forward operation.
  3. Prove field configuration, channel calibration, sensor-health detection, and modular harness replacement.
  4. Establish a reusable data schema for different equipment classes.
  5. Validate the first full harness on an HVAC/glycol chiller.
  6. Generate enough healthy and labelled maintenance data to begin anomaly-detection development.
Out of Scope for the First MVP
  • Direct 110/240 VAC input on the custom PCB.
  • Replacing certified protection, interlock, flame-safeguard, low-water, relief, or machine-control systems.
  • Universal support for every sensor without configuration or interface adaptation.
  • Guaranteed remaining-useful-life predictions before sufficient labelled field data exists.
  • Medium/high-voltage direct measurement or energized-panel installation by unqualified personnel.
What the Device Should Do
  • Acquire configurable analog, temperature, current, vibration, pulse/frequency, contact, and industrial digital-bus signals.
  • Timestamp and convert measurements into engineering units with calibration and quality flags.
  • Buffer data locally for at least 7 days of normal summary telemetry.
  • Use Wi-Fi as primary backhaul and cellular as automatic fallback.
  • Continue acquisition through network outages and forward queued records after reconnection.
  • Report device, power, storage, network, and per-channel sensor health.
  • Support secure remote configuration and firmware updates with recovery provisions.
  • Support continuous summary telemetry plus scheduled or triggered high-rate waveform bursts.
Universal System Architecture

Diagram


85-264 VAC site mains Certified external isolated 24 VDC supply Existing 24 VDC panel supply Protected 24 VDC carrier input Power and protection block Controller and acquisition core Configurable analog module Temperature module CT and waveform module Vibration module Digital and industrial bus module Equipment-specific labelled harness Local storage and RTC Wi-Fi primary Cellular fallback Server, dashboard and analytics
Carrier and Module Partitioning
Common Carrier Board
The carrier should contain functions required by every equipment deployment:
  • ESP32-S3-class controller and Wi-Fi.
  • Cellular modem interface or integrated cellular module.
  • Protected 24 VDC input and internal power conversion.
  • RTC, non-volatile configuration memory, and removable or soldered bulk storage.
  • Watchdog, brownout supervision, status indicators, and service/programming interface.
  • Internal expansion buses and standardized module connectors.
  • Optional isolated RS-485 transceiver where cost and board space permit.
Swappable Interface Modules
Interface circuitry with different range, isolation, bandwidth, or protection needs should be modular. Modules may be small daughterboards, plug-in cards, or separately cabled interface boards during the POC.
Standardized module connections should provide:
  • 24 V protected field power where required.
  • 5 V and 3.3 V logic power with defined current limits.
  • SPI and I2C.
  • UART.
  • ADC/control lines where required.
  • Interrupt/synchronization line.
  • Module identification or configuration EEPROM.
  • Ground, shield, and optional isolated-side boundaries clearly defined.
The connector must be keyed and pin assignments documented. A module must not expose hazardous energy to the carrier.
Modular Interface Requirements
Module A — Configurable Industrial Analog Inputs
MVP target: 4 channels.
Supported sensor formats:
  • 0–5 V.
  • 0–10 V.
  • 4–20 mA.
  • Low-voltage ratiometric sensors where supported by the selected ADC and excitation scheme.
Requirements:
  • Per-channel configuration through jumpers, switches, or software-controlled front ends; the POC may use clearly documented hardware configuration.
  • External ADC with resolution and noise performance suitable for process trending.
  • Input scaling, anti-alias filtering, overvoltage protection, ESD protection, and fault-current limiting.
  • 4–20 mA burden resistor selected for ADC range and power rating.
  • Sensor open-circuit, over-range, and under-range detection where the interface permits.
  • Optional isolated analog module variant reserved for field loops with grounding or long-cable concerns.
  • Protected 24 V sensor excitation output with per-module current limiting where required.
Module T — Temperature Inputs
MVP target: 4 channels total across configurable interfaces.
Supported directions:
  • PT100/PT1000 RTDs using dedicated converter circuitry.
  • Thermocouples using cold-junction-compensated interfaces; type selected per equipment and atmosphere.
  • 1-Wire digital probes for moderate-temperature, cost-sensitive channels.
  • I2C/SPI temperature sensors for enclosure or local board measurements.
Requirements:
  • Open/short detection.
  • 2-, 3-, or 4-wire RTD support selected by module variant; 3-wire is the preferred general industrial compromise.
  • Thermocouple module must support the required type and preserve polarity and cold-junction accuracy.
  • Connector and firmware configuration must prevent silently treating one probe type as another.
Module C — Non-Invasive Current and Waveform Inputs
MVP target: 3 CT channels.
Requirements:
  • Split-core current-transformer compatibility for retrofit monitoring.
  • Permanently fitted burden and secondary protection where required; a CT secondary must never be left open while its primary is energized.
  • Biasing and anti-alias filtering for bipolar waveform capture.
  • Simultaneous or sufficiently synchronized sampling for three-phase/load comparison where feasible.
  • Support RMS, peak, crest factor, load trend, and scheduled high-rate waveform capture.
  • CT ranges are selected in the harness/module configuration, not assumed universal.
  • Inline Hall-effect or shunt-based measurement is outside the default retrofit path but may be supported by future modules.
Module V — Vibration and Acoustic Inputs
MVP target: 1 high-bandwidth digital vibration channel, expandable.
Requirements:
  • SPI-connected industrial vibration sensor preferred for predictable bandwidth and lower analog-front-end risk.
  • Rigid sensor mounting and shielded/robust cabling appropriate to the installation.
  • Configurable sampling and burst duration.
  • Local calculation of RMS, peak, crest factor, and selected spectral features to reduce cellular data use.
  • Preserve selected raw waveform bursts for server-side algorithm development.
  • Future module options may include IEPE accelerometers, analog MEMS sensors, and ultrasonic microphones.
Module D — Digital, Pulse, and Contact Inputs
MVP target: 4 configurable low-speed channels.
Functions may include:
  • Dry-contact or open-collector state inputs.
  • Pulse/frequency counting for RPM, flow, or energy-meter pulses.
  • Debounced alarm/run-state inputs.
  • 1-Wire sensors where not placed on the temperature module.
Requirements:
  • Input protection suitable for external cabling.
  • Configurable pull-up/excitation and thresholding.
  • Galvanically isolated variant for 12/24 V industrial status signals is preferred for field deployment.
  • Outputs for control are not part of the initial MVP; the unit is monitoring-only.
Industrial Communication Interfaces
  • Isolated RS-485 supporting Modbus RTU is the first-priority industrial bus.
  • CAN/CAN-FD or J1939 interface should be available through a future module or carrier option.
  • Ethernet and BACnet/IP are future options, not required for the first hardware spin unless site requirements justify them.
  • Existing controller data should be read where authorized rather than duplicating sensors unnecessarily.
Equipment-Specific Harness Model
Each deployment uses a documented harness that maps physical sensors to universal channels.
A harness definition must contain:
  • Equipment class and harness revision.
  • Connector and cable pinout.
  • Sensor type, measurement range, excitation, output format, and calibration.
  • Module type and per-channel configuration.
  • Cable type, shield termination, maximum recommended length, and environmental rating.
  • Safe installation method and required installer qualification.
  • Firmware channel name, units, sample rate, filtering, alarm limits, and upload policy.
Harness identification should be automatic where practical using an EEPROM or coded ID resistor; manual configuration with strict revision control is acceptable for the first POC.
First Validation Harness — HVAC/Glycol Chiller
The first harness validates the universal platform using:
  • 3 temperature channels.
  • 2 refrigerant pressure channels.
  • 3 split-core CT current channels.
  • 1 vibration channel.
Initial measurement allocation:
  • Glycol supply temperature.
  • Glycol return temperature.
  • Compressor discharge, suction-line, condenser, or ambient temperature.
  • Refrigerant suction pressure.
  • Refrigerant discharge pressure.
  • Compressor current.
  • Condenser/cooling-tower fan current.
  • Glycol/circulation-pump current.
  • Compressor or priority rotating-equipment vibration.
Final ranges, probes, fittings, CT sizes, and vibration placement are determined during the chiller site survey.
Processing and Control
  • ESP32-S3 module or equivalent, selected for adequate interfaces, security features, memory, Wi-Fi support, and ecosystem maturity.
  • Cellular modem must be compatible with target-region carriers; LTE Cat-M1/NB-IoT is preferred where coverage is verified, with LTE Cat-1 bis considered where it provides better regional availability.
  • Independent hardware watchdog preferred.
  • Hardware should expose commissioning and recovery interfaces without opening permanent security weaknesses.
Local Storage and Timekeeping
  • At least 7 days of normal summary telemetry at the configured channel count.
  • Storage policy must distinguish continuous summaries from high-rate waveform bursts.
  • RTC with backup retention and network time synchronization.
  • Each record includes device, site, equipment, harness revision, channel, timestamp, value, units, quality flags, and configuration revision.
  • Use power-loss-resistant writes and storage-health monitoring.
Connectivity
  • Primary: 2.4 GHz Wi-Fi.
  • Fallback: Region-compatible cellular.
  • Automatic failover and return without stopping acquisition.
  • Queue-and-forward with acknowledgement and duplicate protection.
  • MQTT over TLS or HTTPS with authenticated devices.
  • Local commissioning method for network and sensor configuration.
  • Antenna connections must allow external antennas when the unit is installed inside a metal cabinet.
Power and Runtime Expectations
  • Device input: protected nominal 24 VDC.
  • Expected input operating range: to be finalized after transient/protection design; the design should accommodate normal industrial 24 V supply tolerance.
  • Existing-panel installations: connect to a verified 24 VDC supply with adequate spare capacity.
  • Mains-only installations: use an external certified isolated DIN-rail power supply.
  • External supply input: universal 85–264 VAC, 50/60 Hz.
  • External supply output: regulated 24 VDC.
  • Initial supply class: 25 W minimum planning target; final rating follows the complete datasheet-based power budget.
  • No 110/240 VAC is routed onto the custom PCB.
  • Battery backup is optional and outside the first hardware baseline; storage protects against communication outages, not extended site-power loss.
Power Architecture

Diagram


85-264 VAC mains Certified isolated DIN-rail 24 VDC supply Existing 24 VDC panel supply Protected 24 VDC input Fuse, reverse polarity, surge and EMI protection Protected 24 V field excitation High-efficiency 5 V buck Cellular modem peak load 3.3 V regulator Controller and Wi-Fi Storage, RTC and interface logic Interface-module power
Preliminary Power Budget Envelope
Exact current values must be replaced by selected-part datasheet figures before power components are chosen.

Table


Load groupPreliminary peak allowance
Controller, Wi-Fi, storage and RTC3–4 W
Cellular modem transmit bursts5–8 W
Carrier acquisition and interface logic1–2 W
Active interface modules and vibration sensing2–4 W
Field-sensor excitation2–6 W
Conversion losses and growth margin3–5 W
Initial design envelope16–29 W
  • The earlier 15–25 W supply class may be insufficient for the highest-loaded universal configuration.
  • Use a 30 W or larger external supply as the current planning assumption, then size from the verified peak budget with margin.
  • Use switching conversion from 24 V; do not use a linear regulator for the main 24 V-to-5 V or 24 V-to-3.3 V conversion.
  • Cellular transmit peaks must not cause brownout or corrupt storage.
  • Field excitation outputs require defined current limits so one faulty sensor cannot collapse the carrier rails.
Protection and Grounding
  • Reverse-polarity protection and input overcurrent protection.
  • Surge/transient suppression appropriate to industrial 24 V panels.
  • EMI filtering coordinated with converter stability and conducted-emissions needs.
  • ESD, overvoltage, and fault-current protection on all external channels.
  • Defined shield/chassis/logic-ground strategy.
  • Isolation applied by module/interface need rather than claiming one non-isolated circuit is universal.
  • Pluggable, keyed connectors and clear terminal labelling.
Data Acquisition Requirements
  • Per-channel configurable sample rate, filtering, scaling, units, and upload interval.
  • Typical process-summary interval: 1–10 seconds.
  • High-rate current and vibration capture occurs in configurable bursts.
  • Preserve raw ADC/sensor values alongside calibrated engineering units where practical.
  • Detect disconnected, shorted, saturated, stale, and implausible signals.
  • Provide synchronized timestamps across channels.
  • Configuration must be versioned and included with uploaded data.
Server and Prediction Requirements
  • Common ingestion format independent of equipment class.
  • Time-series storage linked to device, site, equipment, harness, operating state, and maintenance labels.
  • Dashboards for telemetry, device health, network status, storage, and alerts.
  • Begin with thresholds, trend analysis, correlations, and unsupervised/semi-supervised anomaly detection.
  • Supervised failure classification and remaining-useful-life prediction require sufficient labelled fault history and are not immediate MVP guarantees.
  • Operators must be able to record alarms, shutdowns, inspections, replaced parts, and confirmed root causes.
Firmware-Relevant Hardware Requirements
  • Board and harness/module identification.
  • Per-channel configuration and calibration storage.
  • Wi-Fi/cellular failover state machine.
  • Store-and-forward queue with acknowledgement and retry control.
  • Sensor-health diagnostics and acquisition scheduling.
  • Local feature extraction for vibration/current waveforms.
  • Secure boot and signed update support where available.
  • Watchdog, brownout recovery, storage recovery, and update rollback.
  • Commissioning mode showing live raw and scaled channel readings.
Physical Design Expectations
  • Carrier and modules suitable for a serviceable prototype enclosure.
  • DIN-rail or secure panel mounting.
  • IP54 minimum inside a protected environment; IP65 preferred for exposed installations.
  • External antennas when installed in a metal enclosure or cabinet.
  • Maintain air space around internal PCB antennas and keep copper, wiring, screws, bosses, and conductive material out of the antenna region.
  • Separate high-current/noisy field wiring from low-level analog, RTD, thermocouple, and vibration channels.
  • Provide strain relief and field-replaceable connectors.
Safety and Installation Constraints
  • The custom electronics remain on the 24 VDC SELV/PELV side.
  • Mains conversion uses an external certified isolated supply installed under local electrical rules.
  • Monitoring circuitry must not bypass or interfere with equipment safety systems.
  • CT, transformer, generator, boiler, gasifier, pressure-vessel, refrigerant, or gas-train installations require appropriately qualified personnel.
  • Sensor taps and pressure connections must use approved fittings and procedures.
  • De-energized installation is preferred wherever possible.
Manufacturing and Assembly Expectations
  • POC quantity: one to a small batch.
  • Prioritize modularity, accessible test points, replaceable modules, and debugging over minimum size and BOM cost.
  • Use readily sourced modules for cellular and specialized acquisition functions in revision 1 where that reduces integration risk.
  • Carrier should be assembled professionally; field harnesses can be built and labelled separately.
  • Lock module and harness connectors/pinouts before ordering a larger batch.
Universal Site-Survey Items
Equipment and Failure Context
  • Equipment class, manufacturer, model, serial number, age, duty cycle, and operating modes.
  • Existing controller, BMS/PLC, alarm history, maintenance records, and known recurring failure modes.
  • Measurements most valuable to operators and the action expected from each alert.
  • Existing Modbus, BACnet, CAN/J1939, pulse, relay, or analog data that can be read safely.
Electrical and Power
  • Available 24 VDC range, spare current, grounding, noise, transients, and panel location.
  • If using mains: voltage, frequency, phase, protective earth, breaker, DIN-rail space, and applicable installation rules.
  • High-current equipment nameplate ratings, conductor sizes, phase arrangement, VFDs, contactors, and CT installation clearance.
  • Lockout/tagout procedures and qualified installer responsibility.
Sensor Interfaces
  • Required measurement, expected normal/fault range, accuracy, bandwidth, cable length, and response time.
  • Sensor output: 0–5 V, 0–10 V, 4–20 mA, RTD, thermocouple, pulse, dry contact, RS-485, CAN, I2C, SPI, or 1-Wire.
  • Sensor excitation, connector/fitting, media compatibility, ingress rating, and calibration requirements.
  • Grounding/isolation needs and cable shield termination.
  • Existing ports or mounting points and whether process penetration is permitted.
Vibration and Waveform Channels
  • Rotational speed range, bearing locations, mounting surface, background vibration, and accessible operating conditions.
  • Required fault frequencies and minimum useful bandwidth.
  • Current waveform load type, inrush, VFD presence, conductor access, and desired analysis depth.
Connectivity and IT
  • Wi-Fi coverage, security, onboarding, firewall, captive-portal, and internet-access restrictions.
  • Cellular carrier, bands, technology availability, signal level, APN, SIM procurement, and data cost.
  • Antenna location and cable route.
  • Server endpoint, security, data ownership, retention, and remote-access policy.
Mechanical and Environmental
  • Mounting location, enclosure size, DIN rail, cable entries, service clearance, and antenna clearance.
  • Temperature, humidity, condensation, washdown, dust, chemicals, sunlight, vibration, and corrosion.
  • Required IP rating, cable glands, conduit/tray, strain relief, and maximum cable runs.
Commissioning and Data Labelling
  • Healthy baseline period and representative operating loads.
  • Maintenance schedule and opportunities to capture before/after service data.
  • Method for operators to label alarms, symptoms, shutdowns, replaced parts, and root causes.
  • Acceptance-test window and responsible contacts.
HVAC/Glycol Chiller Validation Survey Addendum
  • Chiller model, refrigerant, compressor type/staging, VFD use, and controller/BMS interfaces.
  • Glycol supply/return pipe locations, material, diameter, insulation, and temperature range.
  • Refrigerant suction/discharge pressure range, service-port fittings, and qualified technician availability.
  • Compressor, fan, and pump currents, conductor sizes, phase arrangement, and CT clearance.
  • Preferred rigid vibration-sensor mounting point and rotational-speed range.
  • Condensation, frost, refrigerant/oil exposure, and cable-routing constraints.
POC/MVP Acceptance Criteria
  • Carrier operates reliably from verified 24 VDC and through Wi-Fi/cellular transmit peaks.
  • External certified 85–264 VAC-to-24 VDC supply provides mains compatibility without mains entering the custom PCB.
  • At least one module of each MVP type is recognized and configurable: analog, temperature, CT/current, vibration, and digital/contact.
  • Demonstrate 0–5 V, 0–10 V, and 4–20 mA acquisition using calibrated test sources.
  • Demonstrate at least one RTD or thermocouple path and one digital temperature path.
  • Demonstrate three CT channels and one vibration channel with summary metrics and waveform bursts.
  • Demonstrate dry-contact/pulse acquisition and isolated RS-485/Modbus communication.
  • Store at least 7 days of representative summary telemetry.
  • Demonstrate automatic Wi-Fi/cellular failover, offline buffering, and later upload without unacceptable loss or duplication.
  • Detect representative open, short, over-range, and disconnected-sensor faults.
  • Complete the HVAC/glycol chiller nine-channel validation harness and receive all channels at the server.
  • Installation does not modify or impair existing equipment safety functions.
Important Design Decisions
  • The MVP is a universal industrial DAQ platform, not a site-specific chiller board.
  • The architecture uses one common carrier plus swappable interface modules and equipment-specific harnesses.
  • HVAC/glycol chiller remains the first full validation use case.
  • Wi-Fi is primary and cellular fallback is mandatory.
  • The device accepts protected nominal 24 VDC only.
  • Mains compatibility uses an external certified isolated 85–264 VAC-to-24 VDC DIN-rail supply.
  • Monitoring-only behavior is the MVP default; control outputs are deferred.
  • Local buffering and server-side analytics are required from the first prototype.
Assumptions
  • Revision 1 may use specialist modules/daughterboards to reduce development risk.
  • A universal connector standard can be defined without placing every possible field interface directly on the carrier.
  • Final isolation levels, channel counts, sampling rates, sensor ranges, and connector selections will be resolved during schematic architecture and bench-test planning.
  • Cellular technology is selected after confirming target-region coverage.
  • A 30 W or larger supply is the provisional planning target until the datasheet-based budget is complete.
Change Notes
  • Refocused the project from a chiller-specific pilot to a universal industrial data-acquisition POC/MVP.
  • Defined common carrier, modular interface, and equipment-specific harness boundaries.
  • Added configurable analog, temperature, CT/current, vibration, digital/contact, and industrial communication interfaces.
  • Retained the HVAC/glycol chiller as the first full validation harness.
  • Preserved the protected 24 VDC input and external certified mains-supply architecture.
  • Expanded the power envelope, universal site-survey checklist, and acceptance criteria.
  • Project Overview

  • Intended Use

  • POC/MVP Goals

  • Out of Scope for the First MVP

  • What the Device Should Do

  • Universal System Architecture

  • Carrier and Module Partitioning

  • Common Carrier Board

  • Swappable Interface Modules

  • Modular Interface Requirements

  • Module A — Configurable Industrial Analog Inputs

  • Module T — Temperature Inputs

  • Module C — Non-Invasive Current and Waveform Inputs

  • Module V — Vibration and Acoustic Inputs

  • Module D — Digital, Pulse, and Contact Inputs

  • Industrial Communication Interfaces

  • Equipment-Specific Harness Model

  • First Validation Harness — HVAC/Glycol Chiller

  • Processing and Control

  • Local Storage and Timekeeping

  • Connectivity

  • Power and Runtime Expectations

  • Power Architecture

  • Preliminary Power Budget Envelope

  • Protection and Grounding

  • Data Acquisition Requirements

  • Server and Prediction Requirements

  • Firmware-Relevant Hardware Requirements

  • Physical Design Expectations

  • Safety and Installation Constraints

  • Manufacturing and Assembly Expectations

  • Universal Site-Survey Items

  • Equipment and Failure Context

  • Electrical and Power

  • Sensor Interfaces

  • Vibration and Waveform Channels

  • Connectivity and IT

  • Mechanical and Environmental

  • Commissioning and Data Labelling

  • HVAC/Glycol Chiller Validation Survey Addendum

  • POC/MVP Acceptance Criteria

  • Important Design Decisions

  • Assumptions

  • Change Notes

Assets

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Universal Predictive Maintenance DAQ thumbnail
Universal industrial data-acquisition POC/MVP with modular analog, temperature, current, vibration and digital interfaces, protected 24 VDC power, local buffering, Wi-Fi and cellular connectivity.

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