0.35 BB CONN. H=0.6 SSB6 RP REC ASSY

5050660622 is a 6-position board-to-board (mezzanine) receptacle connector from the Molex SlimStack™ Armor 505066 Series. It is designed for compact electronic devices where a very low-profile connection between two PCBs is required. The connector features a fine 0.35 mm pitch, 0.60 mm mated height, and surface-mount termination, making it suitable for smartphones, wearables, IoT devices, cameras, and other space-constrained applications.

Key Features 6 circuits (contacts) for board-to-board interconnection. 0.35 mm pitch for high-density PCB designs. Ultra-low 0.60 mm mated height to minimize product thickness. 2-row connector configuration for efficient space utilization. Surface-mount (SMT) mounting for automated assembly. Armor Nail design improves solder joint strength and mechanical retention. Gold-plated contacts for reliable electrical performance and corrosion resistance. 50 V AC/DC voltage rating. Up to 0.3 A per contact current rating. Operating temperature range: -40°C to +85°C. Liquid Crystal Polymer (LCP) housing for high heat resistance during reflow soldering. 30 mating cycle durability. Typical Applications Smartphones and tablets Wearable devices Wireless modules Portable medical devices Cameras and imaging equipment Compact consumer electronics

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