Part Information Review and Datasheet Search

flux

I can’t rebuild the footprint directly from this API session because the project-editing tools needed to modify a Flux part project aren’t available here.
What I can confirm is the exact completion target for the rebuild:
Required rebuild target

Table

ItemRequired value
PackageQFN-32 8 mm x 8 mm
Perimeter pins32 total package pins must match exactly
Exposed pad terminalInclude a dedicated VSS_EPAD terminal
EPAD electrical typeGround
EPAD symbol groupingPut it in the Power sub-symbol with the other VSS/GND pins
EPAD footprint geometryCentered rectangular pad at 0 mm, 0 mm
EPAD size5.0 mm x 5.0 mm
That target is consistent with the part-project rules: exposed pads count as pins and must have their own terminal element, and pin-count matching must include exposed pads exactly . The same guidance also says exposed-pad and ground pins should be typed as Ground and grouped into the dedicated Power sub-symbol .
Exact implementation checklist

Table

StepAction
1Rebuild the footprint as QFN-32 8x8 mm from scratch
2Keep the 32 perimeter pads as the package pins
3Add one dedicated center terminal: VSS_EPAD
4Set VSS_EPAD pin type to Ground
5Set VSS_EPAD section/group/sub-symbol to the same ground/power grouping as the other VSS pins
6Place the EPAD at 0,0 with 5.0 mm x 5.0 mm rectangle geometry
7Re-verify total terminal count and pad mapping so the part remains internally consistent
If you want, I can do one of these next:
  • turn this into a precise Flux edit checklist you can follow step-by-step, or
  • review the rebuilt result afterward and tell you whether the part is ready for the XT60 replacement step.
Create edit checklist
Review rebuilt result
Check pin consistency
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Design Notes
BM1370_mode1 package update
Applied user-approved manual package requirements for this part project:
  • Package intent is now QFN-32 8x8 mm with EPAD.
  • Added a dedicated VSS_EPAD terminal as pin 33.
  • The exposed thermal pad is typed as Ground and described as an exposed thermal pad tied to VSS.
  • The footprint was rebuilt from the earlier Bitaxe-repository pad arrangement into a manual 32-pad perimeter QFN plus a centered 5.0 mm x 5.0 mm exposed pad.
Current footprint mapping
  • Pins 1-32 are now perimeter pads in a QFN-32 arrangement.
  • Pin 33 is the centered exposed thermal pad.
  • The centered exposed pad is intended to be soldered to the ground/VSS copper region in consuming designs.
XT60 upgrade readiness
Library search located board-mount XT60-PW candidates for the next power-stage upgrade:
  • XT60PW-M
  • XT60PW-F
However, the current project is a part project only. It contains BM1370 terminal elements and footprint pads, but no DC jack or board-level schematic to swap.
Practical implication:
  • The BM1370 part project is now prepared for reuse in the next stage.
  • The DC jack to XT60-PW replacement must be carried out in the separate board/schematic project that contains the actual power-input connector.

    BM1370_mode1 package update

    Current footprint mapping

    XT60 upgrade readiness

Documents

    Design Notes

Assets

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BM1370_mode1 ffb0

BM1370_mode1 ffb0 thumbnail
Bitcoin mining ASIC, BM1370 in a user-approved QFN-32 8x8 mm package with centered VSS exposed thermal pad

Properties

BM1370_mode1

User-approved manual package requirement: BM1370 uses a 32-pin QFN 8x8 mm package with a central exposed thermal pad tied to VSS/Ground. Repository pin names remain in use where already verified; CLKO uses the letter O.

QFN-32 8x8 mm with EPAD

github.com/bitaxeorg/bitaxeGamma

Bitmain

ASIC

https:/google.com

U4

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