Here’s how the PCB layout phase will proceed and what I’ll focus on, tailored to your design:
Board outline and placement anchors
Set a compact provisional board (about 50 x 35 mm).
Reserve a straight board edge for the USB-C receptacle.
Place the ESP32-S3 module U1 so the antenna area faces the board edge with a clear RF keepout.
Place the SHTC3 sensor U2 near an opening/edge for airflow, away from heat sources.
RF keepout and rules
Define a 2.4 GHz antenna keepout area around U1 with no copper pours, traces, or components beneath/near the antenna.
Keep ground reference continuous under digital areas; avoid stitching vias in the antenna keepout.
Set conservative default trace width/via sizes suitable for 2-layer or 4-layer stackups.
Functional grouping
Cluster SW1–SW4 for user ergonomics; place SW5 (BTN_CLR) and SW6 (BTN_PWR) apart to reduce accidental presses.
Place the TVS diodes D1–D6 close to their respective buttons to minimize loop area.
Keep pull-up resistors R1–R6 near the MCU side to ensure defined logic levels.
Power integrity
Route USB VBUS short to input protection and regulator (to be added) with wide traces; add local bulk and high-frequency decoupling.
Place decoupling capacitors as close as possible to U1 and U2 supply pins with short returns to GND.
Manufacturability and test
Maintain component-to-edge clearances for USB-C and buttons.
Add test pads for 3V3, GND, key button nets, and UART/boot signals.
If you want, I can proceed to set the provisional board size and start placing these anchors, then we can iterate on exact dimensions and connector orientation.