USB-C Sensor Node
Worked for 4 mins 28 sec
Implemented the schematic for the USB-C powered Wi‑Fi/BLE temperature/humidity node. It uses a SiWG917 Wi‑Fi/BLE 5.4 module, SHT41 T/RH sensor, USB-C sink input, TPS25940 true reverse-blocking eFuse with OVP/UVLO/OCP/soft-start, MP28301 3.3 V buck regulator, ESD protection, reset/ISP/SWD debug, I2C pull-ups, and status LED.
Created project files:
Open items:
- PCB layout/routing is not done yet, so airwire DRC errors are expected.
- Generic passives still need final manufacturer MPNs before manufacturing export.
- Layout must enforce the SiWG917 antenna keepout and thermal isolation around the SHT41.
Suggested next steps:
- Set board size/stackup and move into PCB placement.
- Place U1 at the board edge with antenna keepout and U4 away from heat sources.
- Route power, buck, I2C, SWD/UART, and USB-C protection paths.
- Assign final passive MPNs and run full DRC/manufacturing checks.
Set up the PCB layout, place the components, route the board, and assign final passive MPNs.
Thought for 5 sec
I can’t continue execution because the account currently has no available ACUs.
Completed already:
- Full 46-component schematic with SiWG917 Wi‑Fi/BLE, SHT41 sensor, protected USB-C input, TPS25940 eFuse, 3.3 V buck, ESD, debug, reset, and indicators.
- Schematic electrical checks passed.
- Firmware, bring-up, specification, and regulatory files were created.
Remaining:
- Define board dimensions, stackup, and layout rules.
- Assign passive MPNs and verify sourcing.
- Place components with the SiWG917 antenna keepout and SHT41 thermal isolation.
- Route power, switching, signal, and ground paths.
- Run DRC, clear airwires, and prepare manufacturing outputs.
Execution can resume once ACUs are available.
Finalize passive BOM
Set up and place PCB
Ask layout constraints
Create manufacturing BOM
