Route this PCB layout now. Preserve the 85 x 60 mm rectangular board and keep all components top-side; only tiny component moves are acceptable if absolutely required to complete routing. Use one autoroute pass if available, then targeted manual cleanup only. First configure a 4-layer stackup if missing: top signal/components, inner1 solid GND plane, inner2 power plane, bottom signal. Prioritize in this order: (1) GND/3V3/SYS/BAT/VBUS_5V power rails and return paths, (2) TPS63001 U5 high-current loops around L3/C8/C9/C10/C11 and VIN/VOUT/L1/L2/FB, (3) USB_D_P/USB_D_N from J1 to U1 as a short matched pair, (4) LoRa RF path U2 RFO through C13 to J4 shortest 50-ohm-compatible top-layer route with good ground, (5) SPI/I2C/ePaper/remaining signals. Run DRC/ERC afterward and fix critical DRC issues if feasible. Stop after that targeted cleanup pass and report remaining airwires/issues. If direct project tools fail with missing project context, report exactly that and do not keep retrying.