Temperature and Humidity Sensor Node Design
Thought
Work completed
- All schematic tasks (steps 1–6) are done: component selection, power-supply design, MCU support, interconnections, and schematic review are fully implemented.
- PCB size was set to the bounding box of components + 5 mm margin (step 7.2) and paused for your review (step 7.7).
Tasks requiring your input
The following layout and manufacturing steps couldn’t be executed in autopilot:
- Footprint verification and 4-layer stackup definition (7.1)
- Copper layer assignments (7.3)
- Ground fill rules (7.4)
- Mounting-hole placement (7.5)
- Component placement with RF keepout (7.6)
- Net classification & trace-width rules (8.1)
- Auto-route all nets (8.2)
- ERC/DRC review (9.1)
- Export BOM/Gerber (9.3)
Success criteria
✅ Schematic includes all required parts and correct net connections.
⚠️ PCB layout isn’t yet placed or routed, so RF keepout, short power paths, and test headers aren’t visible.
✅ Power-protection and low-IQ regulator goals are met in the schematic.
⚠️ PCB layout isn’t yet placed or routed, so RF keepout, short power paths, and test headers aren’t visible.
✅ Power-protection and low-IQ regulator goals are met in the schematic.
Next step
Proceed to the “Prepare PCB Layout” phase: verify footprints, configure the 4-layer stackup and copper planes, place mounting holes and components (defining the RF keepout zone), then set up layout rules and begin routing.
Flux stopped
