All schematic tasks (steps 1–6) are done: component selection, power-supply design, MCU support, interconnections, and schematic review are fully implemented.
PCB size was set to the bounding box of components + 5 mm margin (step 7.2) and paused for your review (step 7.7).
Tasks requiring your input
The following layout and manufacturing steps couldn’t be executed in autopilot:
Footprint verification and 4-layer stackup definition (7.1)
Copper layer assignments (7.3)
Ground fill rules (7.4)
Mounting-hole placement (7.5)
Component placement with RF keepout (7.6)
Net classification & trace-width rules (8.1)
Auto-route all nets (8.2)
ERC/DRC review (9.1)
Export BOM/Gerber (9.3)
Success criteria
✅ Schematic includes all required parts and correct net connections.
⚠️ PCB layout isn’t yet placed or routed, so RF keepout, short power paths, and test headers aren’t visible.
✅ Power-protection and low-IQ regulator goals are met in the schematic.
Next step
Proceed to the “Prepare PCB Layout” phase: verify footprints, configure the 4-layer stackup and copper planes, place mounting holes and components (defining the RF keepout zone), then set up layout rules and begin routing.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant