Package/footprint: QFN-80 with exposed pad, listed as QFN50P1200X1200X80-81WN
Size: 10 × 10 mm
Terminals: 81 including exposed pad
Library part UID:273d1ce9-704d-4a24-abea-4e5b5d432af0
There are also alternate RP2350B entries, but I’d use the exact Raspberry Pi Ltd RP2350B entry above as the primary choice.
One note: you currently have comment access on this project, so I can inspect and plan, but I may not be able to modify the schematic directly unless you have edit access or fork the project. For the “start small” step, the next sensible move is to add two RP2350B instances, likely U1 and U2, then build up the required support circuitry around them: power rails, decoupling, boot/debug, clocks if needed, flash, and interconnect.
Here's a high-level mermaid block diagram of your project. Since manufacturer part numbers (MPNs) weren't provided for the components in your project, I've just included the key components and their designators:
graph TD;
A[Project] --> B[C1: Capacitor node_100uF]
A --> C[L1: Inductor node_1uH]
A --> D[R1: Resistor 500Ω]
If you obtain MPNs for the components, you can easily update the diagram by including them in each block. Would you like assistance with anything else in this project?
1y
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3
C1
Capacitance
100uF
L1
Inductance
1uH
R1
Resistance
500 Ω
2
create a high level mermaid block diagram of this project. Include key component...
Certainly! I'll create a high-level mermaid block diagram for the project. Since the manufacturer part numbers (MPN) are not provided for the components, I'll include the designators and their key properties instead.
Here’s the diagram:
Diagram
This diagram provides a simple visualization of the components and their relationships assuming that each component might connect in a series path. Let me know if you would like to make adjustments or add more specific connections!
1y
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Reviews
Documents
Documents are markdown text files which describe project goals, capture details, or even simulation outputs.
Assets
oshpark-4l.png
oshpark-4lThumbnail
[4-layer] OSHPARK Constraints
Use this template if you're planning to get your board manufactured in OSHPARK. It has the via min/max and trace width constraints already baked as global rules. #project-template #template#manufacturer-design-rules
OSHpark 4-layer stackup specs:
Top overlay or silkscreen: 1 mil thick
Top solder mask or solder resist: 1 mil thick
Top copper: 1.7 mil thick on 1 oz copper
Dielectric: 7.96 mil thick FR408HG 2113
Mid layer 1: 0.68 mil thick on 0.5 oz copper
Dielectric core: 39 mil thick FR408HR
Mid layer 2: 0.68 mil thick on 0.5 oz copper
Dielectric: 7.96 mil thick FR408HG 2113
Bottom copper: 1.7 mil thick on 1 oz copper
Bottom solder mask or solder resist: 1 mil thick Bottom overlay or silkscreen: 1 mil thick
Properties
Pricing & Availability
Distributor
Qty 1
Controls
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