RP2350B Footprint Inquiry

flux

Yes — Flux has usable RP2350B parts/footprints.
Best match found:
  • RP2350B
  • Manufacturer: Raspberry Pi Ltd
  • Package/footprint: QFN-80 with exposed pad, listed as QFN50P1200X1200X80-81WN
  • Size: 10 × 10 mm
  • Terminals: 81 including exposed pad
  • Library part UID: 273d1ce9-704d-4a24-abea-4e5b5d432af0
There are also alternate RP2350B entries, but I’d use the exact Raspberry Pi Ltd RP2350B entry above as the primary choice.
One note: you currently have comment access on this project, so I can inspect and plan, but I may not be able to modify the schematic directly unless you have edit access or fork the project. For the “start small” step, the next sensible move is to add two RP2350B instances, likely U1 and U2, then build up the required support circuitry around them: power rails, decoupling, boot/debug, clocks if needed, flash, and interconnect.
Minimum support circuitry
Check datasheet requirements
Plan schematic blocks
List power rails
epistra

epistra

yup lets do what you suggested, I just need them to have all the circuits they need also the ability to talk to eachotehr so shared grounds etc
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    oshpark-4l.png

    oshpark-4l.png

    oshpark-4lThumbnail

    [4-layer] OSHPARK Constraints

    [4-layer] OSHPARK Constraints thumbnail
    Use this template if you're planning to get your board manufactured in OSHPARK. It has the via min/max and trace width constraints already baked as global rules. #project-template #template #manufacturer-design-rules
    OSHpark 4-layer stackup specs: Top overlay or silkscreen: 1 mil thick Top solder mask or solder resist: 1 mil thick Top copper: 1.7 mil thick on 1 oz copper Dielectric: 7.96 mil thick FR408HG 2113 Mid layer 1: 0.68 mil thick on 0.5 oz copper Dielectric core: 39 mil thick FR408HR Mid layer 2: 0.68 mil thick on 0.5 oz copper Dielectric: 7.96 mil thick FR408HG 2113 Bottom copper: 1.7 mil thick on 1 oz copper Bottom solder mask or solder resist: 1 mil thick
Bottom overlay or silkscreen: 1 mil thick

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