12V Sabit Güç Devresi Tasarımı
4:51
Querying thermal resistance.
Looking for "Thermal resistance junction to ambient junction to case package PG-TO263-3 power dissipation thermal characteristics" in Infineon_IPB110P06LM_DS_v02_00_EN-1578763.pdf
Looking for "Thermal characteristics versus PCB copper area mounting recommendations TO-263 D2PAK" in Infineon_IPB110P06LM_DS_v02_00_EN-1578763.pdf
Looking for "Drain-source on-resistance RDS(on) versus temperature or typical RDS(on) at VGS -10V and -4.5V" in Infineon_IPB110P06LM_DS_v02_00_EN-1578763.pdf
Looking for "Maximum power dissipation package thermal impedance and PCB footprint notes" in Infineon_IPB110P06LM_DS_v02_00_EN-1578763.pdf
Looking for "Thermal resistance junction to ambient junction to case power dissipation PG-TO263-3" in Infineon_IPB110P06LM_DS_v02_00_EN-1578763.pdf
Looking for "RDS(on) at VGS -10V and -4.5V and temperature dependence" in Infineon_IPB110P06LM_DS_v02_00_EN-1578763.pdf
Table
| Hedef | Öneri |
|---|---|
| Minimum çalışır yaklaşım | MOSFET tab pad’i altında ve çevresinde en az 1-2 cm² bakır |
| Daha rahat termal marj | 2-4 cm² toplam bakır alan |
| Daha iyi ısı yayılımı | alt katmana çoklu termal via ile yayılım |
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