jbreidfjord-dev / TCA9555RTWR fKFn

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    24Pins_EP

    24Pins_EP

    24Pins_EP Symbol.svgDefault
    kicad_mod

    QFN50P350X450X100-25VN.kicad_mod

    QFN50P350X450X100-25VNFootprint

    TCA9555RTWR fKFn

    TCA9555RTWR fKFn thumbnail
    The Texas Instruments TCA9555 is a low-voltage 16-bit I2C and SMBus I/O expander tailored for operation in the 1.65-V to 5.5-V range, making it an ideal candidate for enhancing the I/O capabilities of general-purpose microcontrollers with limited GPIOs. Given part numbers corresponding to different package types, such as TCA9555DBR, TCA9555DBT for SSOP packages, TCA9555PWR for TSSOP packages, and TCA9555RGER, TCA9555RTWR for VQFN and WQFN packages respectively, the TCA9555 provides versatility in integration across various design layouts. This component features an open-drain active-low interrupt output, configurable slave addresses utilizing 3 address pins, and polarity inversion registers. Notably, this I/O expander exceeds the 100 mA per JESD 78, Class II latch-up performance and offers significant ESD protection. These characteristics, combined with the capability to directly drive LEDs with its latched outputs, make the TCA9555 a practical solution for applications requiring additional I/Os such as in servers, personal electronics, and industrial automation equipment, among others.

    Properties

    Integrated Circuit

    Texas Instruments

    TCA9555RTWR

    cdn2.flux.ai/copilot-datasheets/pdf-upload-eaa9805a5d5e8cab00b4bbae9e17beeefbd3a210fe3068aab9fe401199a2a7d0/a76389f87f99454e02256826a5ed2e703656d48adf402997459f2fd94389c794.pdf

    U

    creativecommons.org/licenses/by/4.0/

    QFN50P350X450X100-25VN

    RoHS, REACH, Conflict Minerals, JEDEC JESD 22, JEDEC JESD 78, JEDEC MO-150

    Component, Material, %/wt Bond Wire, Copper, 99.9884 Bond Wire, Proprietary Materials, 0.008189 Bond Wire, Iron, 0.000682 Bond Wire, Silver, 0.002047 Die Attach Adhesive, Silver, 81.099945 Die Attach Adhesive, Epoxy, 18.900057 Lead Frame, Copper, 99.25 Lead Frame, Chromium, 0.259999 Lead Frame, Tin, 0.250003 Lead Frame, Zinc, 0.240001 Lead Frame Plating, Nickel, 95.12008 Lead Frame Plating, Gold, 0.780019 Lead Frame Plating, Palladium, 4.099904 Mold Compound, Fused Silica, 90.5 Mold Compound, Carbon Black, 0.499998 Mold Compound, Epoxy, 8.999999 Semiconductor Device, Doped Silicon, 100

    Pricing & Availability

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    Qty 1

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