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    Documents are markdown text files which describe project goals, capture details, or even simulation outputs.

    Assets

    28Pins_EP-Symbol.svg

    28Pins_EP-Symbol.svg

    28Pins_EP-SymbolDefault
    QFN50P500X500X100-29N-removebg-preview.png

    QFN50P500X500X100-29N-removebg-preview.png

    QFN50P500X500X100-29N-removebg-previewThumbnail
    step

    QFN50P500X500X100-29N-3D.step

    QFN50P500X500X100-29N-3D3D Model
    kicad_mod

    QFN50P500X500X100-29N.kicad_mod

    QFN50P500X500X100-29NFootprint

    TCA9555RGER ecAV

    TCA9555RGER ecAV thumbnail
    The TCA9555 is a 16-bit I/O expander for the 1.65-V to 5.5-V Vcc operation designed by Texas Instruments. It serves to enhance the general-purpose remote I/O expansion for most microcontroller families via the I2C interface. Key features of the TCA9555 include low standby-current consumption, 5-V I/O ports, 400-Khz fast I2C bus, and ESD protection. It finds applications across personal computers, servers, routers, industrial automation equipment, and products with GPIO-limited processors.

    Properties

    Integrated Circuit

    Texas Instruments

    TCA9555RGER

    storage.googleapis.com/copilot-datasheets/pdf-upload-eaa9805a5d5e8cab00b4bbae9e17beeefbd3a210fe3068aab9fe401199a2a7d0/a76389f87f99454e02256826a5ed2e703656d48adf402997459f2fd94389c794.pdf?GoogleAccessId=graviton-mvp%40appspot.gserviceaccount.com&Expires=4860351610&Signature=RMpuIwWnGTKf%2Ft65etWfSy9sZpOlTwiM7ASFDW14MFrSumVaNNVRtrR3s7v8P7Mska1e%2BbZ78GIvhIMgo%2BgCNzo79ENMi0CDQjyo43tBJGFEreXmV79AGx080W9HG25eaOONIkyW9QxfbVc3YjvvBzJ6TgM682%2Fb7N9T1ElviQkKxyJG6AAr6sB%2B1qSqdzXYzCp50zktdLZphPuDFQXNNSVq%2B37md%2BtA4rNojhYQES%2B7GSw9fgqo52JS1qV65Wma5HAyJNrrorJfsJPotf42J1TwGwYbR2Y9KhL1W0fEFM2rMHloXXb%2FMR7qJxe68iT3f2RgWZFjpH%2Bjwi0x0%2BlNKA%3D%3D

    U

    creativecommons.org/licenses/by/4.0/

    RoHS,Green

    QFN50P500X500X100-29N

    Component, Material, %/wt Bond Wire, Copper, 99.9884 Bond Wire, Proprietary Materials, 0.008189 Bond Wire, Iron, 0.000682 Bond Wire, Silver, 0.002047 Die Attach Adhesive, Silver, 81.099945 Die Attach Adhesive, Epoxy, 18.900057 Lead Frame, Copper, 99.25 Lead Frame, Chromium, 0.259999 Lead Frame, Tin, 0.250003 Lead Frame, Zinc, 0.240001 Lead Frame Plating, Nickel, 95.12008 Lead Frame Plating, Gold, 0.780019 Lead Frame Plating, Palladium, 4.099904 Mold Compound, Fused Silica, 90.5 Mold Compound, Carbon Black, 0.499998 Mold Compound, Epoxy, 8.999999 Semiconductor Device, Doped Silicon, 100

    Pricing & Availability

    Distributor

    Qty 1

    Controls