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J3
R3
Resistance
10kΩ
R1
Resistance
10kΩ
R4
Resistance
100 Ω
R5
Resistance
10kΩ
R2
Resistance
100 Ω
PP5V0
INT_ADC_DRDY
PG_PP5V0
USBC2.0_D_N
SPI_MISO
I2C_SDA
PG_PP5V0
PP3V3
C2
Manufacturer Part Number
OPT
PP3V3
SPI_SCK
USBC2.0_D_P
I2C_SCL
PP3V3_SPI
LOAD_CELL_A1_P
I2C_SCL
PP3V3
PP12V0
SPI_SCK
PP5V0
GPIO_SW1
LOAD_CELL_A1_P
I2C_SCL
VOS
INT_ADC_DRDY
PP5V0
PP3V3
LOAD_CELL_AI_N
C8
Capacitance
13pF
PP5V0
GPIO_SW2
GPIO_SW1
I2C_SDA
GPIO_SW2
SPI_MISO
PP5V0
C6
Capacitance
1.2pF
PP5V0
PP12V0
SPI_MOSI
LOAD_CELL_AI_N
I2C_SDA
I2C_SDA
I2C_SCL
SPI_CS
VOS
PP3V3
PP3V3
SPI_CS
SPI_MOSI
C4
Capacitance
13pF
C7
Capacitance
1uF
C13
Capacitance
1uF
C23
Capacitance
.1uF
C9
Capacitance
1uF
C18
Capacitance
1uF
C20
Capacitance
1uF
C10
Capacitance
1uF
C3
Capacitance
1uF
C26
Capacitance
4.7µF
C15
Capacitance
1uF
Y1
C5
Capacitance
1uF
C28
Capacitance
.1uF
C12
Capacitance
1uF
C11
Capacitance
1uF
C24
Capacitance
1uF
C31
Capacitance
.1uF
J4
H4
J5
H1
C25
Capacitance
22uF
IC1
U2
H2
H3
R7
Resistance
100kΩ
L1
Inductance
2.2nH
R8
Resistance
953kΩ
C22
Capacitance
10uF
J1
C21
Capacitance
10uF
C17
Capacitance
10uF
C29
Capacitance
10uF
C27
Capacitance
10uF
R6
Resistance
180kΩ
C30
Capacitance
10uF
C1
Capacitance
10uF
L2
Inductance
2.2nH
C19
Capacitance
10uF
MCU_TXD
U1
End of Life
U3
Manufacturer Part Number
TPS62130ARGTR
Y2
J2
L4
MCU_RXD
L3
Inductance
2.2uH
MCU_BOOT
Project Specification
Version: 0.1.0 Date: ... Author: ... Status: ... Tags: ...

1. Executive Summary
What board we're building and the intended outcome in one paragraph. ...
2. Goals and Non-Goals
What must be true in this rev, and what is explicitly out of scope. ...
2.1 Goals
...
2.2 Non-Goals
...
3. System Overview
High-level description of the system and how the board fits into it. ...
3.1 Block Diagram
A space for a simple block diagram (power + data paths). ...
4. Requirements
What the design must do (behaviorally and electrically), independent of implementation details. ...
4.1 Functional Requirements
...
4.2 Electrical Requirements
Power input, rails, currents, interfaces, sensing accuracy, etc. ...
4.3 Environmental and Reliability Requirements
Operating ranges, expected lifetime, handling constraints, safety/compliance. ...
5. Constraints
Hard limits that shape the design choices. ...
5.1 Mechanical Constraints
Size, mounting, connector access, enclosure interactions. ...
5.2 Power and Thermal Constraints
Power source limits, dissipation ceilings, heat-sensitive components. ...
5.3 Layout / Implementation Constraints
High-level layout rules (keepouts, grounding intent, routing classes), without detailed PCB guidance. ...
5.4 Cost and Sourcing Constraints
Target cost range, availability requirements, preferred vendors/alternates policy. ...
6. Assumptions and Dependencies
What we assume is true, and what the design depends on (parts, standards, external systems). ...
7. Validation Criteria
What “done” means in terms of checks and evidence (not task lists). ...
7.1 Acceptance Tests
...
7.2 Review Checklist
...
Appendix (Optional)
Any supporting urls, analysis, datasets, or taxonomy notes that informed this spec. ...
  • 1. Executive Summary

  • 2. Goals and Non-Goals

  • 2.1 Goals

  • 2.2 Non-Goals

  • 3. System Overview

  • 3.1 Block Diagram

  • 4. Requirements

  • 4.1 Functional Requirements

  • 4.2 Electrical Requirements

  • 4.3 Environmental and Reliability Requirements

  • 5. Constraints

  • 5.1 Mechanical Constraints

  • 5.2 Power and Thermal Constraints

  • 5.3 Layout / Implementation Constraints

  • 5.4 Cost and Sourcing Constraints

  • 6. Assumptions and Dependencies

  • 7. Validation Criteria

  • 7.1 Acceptance Tests

  • 7.2 Review Checklist

  • Appendix (Optional)