Schematic Design Review


flux

The dialog is blocking the UI export because 12 generic resistors/capacitors have no Manufacturer Part Number (MPN):
R1, R2, R5, C1, C2, C3, C5, C6, C7, C8, VS1, VS2
The PCB geometry itself is exportable—the direct Gerber exporter succeeded and the archive is valid. The UI’s manufacturing gate also treats missing sourcing data as an error, even though MPNs are not required to fabricate a bare PCB.
  • Bare PCB only: select Export with errors; the Gerbers are valid.
  • PCB assembly: assign real MPNs to those 12 generic parts before exporting the BOM/placement files.
My earlier check excluded the MPN manufacturing review, which is why I incorrectly said there were no blockers.
well fix the MPN's then.

flux

I’ll source exact purchasable resistor and capacitor MPNs matching each existing value, voltage rating, dielectric, and footprint, assign them without changing the PCB geometry, then rerun the manufacturing review.

flux

All 12 generic passives now have verified MPNs matching their existing footprints and electrical ratings. I’m rerunning the same manufacturing gate that blocked the export, plus the PCB checks.

flux

The manufacturing metadata is updated; the final review is checking for any remaining blockers.

flux

Fixed all 12 missing MPNs with footprint- and rating-compatible Yageo/Murata parts.
The manufacturing review now reports no errors, warnings, or open blockers. Close and reopen the export dialog if it is still showing the cached warning.

Power Budget
Current PCB completion — 2026-09-21 23:18 UTC
This section supersedes the historical incomplete PCB handoff below. Selected parts and logical topology are unchanged.

Table


Item requested in continuationStatusEvidence
Separate F1/D1 locallyCompletedResolve-overlaps moved only D1 by 0.50 mm; final overlap check clear
Clear stale/redundant copperCompletedRemoved raw-VBUS stub Trace 106f; fresh routing-state report has zero redundant traces
Route both raw VBUS airwiresCompletedBoth routed at 0.254 mm; zero airwires board-wide
Protected 5vdc power pathCompleted/verifiedExisting new F1→VIN/C3 copper retained at 0.5 mm; zero airwires
Very short TVS ground returnCompletedD1 anode explicitly solid-connected to GND fill; local GND stitch added at (−22.85, 9.416) mm using Through-hole via configuration, direct fill connection
Final electrical/layout checksCompletedFresh ERC/DRC at 23:18:05.874 UTC: no Errors; only prior board-density and C3 decoupling-loop Warnings
Exact final component coordinates
Coordinates are millimeters from board origin; rotations are CCW; both parts remain on Top.

Table


ComponentXYRotation
F1−20.13.8270°
D1−19.82229.4157180°
Only D1 changed position in this continuation; F1 and all USB support passives, the connector, and unrelated components retained their starting positions. D1's anode pad center is approximately (−21.5622, 9.4157) mm; the ground stitch center is 1.288 mm away, approximately 0.588 mm beyond the pad edge. Solid ground copper avoids thermal-spoke inductance.
The raw VBUS branch from the nearby USB contact to D1 is approximately 1.91 mm routed centerline length. The second VBUS contact uses a 22.83 mm top-layer route around the connector pad/anchor obstacles to preserve unrelated copper. Its 0.254 mm width on the existing 35 µm copper gives approximately 44 mΩ at room temperature (ρ=1.72×10⁻⁸ Ω·m), or 24 mV drop / 13 mW if carrying the entire provisional 0.533 A load. Main D1→F1 and protected-rail traces remain 0.5 mm. These are DC estimates, not assembled ESD certification.
Fresh requested checks: 0 airwires, 0 F1/D1 or other component overlaps, 0 overlapping-copper/trace findings, 0 redundant traces, 0 dangling traces, 0 out-of-bounds findings, 0 missing-footprint findings, 0 under-connected-via findings. Read-back confirms USB_VBUS_RAW = both USB VBUS pins + F1:P1 + D1:K, while 5vdc = F1:P2 + regulator VIN + C3:P1. There is no logical bypass; copper checks find no short between those nets. Existing power-budget, USB-source and AMS1117-headroom qualifications below still apply; PCB routing completion does not resolve them.
Existing loads and sizing envelope

Table


LoadTypical operating currentPeak / design allocation
ESP-01S / ESP826650–56 mA RX; 120–170 mA TX500 mA provisional supply allocation, NOT a verified maximum
MAX3232E, one active transmitter0.3 mA no-load typical1 mA no-load maximum plus 20 mA provisional loaded/dynamic allowance
R1/R2 10 kΩ pull-upsapproximately zero when high0.66 mA with both low
Capacitors, jumpers, socketszero DC idealcapacitor charging inrush not included in steady-state peak
AMS1117 ground current5 mA11 mA
ESP module RX/TX values are specified typical; the module manual leaves maximum cells blank. MAX3232E no-load current is 0.3 mA typical, 1 mA maximum; loaded supply current is not specified in the consulted source. One transmitter is connected; the other is unused. Its 60 mA short-circuit output limit is not an input-current specification and is not substituted for supply current.
Typical TX/no-load total = 170 + 0.3 + 5 = 175.3 mA at USB VBUS. Conservative design allocation = 500 + 21 + 0.66 + 11 = 532.66 mA. The 3.3 V rail allocation is 521.66 mA. This is an engineering envelope, not a datasheet-guaranteed peak; verify radio startup, TX bursts, RS-232 load and inrush on hardware. ESP 500 mA source-capability evidence lookups failed with evidence_location_invalid for two Espressif sources; that number remains explicitly unverified.
LDO input current approximately equals output current plus ground current; do not scale by 3.3/5. PTC hold-current target ≥1.5 × 532.66 mA = 798.99 mA, before ambient derating. A 1 A low-resistance PTC is the candidate class; select exact part only after this budget.
AMS1117 headroom and heat
AMS1117 quiescent current is 5/11 mA typical/max; dropout maximum is 1.3 V at 0.8 A. Use that conservative dropout bound rather than assuming a smaller guaranteed value at this load.
At nominal 5 V, typical TX heat including ground current = (5−3.3)×0.1703 + 5×0.005 = 0.315 W. At a conservative 5.5 V input: 0.402 W typical TX, and 1.208 W if the full 521.66 mA allocation were sustained. SOT-223 θJA is nominally 90°C/W and depends strongly on copper area; maximum junction temperature is 125°C. Approximate rises at 90°C/W: 36°C typical, 109°C sustained allocation. Burst allocation is not safe as continuous load without thermal verification. Existing regulator is retained, not thermally certified by this change.
At 4.75 V connector VBUS, only 150 mV remains above 3.3+1.3 V before PTC and copper losses. At a drooping 4.5 V connector, headroom already fails by 100 mV before protection. Low-resistance PTC minimizes additional drop but cannot fix existing LDO dropout. Robust operation over all USB cable/source conditions requires a future lower-dropout regulator or tighter input-source specification.
USB-C constraints
Independent 5.1 kΩ Rd only identifies a sink; this board has no CC-advertisement measurement or USB enumeration. Do not infer permission for 1.5 A/3 A, or automatic 500 mA entitlement on every default-current USB source. The 532.66 mA allocation exceeds 500 mA by 32.66 mA. A PTC is slow fault protection, not a USB current limiter or negotiator. Use a known suitable 5 V power source; universal default-current compliance remains unresolved without current detection/management. CC current comes from the source CC circuitry, not the VBUS fuse budget.
Scope
Selected protection and margin
  • F1: Littelfuse 1206L110/16WR, two-pad 1206 (3216 metric) library footprint. Manufacturer web datasheet table reports 1.1 A hold, 2.2 A trip, 16 V maximum, 0.06 Ω initial minimum and 0.21 Ω post-trip/reflow maximum. These were read through web search; repeated structured datasheet queries returned insufficient evidence, so citation-grade verification remains unresolved. Do not mistake 0.06 Ω minimum for guaranteed operating resistance. At 20°C, hold margin above 532.66 mA is 567.34 mA / 106.5%, or 2.065× the allocation; 37.7% above the 1.5× sizing target. Ambient derating still applies and high-temperature operation is not qualified.
  • At 0.21 Ω and 532.66 mA, PTC drop is 111.9 mV and heat 59.6 mW. At 4.75 V raw input, conservative LDO dropout margin is only 38.1 mV before PCB/contact losses. This is not robust headroom at minimum USB voltage. Hot PTC resistance may be higher.
  • D1: PANJIT SMF6.0A_R1_00001, unidirectional, SOD-123FL two-pad footprint. 6 V stand-off, breakdown 6.7–7.4 V at 10 mA, maximum clamp 10.3 V at 19.4 A, leakage 100 µA at stand-off. Peak pulse rating is 200 W at 25°C. Cathode band and SOD-123FL case are documented. The family electrical table covers SMF6.0A, but exact packing suffix is not independently confirmed by the consulted packing table.
  • A nominal 5.0 V stand-off TVS was deliberately not selected: 6 V stand-off allows normal USB high-line operation without specified avalanche conduction. The 10.3 V pulse clamp is below AMS1117's 15 V absolute input limit, but parasitic overshoot, negative-pulse behavior and existing C3's unspecified voltage rating still need validation. This is not a certified surge rating for the assembled board.
  • Espressif's manufacturer web guideline corroborates a 500 mA recommended supply capability; the structured evidence service remains broken for this source. It is a supply-sizing recommendation, not a measured worst-case peak limit.
Historical initial integration status (superseded for PCB completion above)
  1. Power-budget file: completed; fully guaranteed peak budget: failed/unresolved. Cited typical data and LDO limits are available; loaded MAX3232E maximum and actual ESP peak remain unbounded. Hardware measurement is required. USB default-current and low-input dropout limitations are not repaired by a fuse.
  2. Library part addition: completed. F1 and D1 have real two-terminal footprints. PTC citation-grade verification and TVS packing suffix remain unresolved as above.
  3. Logical rewiring: completed and read back. USB_VBUS_RAW contains exactly usb power:VBUS, usb power:VBUS__1, F1:P1 and D1:K. Protected 5vdc contains exactly F1:P2, voltage reg:VIN and C3:P1. D1:A joins GND. No logical fuse bypass exists.
  4. CC and no-connect preservation: completed. CC1/R3 and CC2/R4 unchanged; all six D+/D−/SBU contacts remain intentionally no-connect.
  5. Schematic placement: unattempted/blocked. No schematic-arrangement mutation capability is exposed in this delegated tool set. New symbols remain in their automatic insertion positions, not beside USB; net names are correct.
  6. PCB integration: failed/incomplete. Only F1/D1 were moved. D1=(-20.1,9.0) mm, 180°; F1=(-20.1,3.8) mm, 270°, top side. Original 5vdc copper was removed to eliminate a physical bypass; unrelated copper was preserved. D1:K→F1:P1 and F1:P2→regulator VIN/C3 were routed at 0.5 mm. One router-created redundant trace was removed. GND connectivity has no airwire, but extremely short TVS return has not been geometrically qualified.
Initial read-only DRC/ERC review (2026-09-21 23:07 UTC):
Raw VBUS routing at 0.5 mm failed no-path; a 0.3 mm retry was rejected by the transaction's airwire checks. Stop repeated retries: next engineer should inspect the connector escape and add a controlled short neckdown/fanout with a width justified for 0.533 A, then route raw VBUS. F1/D1 overlap persisted after two spacing corrections despite apparent 2D separation; inspect footprint/model body bounds before moving again or changing rules. Do not fabricate this partial layout: USB input is physically disconnected until those two airwires are completed.
Add resettable series protection and connector-side unidirectional transient suppression while preserving existing CC, no-connect pins, regulator and unrelated routing. Raw-side TVS is for ESD/transients, not sustained overvoltage; a raw-side TVS short is upstream of this PTC and relies on source current limiting. No PD, sustained-overvoltage disconnect, reverse-current blocking or thermal redesign is implied.
  • Current PCB completion — 2026-09-21 23:18 UTC

  • Exact final component coordinates

  • Existing loads and sizing envelope

  • AMS1117 headroom and heat

  • USB-C constraints

  • Scope

  • Selected protection and margin

  • Historical initial integration status (superseded for PCB completion above)