Attachment Access Issue


The board is fabrication-ready: all nets routed with 0 airwires, dual-layer GND pours added with 28 stitching vias, and final ERC/DRC shows zero errors or warnings.
Manufacturing files generated:
  • Gerber/drill package
  • BOM variants, including JLCPCB and PCBWay
  • Pick-and-place files
  • IPC-D-356 electrical-test netlist
Open items
  • None blocking fabrication.
  • Visually review the Gerbers and confirm gas-module footprint dimensions before ordering.
Suggested next steps
  1. Upload the Gerber ZIP to your chosen fabricator.
  2. Verify drill sizes and the 1.6 mm gas-module pin pitch in its viewer.
  3. Use the BOM/CPL files only if assembly service is required.
the pin alignment of the gas sensors doent seem right - the 5 pin side shouldnt be centred - see attached data sheet
I’ll compare the live ZE07-H2 footprint against the datasheet’s mechanical drawing, correct the offset pin-row geometry, then verify pad numbering, clearances, routing, and DRC.
The datasheet confirms the five-pin group is pins 1–5, but its offset dimensions are embedded in the drawing rather than searchable text. I’m having the drawing and live footprint compared geometrically before changing copper, so the correction is not based on a guess.
I confirmed the datasheet identifies the five-pin group as pins 1–5, but the critical offset dimensions are embedded graphically and were not recoverable from PDF text/OCR. A dedicated footprint-correction executor completed its visual comparison and correction task, but I could not retrieve and independently reconcile its final report or run live post-change geometry/DRC checks.
Still required
  • Confirm the executor’s exact extracted dimensions and resulting ZE07-H2 pad coordinates.
  • Verify pin numbering, five-pin offset, row spacing, pitch, and module orientation against the drawing.
  • Check whether ZE15-CO needs the same correction.
  • Run final ERC/DRC and confirm zero airwires.
  • Regenerate the manufacturing files because the previous exports predate this footprint work.
Execution stopped because your ACUs ran out.
Received notification from "ZE07-H2 Footprint Fix" that it finished — picking the work back up.
The ZE07-H2 footprint-fix executor has finished, but I cannot access its report or inspect the modified footprint in this turn. Therefore, I cannot safely claim that the five-pin offset, pad numbering, routing, or DRC is correct.
The project remains at the post-footprint-edit stage. Before fabrication, it still needs:
  • Reconcile the executor’s exact ZE07-H2 pad coordinates against the attached datasheet.
  • Verify pins 1–5 form the correctly offset five-pin side and pins 6–15 remain correctly aligned.
  • Check whether the ZE15-CO uses identical mechanical geometry.
  • Re-run routing/airwire checks and full ERC/DRC.
  • Regenerate Gerbers, drill files, IPC-D-356, and placement outputs.
Do not use the previously exported manufacturing package; it predates the footprint correction. Execution stopped because your ACUs ran out.
Verify corrected footprint
Check ZE15 compatibility
Review remaining errors
Document fabrication hold

J_H2_MODULE
J_CO_MODULE
C_SHT3X_OPTIONAL
Capacitance
0.1uF
J_BME
J_SPS30
C_CO_OPTIONAL
Capacitance
0.1uF
C_SPS30_OPTIONAL
Capacitance
0.1uF
J_SHT3X
C_BME_OPTIONAL
Capacitance
0.1uF
C_H2_OPTIONAL
Capacitance
0.1uF
J_ARDUINO
TP_3V3
TP_GND
R_SCL_OPTIONAL
Resistance
4.7kΩ
R_SDA_OPTIONAL
Resistance
4.7kΩ
TP_SCL
TP_SDA

Arduino Multi-Sensor Interconnect

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