Audio Control Board Design

Worked for 3 mins 20 sec
Thought for 23 sec — Assessing wire connections
Reading schematic details for J1, U1, U2 and 8 more.
Thought for 39 sec — Considering debug options
Added D3 and D4.
Thought for 3 sec — Considering wiring options
Connected J1:VBUS, J1:VBUS__1, U2:IN and 30 more.
Thought for 14 sec — Continuing configuration process
Connected U2:OUT, C3:P1, U3:VIN1 and 24 more.
Thought for 12 sec
Connected U3:SW, L1:1, L1:2 and 18 more.
Thought for 13 sec
Connected U1:VBATT, U1:ULP_IO_VDD, U1:IOVDD and 31 more.
Thought for 18 sec
Connected U4:VDD, C15:P1, R9:P2 and 14 more.
Thought for 17 sec
Connected U1:POC_OUT, R13:P1, U1:POC_IN and 23 more.
Thought for 15 sec — Debugging header pins
Connected J2:1, J2:3, J2:5 and 9 more.
Thought for 11 sec
Wired pins.
Thought for 14 sec
Updated GND, VBUS_RAW, VBUS_PROT and 5 more.
Thought for 13 sec
Referenced guidance.
Reading project docs.
Getting a schematic overview.
Thought for 14 sec — Updating tasks
5/6 Create firmware/regulatory/bring-up project files

Rename project, create specification, and record initial requirements/power budget

Select library parts for MCU, T/RH sensor, USB-C input, regulator, and protection

Add main components and supporting passives to the schematic

Wire USB-C power/protection, 3.3 V rail, MCU boot/debug, USB data, I2C sensor, and indicators

Create firmware/regulatory/bring-up project files

Run schematic/design checks and fix actionable issues

Thought for a moment
Planning firmware documentation
I need to create documentation for the firmware starter. Since the SIWG917 isn’t an ESP32, there’s no common Arduino
halimhalim

halimhalim

بأستخدام tda2050 وtm2313 اشئ لوحة الكترونية لتحكم بالصوت مع استعمال الميكروكنترولر atmel 328p

flux

لم يتم تنفيذ أي تعديلات جديدة بسبب عدم توفر ACUs حاليًا. المشروع الحالي ما يزال لوحة حساس حرارة ورطوبة USB‑C مع Wi‑Fi/BLE.
المتبقي لإنشاء لوحة التحكم بالصوت:
  • تأكيد رقم دارة الصوت: هل المقصود PT2313 بدل TM2313؟
  • تحديد عدد قنوات ومقدار قدرة خرج TDA2050، وجهد/نوع التغذية، وممانعة السماعات.
  • تصميم وربط ATmega328P مع دارة التحكم بالصوت ومرحلة القدرة والحماية والتبريد.
  • تنفيذ المخطط، ثم فحص ERC وتصميم الـPCB والتحقق الحراري.
بعد توفر ACUs وتأكيد البيانات أعلاه يمكن متابعة التنفيذ.
Sign up to send

Files

Schematic

Layout

Preview

U2
D1
J1
U1
R1
Resistance
5.1kΩ
R13
Resistance
100kΩ
R4
Resistance
400kΩ
R7
Resistance
100kΩ
R10
Resistance
10kΩ
R3
Resistance
909Ω
R14
Resistance
100Ω
R2
Resistance
5.1kΩ
R8
Resistance
100kΩ
R9
Resistance
10kΩ
R6
Resistance
100kΩ
R11
Resistance
1kΩ
R12
Resistance
10kΩ
R5
Resistance
261kΩ
C4
Capacitance
10µF
C17
Capacitance
1nF
C7
Capacitance
100nF
C3
Capacitance
10µF
C5
Capacitance
10µF
C13
Capacitance
100nF
C2
Capacitance
10nF
C15
Capacitance
100nF
C8
Capacitance
1µF
C14
Capacitance
1µF
C9
Capacitance
10µF
C10
Capacitance
100nF
C1
Capacitance
1µF
C16
Capacitance
10nF
C6
Capacitance
10µF
C12
Capacitance
100nF
C11
Capacitance
100nF
U3
D2
U4
D4
L1
D3
SW1
SW2
LED1
J2
Project Specification — USB-C WiFi BLE TH Sensor
Project Overview
Status: Draft schematic in progress.
A consumer USB-C powered temperature and relative humidity sensor node with Wi-Fi and Bluetooth Low Energy connectivity. The board uses a protected USB-C 5 V sink input, local 3.3 V regulation, a low-power Wi-Fi/BLE MCU module, and a digital I2C T/RH sensor.
Intended Use
  • Indoor consumer environmental monitoring node.
  • Powered from USB-C 5 V chargers, hubs, or ports.
  • Designed for prototype-to-production learning; not medical, industrial safety, or outdoor/weatherproof use unless later specified.
What the Device Should Do
  • Measure ambient temperature and relative humidity.
  • Connect over 2.4 GHz 802.11 b/g/n Wi-Fi.
  • Support BLE 5.x provisioning or local telemetry.
  • Power from USB-C default 5 V sources.
  • Survive common consumer input faults with reverse-current, overvoltage, undervoltage, and overcurrent protection.
Main Features
  • USB-C receptacle configured as sink-only with independent CC1/CC2 5.1 kΩ Rd resistors.
  • Protected 5 V input sized for 0.5–3 A capable sources, while the node itself is expected to draw well below 500 mA average.
  • 3.3 V logic rail for MCU and sensor.
  • Native USB data/programming path where supported by the selected MCU.
  • Boot/reset controls, debug/programming access, and status LED.
System Architecture
Diagram



  
    
  
  
    
  









I2C

USB D+/D-






USB-C Receptacle node_5V Sink
VBUS Protection OVP UVLO OCP Reverse Blocking
3.3V Regulator
WiFi/BLE MCU Module
Digital T/RH Sensor
Status LED
Hardware Subsystems
  • Power input: USB-C receptacle, CC pull-downs, VBUS ESD/TVS, protected power switch/eFuse or load switch with OVP/UVLO/OCP/reverse-current blocking.
  • Regulation: 5 V to 3.3 V rail sized for Wi-Fi transmit current peaks.
  • Compute/radio: certified ESP32-family module preferred to avoid custom RF matching and simplify regulatory work.
  • Sensor: digital I2C temperature/humidity sensor with local decoupling and one shared I2C pull-up pair.
  • User/debug: reset and boot controls, status LED, USB programming, optional exposed test/debug header.
Interfaces and Connections
  • External: USB-C 5 V power and USB 2.0 D+/D- for programming/debug.
  • Internal: 3.3 V rail, GND, I2C SDA/SCL, boot/reset, status LED GPIO.
  • RF: integrated 2.4 GHz antenna module; PCB layout must provide the module antenna keepout.
Power and Runtime Expectations
  • Source: USB-C 5 V default power only; no battery in this revision.
  • Source capability planning: tolerate 0.5 A, 1.5 A, and 3 A capable USB-C sources. Do not assume the device may draw 3 A unless CC current advertisement is measured/implemented.
  • Low-power behavior: firmware should sleep between samples and radio transmissions, but USB-powered operation makes absolute sleep current less critical than thermal and regulatory behavior.
Power Tree and Power Budget

Table

RailLoadSleepTypical activePeak
3.3 VWi-Fi/BLE MCU module~10–100 µA deep sleep~80–240 mA radio active~500 mA short Wi-Fi TX burst
3.3 VT/RH sensor<1 µA standby~0.5–1 mA measuring~1 mA
3.3 VStatus LED0 mA off~2 mA on~5 mA configured max
3.3 VPull-ups/leakage~1–2 mA worst when lines lownegligible average~1.4 mA for two 4.7 kΩ pull-ups low
Estimated 3.3 V rail sizing target: 250 mA typical active, 510 mA transient peak. For an LDO from 5 V, input current is approximately output current; thermal at 250 mA is about (5.25 V - 3.3 V) × 0.25 A = 0.49 W, so a small SOT-23 LDO may be marginal during sustained Wi-Fi. Preferred choices are a high-current low-Iq regulator in a thermally capable package or a quiet buck regulator if sustained radio current/thermal limits demand it.
Manufacturing and Assembly Expectations
  • Default assembly: SMD, production-intent consumer PCB.
  • Use stocked, non-EOL parts where available.
  • Add test points for 5 V protected rail, 3.3 V, GND, reset/boot, and I2C if space permits.
Firmware-Relevant Hardware Requirements
  • Define actual GPIO pins for I2C SDA/SCL and status LED.
  • Provide USB programming or serial/JTAG path.
  • Support Wi-Fi + BLE provisioning, periodic sensor reads, and telemetry output.
  • Include boot/reset access for field recovery.
Physical Design Expectations
  • ESP32 module antenna must be placed at board edge with no copper/traces/components in the keepout on all layers.
  • Sensor should be isolated from regulator/MCU heat sources and exposed to ambient airflow.
  • USB-C connector should be board-edge mounted and mechanically reinforced.
Important Design Decisions
  • Use an ESP32-family certified module rather than a bare RF SoC.
  • Use a digital I2C humidity/temperature sensor.
  • Use USB-C sink-only 5 V; no USB-PD negotiation in this revision.
  • Include a protected VBUS front end instead of relying on a fuse alone.
Assumptions
  • Indoor consumer use, ambient operating range roughly 0–50 °C unless later expanded.
  • No enclosure dimensions or board size provided yet.
  • No cloud protocol specified; firmware examples will print readings and include Wi-Fi/BLE placeholders.
Change Notes
  • Initial requirements captured from user request on 2026-07-17.

  • Project Overview

  • Intended Use

  • What the Device Should Do

  • Main Features

  • System Architecture

  • Hardware Subsystems

  • Interfaces and Connections

  • Power and Runtime Expectations

  • Power Tree and Power Budget

  • Manufacturing and Assembly Expectations

  • Firmware-Relevant Hardware Requirements

  • Physical Design Expectations

  • Important Design Decisions

  • Assumptions

  • Change Notes