Project N1201/2 8A Update

Worked for 41 sec

flux

Regenerated from the current DRC-clean layout:

n12012-8a-gerbers

n12012-8a-bom

Designator	Quantity	Element UIDs	Part UID	Specification	Part Type	Role Details	Manufacturer Part Number	Manufacturer Name	Preferred Distributors	Voltage Rating	Resistance	Resistor Type	Tolerance	Capacitance	Capacitor Type	Power Rating	Inductance	Inductor Type	Package	Designator Prefix
C1B,C3B	2	314c89b0-1023-4ce8-b8d4-3962061501ff,cc1d5c56-17e6-4143-b411-72939996daff	46707925-236f-106b-e676-afa2757aa1d6	Non-Polarized Capacitor, 11uF, CP_Radial_D18.0mm_P7.50mm	Non-Polarized Capacitor	Solen PB1100 11uF 400V film capacitor, physical parallel half of C3 21uF position,Solen PB1100 11uF 400V film capacitor, physical parallel half of C1 21uF position	PB1100	Solen		400V			%	11uF	Film				CP_Radial_D18.0mm_P7.50mm	C
C1,C3	2	7b187c80-a127-4c71-934c-bf656b521d82,f700680d-f624-48a9-b4a9-c1286856b674	46707925-236f-106b-e676-afa2757aa1d6	Non-Polarized Capacitor, 10uF, CP_Radial_D18.0mm_P7.50mm	Non-Polarized Capacitor	Dayton Audio PMPC-10 10uF 250V film capacitor, physical parallel half of former C1 21uF position with C1B/Solen PB1100,Dayton Audio PMPC-10 10uF 250V film capacitor, physical parallel half of former C3 21uF position with C3B/Solen PB1100	PMPC-10	Dayton Audio		250V			%	10uF	Film				CP_Radial_D18.0mm_P7.50mm	C
C2	1	97a1503e-35f1-40c8-948c-a4554168df3a	46707925-236f-106b-e676-afa2757aa1d6	Non-Polarized Capacitor, 16uF, CP_Radial_D18.0mm_P7.50mm	Non-Polarized Capacitor	Solen 16uF 400V polypropylene capacitor, Parts Express #027-578	027-578	Solen		400V			%	16uF	Film				CP_Radial_D18.0mm_P7.50mm	C
C4	1	9c1f604f-e1b3-4fac-898d-d7ba9f462b52	46707925-236f-106b-e676-afa2757aa1d6	Non-Polarized Capacitor, 6.2uF, CP_Radial_D18.0mm_P7.50mm	Non-Polarized Capacitor	Dayton Audio PMPC-6.2 6.2uF 250V precision audio capacitor used for nominal 6uF position	PMPC-6.2	Dayton Audio		250V			%	6.2uF	Film				CP_Radial_D18.0mm_P7.50mm	C
L1	1	c023da19-7c5c-4a87-af3a-c031b6b68851	181603df-1db7-f7c0-4144-8e265bcbee99	Inductor, 0.3mH, SMD_0603_1608Metric	Inductor	Dayton Audio LW14-30, 0.30mH, 14 AWG air-core coil; nominal body diameter 47 mm and height 28.5 mm.	LW14-30	Dayton Audio									0.3mH	Fixed	SMD_0603_1608Metric	L
L2	1	01529f73-0e61-475b-b2d6-99e906a6f7fc	181603df-1db7-f7c0-4144-8e265bcbee99	Inductor, 2.7mH, SMD_0603_1608Metric	Inductor	Jantzen Audio 2.7 mH 15 AWG air-core inductor; Parts Express Part #255-434; 0.59 ohm DCR; 60 x 60 mm body	000-1802	Jantzen Audio	Parts Express				3%				2.7mH	15 AWG air-core crossover inductor	SMD_0603_1608Metric	L
L3	1	dcfdba6e-a0a6-4adf-9fb5-bfffc2ed449e	181603df-1db7-f7c0-4144-8e265bcbee99	Inductor, 0.80mH, SMD_0603_1608Metric	Inductor	Dayton Audio LW14-80, 0.80mH, 14 AWG air-core coil; nominal body diameter 59 mm and height 27 mm.	LW14-80	Dayton Audio									0.80mH	Fixed	SMD_0603_1608Metric	L
R1,R3	2	54394cda-a13a-4622-9ca5-acf6e848112f,600ce474-c9d0-4d1a-b663-0e4f07ab2356	b67f50a9-ae5e-10ea-9c3c-d377e2ab3b2d	Resistor, 2.0ohm, H_AXIAL-P25.4_D_3.2	Resistor	Dayton Audio DNR-2.0 2 Ohm 10W non-inductive wirewound resistor	DNR-2.0	Dayton Audio		V	2.0ohm	Wirewound	%			10W			H_AXIAL-P25.4_D_3.2	R
R2,R5	2	2f4d238e-9a4a-4d1f-9118-15a8b4f3714a,5d97e226-c50c-49e4-88d9-024308e607bb	b67f50a9-ae5e-10ea-9c3c-d377e2ab3b2d	Resistor, 3.0ohm, H_AXIAL-P25.4_D_3.2	Resistor	Dayton Audio DNR-3.0 3 Ohm 10W Precision Audio Grade Resistor, sourced at Parts Express	DNR-3.0	Dayton Audio		V	3.0ohm	Wirewound	%			10W			H_AXIAL-P25.4_D_3.2	R
R4	1	66e412b3-043e-4517-80be-a388f4ddf6de	b67f50a9-ae5e-10ea-9c3c-d377e2ab3b2d	Resistor, 3.9ohm, H_AXIAL-P25.4_D_3.2	Resistor	Jantzen Audio 3.90 Ohm 10W Audio-Grade Superes Resistor, Parts Express #255-948	255-948	Jantzen Audio		V	3.9ohm	Wirewound	%			10W			H_AXIAL-P25.4_D_3.2	R
R6	1	8ec0e71d-6992-48cb-86d7-54f3ade7a0e8	b67f50a9-ae5e-10ea-9c3c-d377e2ab3b2d	Resistor, 30ohm, H_AXIAL-P25.4_D_3.2	Resistor	Dayton Audio DNR-30 30 Ohm 10W Wirewound Resistor, sourced at Parts Express	DNR-30	Dayton Audio		V	30ohm	Wirewound	%			10W			H_AXIAL-P25.4_D_3.2	R

n12012-8a-bom-pcbway

Item #	Designator	Qty	Manufacturer	Mfg Part #	Description / Value	Package/Footprint
1	C1B,C3B	2	Solen	PB1100	Non-Polarized Capacitor, 11uF, CP_Radial_D18.0mm_P7.50mm	CP_Radial_D18.0mm_P7.50mm
2	C1,C3	2	Dayton Audio	PMPC-10	Non-Polarized Capacitor, 10uF, CP_Radial_D18.0mm_P7.50mm	CP_Radial_D18.0mm_P7.50mm
3	C2	1	Solen	027-578	Non-Polarized Capacitor, 16uF, CP_Radial_D18.0mm_P7.50mm	CP_Radial_D18.0mm_P7.50mm
4	C4	1	Dayton Audio	PMPC-6.2	Non-Polarized Capacitor, 6.2uF, CP_Radial_D18.0mm_P7.50mm	CP_Radial_D18.0mm_P7.50mm
5	L1	1	Dayton Audio	LW14-30	Inductor, 0.3mH, SMD_0603_1608Metric	SMD_0603_1608Metric
6	L2	1	Jantzen Audio	000-1802	Inductor, 2.7mH, SMD_0603_1608Metric	SMD_0603_1608Metric
7	L3	1	Dayton Audio	LW14-80	Inductor, 0.80mH, SMD_0603_1608Metric	SMD_0603_1608Metric
8	R1,R3	2	Dayton Audio	DNR-2.0	Resistor, 2.0ohm, H_AXIAL-P25.4_D_3.2	H_AXIAL-P25.4_D_3.2
9	R2,R5	2	Dayton Audio	DNR-3.0	Resistor, 3.0ohm, H_AXIAL-P25.4_D_3.2	H_AXIAL-P25.4_D_3.2
10	R4	1	Jantzen Audio	255-948	Resistor, 3.9ohm, H_AXIAL-P25.4_D_3.2	H_AXIAL-P25.4_D_3.2
11	R6	1	Dayton Audio	DNR-30	Resistor, 30ohm, H_AXIAL-P25.4_D_3.2	H_AXIAL-P25.4_D_3.2

n12012-8a-bom-jlcpcb

Comment	Designator	Footprint
PB1100	C1B, C3B	CP_Radial_D18.0mm_P7.50mm
PMPC-10	C1, C3	CP_Radial_D18.0mm_P7.50mm
027-578	C2	CP_Radial_D18.0mm_P7.50mm
PMPC-6.2	C4	CP_Radial_D18.0mm_P7.50mm
LW14-30	L1	SMD_0603_1608Metric
000-1802	L2	SMD_0603_1608Metric
LW14-80	L3	SMD_0603_1608Metric
DNR-2.0	R1, R3	H_AXIAL-P25.4_D_3.2
DNR-3.0	R2, R5	H_AXIAL-P25.4_D_3.2
255-948	R4	H_AXIAL-P25.4_D_3.2
DNR-30	R6	H_AXIAL-P25.4_D_3.2

gunsort

I need a printed schematic in PDF form

Thought for 33 sec

flux

Flux’s built-in PDF export contains PCB layers, not the schematic. I’ll create a separate, print-ready schematic PDF from the current circuit connections and component values.

Thought for 3 mins 25 sec

Thought for 11 sec

Reading schematic details.

Thought for 7 sec

1/2 Create a print-ready schematic PDF from the live component values and net connections.

Create a print-ready schematic PDF from the live component values and net connections.

Verify readability and circuit coverage, then provide the PDF download.

Accessed knowledge for the next task.

Thought for 27 sec

Awaiting 1 task

"N1201 Crossover Schematic" completed.

Thought for 1 min 54 sec

flux

Created a 3-page, print-ready schematic PDF, reconstructed from the current circuit connections and values. Print on US Letter, landscape.

Download schematic PDF

Important: The live schematic still shows J6’s MF breakout isolated from the crossover circuit; the PDF flags this unresolved connection rather than inventing wiring.

Files

Schematic

Layout

3D View

Final Hand-Stuffing Assembly Checklist — N1201/2 8A

Use this checklist with the latest 2D PCB/Gerber view. The 2D view is the manufacturing authority for solder pads, drill holes, silkscreen, copper, and tie-down holes; the 3D render may not show custom pad-only or hole-only features clearly.

Final Manufacturing Review — 2026-07-18

DRC/manufacturing/ERC review showed no open errors or warnings for airwires, dangling traces, floating copper, overlapping copper/traces, component body overlap, missing footprints, invalid layers, or manufacturing part-number checks.
The current 2D layout contains active drilled pad/hole features that feed the Gerber drill data:
- J1-J6: two 8 mm circular plated through-hole solder pads per J position, with 2.6 mm drill holes, intended for 14 AWG leads.
- C1, C1B, C2, C3, C3B, C4, R1-R6, L1-L3: active component lead solder holes remain present for hand stuffing.
- Tie-down holes remain present for L1, L2, L3, C1/C1B stack, and C3/C3B stack.
- Board mounting holes remain present at the corner/center mounting locations shown in the 2D layout.
Gerbers should be inspected in a Gerber viewer using the copper, solder mask, silkscreen, board outline, and drill layers. The 3D render is not the source of truth for these custom hole-only or pad-only features.

1. Pre-Assembly Verification

Confirm PCB matches the latest Gerber export for project N1201/2 8A.
Inspect both sides of the bare PCB for scratches, lifted copper, blocked drill holes, or solder mask defects.
Confirm the following features are visible on the physical PCB:
- J1-J6 large 14 AWG solder pads.
- Component lead solder holes for C1, C1B, C2, C3, C3B, C4, R1-R6, L1-L3.
- Zip-tie/tie-down holes around L1, L2, L3, C1/C1B stack, and C3/C3B stack.
- Board screw mounting holes at the corners and center location if present on the ordered Gerbers.
Clean the PCB with isopropyl alcohol before stuffing.

2. BOM Parts to Stage

Table

Ref	BOM Part / Value	Body Outline Used on PCB	Notes
C1	Dayton Audio PMPC-10, 10 uF, 250 V	45 x 22 mm	Part of LF 21 uF parallel pair
C1B	Solen PB1100, 11 uF, 400 V	38 x 28 mm	Part of LF 21 uF parallel pair
C2	Solen 16 uF 400 V, Parts Express 027-578 / PB1600	45 x 29 mm	HF input series capacitor
C3	Dayton Audio PMPC-10, 10 uF, 250 V	45 x 22 mm	Part of HF EQ 21 uF parallel pair
C3B	Solen PB1100, 11 uF, 400 V	38 x 28 mm	Part of HF EQ 21 uF parallel pair
C4	Dayton Audio PMPC-6.2, 6.2 uF, 250 V	31 x 22 mm	HF bypass capacitor
L1	Dayton LW14-30, 0.30 mH	Outline on PCB	Stand vertically; center hole left/right
L2	Madisound SL2.7-18AWG, 2.7 mH	Approximate outline on PCB	Lay flat; verify physical size before final assembly
L3	Dayton LW14-80, 0.77 mH	Outline on PCB	Stand vertically, rotated 90 degrees from L1
R1, R3	Dayton Audio DNR-2.0, 2 ohm, 10 W	48 x 10 mm	Mount elevated slightly off board
R2, R5	Dayton Audio DNR-3.0, 3 ohm, 10 W	48 x 10 mm	Mount elevated slightly off board
R4	Jantzen Audio 255-948, 3.90 ohm, 10 W	53 x 8.5 mm	Mount elevated slightly off board
R6	Dayton Audio DNR-30, 30 ohm, 10 W	48 x 10 mm	Mount elevated slightly off board
HF L-pad	AT-50H / Parts Express 260-252	Off-board	Remote control panel, 14 AWG leads
MF L-pad	AT-50H / Parts Express 260-252	Off-board	Remote control panel, 14 AWG leads

3. External 14 AWG Solder Pad Map

All J pads are large PCB solder pads intended for 14 AWG wire. Strip and tin wire ends only as needed; avoid wicking solder far up the lead.

Table

Board Pad	Function	Connection / Net	Assembly Note
J1 P1	LF input positive	LF_IN_POS	14 AWG input lead
J1 P2	LF return / LF negative	LF_RETURN	14 AWG input return lead
J2 P1	Woofer positive output	WOOFER_POS	14 AWG woofer lead
J2 P2	Woofer return / LF return	LF_RETURN	14 AWG woofer return lead
J3 P1	HF input positive	HF_IN_POS	14 AWG input lead
J3 P2	HF return / HF negative	HF_RETURN	14 AWG input return lead
J4 P1	Horn positive output	HORN_POS	14 AWG horn lead
J4 P2	Horn return / HF return	HF_RETURN	14 AWG horn return lead
J5 P1	HF L-pad lead A	HF_LPAD_IN	Confirm AT-50H terminal with ohmmeter before final wiring
J5 P2	HF L-pad lead B	HORN_POS	Confirm AT-50H terminal with ohmmeter before final wiring
J6 P1	MF L-pad lead A	MF_LPAD_A / as labeled on PCB	Confirm AT-50H terminal with ohmmeter before final wiring
J6 P2	MF L-pad lead B	MF_LPAD_B / as labeled on PCB	Confirm AT-50H terminal with ohmmeter before final wiring

4. Tie-Down / Mechanical Features

Use nylon zip ties, high-temp hot glue, neutral-cure silicone, or other non-ferrous restraints. Avoid steel or iron hardware near inductors.

Table

Feature Group	PCB Labels / Hole Names	Use
L1 tie-downs	ZT_L1_TOP_L, ZT_L1_TOP_R, ZT_L1_BOT_L, ZT_L1_BOT_R	Secure vertical L1 coil
L2 tie-downs	ZT_L2_TOP_L, ZT_L2_TOP_R, ZT_L2_BOT_L, ZT_L2_BOT_R	Secure flat L2 coil
L3 tie-downs	ZT_L3_TOP_L, ZT_L3_TOP_R, ZT_L3_BOT_L, ZT_L3_BOT_R	Secure vertical L3 coil
C1/C1B stack tie-downs	ZT_C1_STACK_TOP_L, ZT_C1_STACK_TOP_R, ZT_C1_STACK_BOT_L, ZT_C1_STACK_BOT_R	Secure LF capacitor stack
C3/C3B stack tie-downs	ZT_C3_STACK_TOP_L, ZT_C3_STACK_TOP_R, ZT_C3_STACK_BOT_L, ZT_C3_STACK_BOT_R	Secure HF capacitor stack
Board mounting	MH corner/center holes as printed	Screw board to cabinet/surface with non-magnetic hardware preferred near coils

5. Recommended Stuffing Order

Dry fit only — place all large capacitors, resistors, inductors, and 14 AWG leads on the bare board before soldering.
Verify mechanical clearance — confirm parts fit inside their silkscreen outlines and do not cover J pads, mounting holes, or tie-down holes.
Install small/low-profile leaded parts first — if any small jumpers or low-profile parts are used, install them before large passives.
Install resistors R1-R6 — keep wirewound resistor bodies slightly elevated from the board for heat clearance.
Install film capacitors C1, C1B, C2, C3, C3B, C4 — mount horizontally within their BOM-sized outlines.
Install inductors L1-L3:
- L2 flat on the board.
- L1 vertical with center hole left/right.
- L3 vertical and rotated 90 degrees from L1.
Install 14 AWG external leads at J1-J6 — solder only after confirming each pad function and wire destination.
Secure heavy parts — use zip ties and adhesive after soldering and after continuity checks pass.

6. Soldering Checklist

Each component lead is through its intended plated hole before soldering.
No component body is forced against a hot resistor or inductor edge.
J1-J6 14 AWG wires are mechanically supported; solder joint is not the only strain relief.
Solder joints are shiny, fully wetted, and do not bridge adjacent copper.
Trim lead ends only after final inspection of the joint.
Clean flux residue if it obscures inspection.

7. AT-50H L-Pad Qualification Before Final Wiring

Before connecting J5/J6 to the remote control panel:

Use an ohmmeter to identify the AT-50H common, input, and wiper/output terminals.
Mark each AT-50H terminal physically.
Confirm rotation direction: resistance should change in the intended attenuation direction.
Confirm loaded/unloaded behavior if possible before wiring into the crossover.
Wire HF L-pad to J5 only after terminal ID is confirmed.
Wire MF L-pad to J6 only after terminal ID is confirmed.

8. Continuity / Pre-Power Audio Checks

No amplifier should be connected until these pass.

Table

Test	Expected Result
J1 P1 to J1 P2	Not a direct short
J2 P1 to J2 P2	Not a direct short
J3 P1 to J3 P2	Not a direct short
J4 P1 to J4 P2	Not a direct short
J1 P2 to J2 P2	Continuity through LF return
J3 P2 to J4 P2	Continuity through HF return
J2 P1 path	Continuity through LF series inductor path as expected
J4 P1 path	Continuity through HF attenuation/output path as expected
J5/J6 remote leads	Match intended L-pad terminals after ohmmeter confirmation

9. Final Mechanical Inspection

All large parts are secured with tie-downs or adhesive.
Inductors are oriented per layout notes and separated as much as the PCB allows.
No steel screws or ferrous hardware are near L1/L2/L3.
14 AWG leads are strain relieved and labeled.
The board can be mounted to its surface without bending or crushing parts.
Polarity/function labels near J1-J6 remain visible after wiring.

10. First Audio Test

Start with low amplifier volume.
Use a current-limited or low-power test amplifier first if available.
Verify woofer output from J2 and horn output from J4 separately.
Sweep the HF and MF L-pads through their range and confirm smooth attenuation with no dropouts.
Stop immediately if any resistor overheats, sound drops out, or there is distortion suggesting a wiring error.

Build Sign-Off

Table

Item	Pass/Fail	Notes
Visual PCB inspection
BOM parts verified
Solder joints inspected
J1-J6 wiring checked
Tie-downs installed
Continuity checks passed
L-pad ohmmeter qualification passed
Low-level audio test passed

Assembler: ____________________
Date: ____________________
Board serial / notes: ____________________

Final Manufacturing Review — 2026-07-18
1. Pre-Assembly Verification
2. BOM Parts to Stage
3. External 14 AWG Solder Pad Map
4. Tie-Down / Mechanical Features
5. Recommended Stuffing Order
6. Soldering Checklist
7. AT-50H L-Pad Qualification Before Final Wiring
8. Continuity / Pre-Power Audio Checks
9. Final Mechanical Inspection
10. First Audio Test
Build Sign-Off