Power: USB-C J1, charger IC3, battery connector J2, regulators U2 + U3, inductors L3 + L4, and decoupling/bulk caps C1-C16
Set initial PCB constraints: 4-layer stackup and 70 mm x 40 mm board size.
Success criteria review
✅ Major subsystems integrated and electrically connected in the schematic (compute, camera, audio, UI, power, optional mic).
❌ Cannot complete PCB routing/placement: DRC shows 131 airwires (unrouted nets). Routing requires the human to run Auto-Layout and/or perform placement.
❌ Cannot confirm charger/regulator programming component values from datasheets because the @datasheet tool errored (reported internally).
Next steps
Place the key parts (IC1, U1, IC2, U2, U3, J1) in PCB, then run Auto-Layout to route and reduce airwires.
Once the datasheet tool is working (or if you provide PDFs/URLs), I can finalize correct values for the charger/regulator programming networks (currently placeholders on R3, R4, C7, L3, L4).
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant