VESC Receiver Design
Please send just a top-down 2D file of each side showing the component locations. That should be simpler and faster.
I’d rather get approval on a 2D top-down view of both sides first, and then move to 3D if needed, so we can use time and credits more efficiently.
Worked
Agreed — I’ll generate lightweight 2D top-down layout exports first, aiming for top and bottom component-location views before doing any more 3D work.
Worked
The 2D SVG export is ready as a ZIP. I’m recording it in the attachment/reference log so this review artifact stays traceable.
Thought
Generated the lightweight 2D layout export for component-location review:
I also added it to the Attachment and Reference Log. If this ZIP does not give you clean separate top/bottom views, I’ll generate a simpler side-specific review file next.
Review top-bottom views
Fix export clarity
Check placement constraints
Update review package
Refine this doc
Ask about this doc
Mechanical Envelope from STEP
Critical Control Update — Supersedes Earlier Board-Width Extraction
The user reattached and reconfirmed
G2 6 Hole drybox PCA Spaceclaim.STEP as the binding mechanical source for the initial PCA layout. The following values supersede any earlier summary or extraction that listed a 31.75 mm board width.- Board X dimension: 101.8 mm
- Board Y dimension: 38.0 mm
- Finished board thickness: 2.0 mm
- All four board corner radii: 6.25 mm
- Five high-current terminal footprints: battery positive, battery negative, and three motor phases
- Finished plated hole per high-current terminal: 5.75 mm diameter
- Plated contact pad on both sides per high-current terminal: 11.0 mm minimum overall diameter
- Radial annular copper width with an 11.0 mm pad: 2.625 mm
- Mounting holes: two total, each 2.8 mm diameter through the board; use the exact STEP-defined locations
- Hole centers from the STEP lower-left board datum: H1 = (2.636631 mm, 18.888223 mm); H2 = (99.156631 mm, 17.904272 mm)
- Hole centers in board-center coordinates: H1 = (-48.263369 mm, -0.111777 mm); H2 = (+48.256631 mm, -1.095728 mm)
- The two holes are intentionally offset from the board centerline and from each other in Y. They must not be forced into a symmetric pattern.
These are hard pass/fail controls. Do not alter the outline, thickness, corner radii, terminal hole/pad geometry, or source terminal models without explicit user approval.
Source file: 100-10074-01.STEP
Upload link:
Date parsed: 2026-07-24
3D Model (STEP)
Date parsed: 2026-07-24
User-provided interpretation
- Green body = PCA / PCB body.
- Blue body = total usable top-side part volume.
- Yellow body = total usable bottom-side part volume.
- Keepouts are already baked into the STEP geometry.
- Mounting holes are already accurately located and sized in the STEP.
- User-provided image confirms the assembly orientation: blue volume is above the green PCB, yellow volume is below the green PCB, and all three bodies are referenced to the same parallel board plane with no rotation between them.
- The blue/yellow bodies include odd-shaped opposite faces because the enclosure sits down into a boat hull; those shapes are real usable-volume limits and must be preserved.
STEP units
The STEP file uses millimeters:
Step
SI_UNIT ( .MILLI., .METRE. )
Extracted bodies
Table
| STEP product/body | User meaning | Raw STEP bounding-box dimensions |
|---|---|---|
G2 6 Hole drybox PCA Spaceclaim | Green PCB body | 101.8 × 31.75 × 2.0 mm |
G2 6 Hole drybox PCA Spaceclaim Top Part Volume | Blue top-side usable part volume | Raw local bbox: 24.479 × 38.000 × 101.800 mm |
G2 6 Hole drybox PCA Spaceclaim Bottom Part Volume | Yellow bottom-side usable part volume | Raw local bbox: 27.276 × 34.222 × 52.208 mm |
PCB envelope
The PCB body is unambiguous:
- X: 0.000 to 101.800 mm
- Y: 0.000 to 31.750 mm
- Z: 0.000 to 2.000 mm
Therefore the current mechanical PCB space claim should be treated as:
- Length: 101.8 mm
- Width: 31.75 mm
- PCB thickness: 2.0 mm
This is slightly narrower than the previously discussed 102 × 40 mm max envelope; it appears the STEP defines the exact board outline as 101.8 × 31.75 mm.
Interpreting top and bottom volume solids
The STEP and user-provided image confirm the blue/yellow part-volume solids share the same board-plane orientation as the green PCB; they should not be treated as rotated coordinate artifacts.
Important placement interpretation:
- The blue top-side volume is the real shaped top-side usable component envelope above the PCB.
- The yellow bottom-side volume is the real shaped bottom-side usable component envelope below the PCB.
- These are not just simple rectangular height limits. The shaped faces are enclosure/hull-driven constraints and should be preserved when evaluating component fit.
- The raw bounding boxes are still useful for maximum extents, but final compact placement should respect the shaped STEP volume, especially near the curved/notched areas.
Layout implications
- Resize the PCB to 101.8 × 31.75 mm, not 160 × 100 mm.
- Use the STEP mounting hole geometry as authoritative.
- Do not add extra keepouts beyond the STEP volume bodies unless the user later specifies additional constraints.
- A dense 6-layer layout is strongly recommended for this envelope.
- Top/bottom component placement should be constrained by the blue/yellow volume bodies once the exact height-axis mapping is confirmed.
- Hard placement requirement: all external connectors and LED indicators must be on the top side of the PCB.
- Hard connector-access requirement: all external connectors must be placed within the user-highlighted darker-blue top-side access corridor along the long side of the assembly, so the enclosure can access/seal the connections.
- Hard indicator-access requirement: all LED indicators must remain on the top side, but because the enclosure top is transparent, LEDs do not need to occupy the darker-blue connector-access corridor. Prefer placing LEDs along the opposite side or any open top-side area that preserves connector sealing/interface space.
- Connector clearance requirement: preserve as much free space as practical around each connector/post/header in the darker-blue top-side access corridor for enclosure interface, sealing, potting, or gasket features. Do not consume connector-adjacent real estate with nonessential indicators or support passives unless there is no viable alternative.
- Thermal placement requirement: MOSFETs should be on the bottom side, arranged in a straight row along an edge for direct contact to the user's water-cooled heat sink. Use generous copper around MOSFETs/high-current paths without reserving excessive heat-spreader area.
- Vertical alignment requirement: the bottom-side MOSFET/water-cooled heat-sink corridor is directly below the darker-blue top-side connector corridor, on the same long side of the assembly. Place connectors/LEDs on top in that corridor and MOSFETs below on the bottom side in the corresponding heat-sink row.
Orientation confirmation
The user-provided screenshot confirms the intended assembly view:
- Blue/cyan solid above PCB = top-side volume.
- Green thin solid = PCB.
- Yellow solid below PCB = bottom-side volume.
- No extra keepouts should be added beyond the baked-in volume geometry unless new constraints are provided.
Critical Control Update — Supersedes Earlier Board-Width Extraction
User-provided interpretation
STEP units
Extracted bodies
PCB envelope
Interpreting top and bottom volume solids
Layout implications
Orientation confirmation
