Functional Clustering & Orientation
- Check that related components (MCU, power, analog, RF) are grouped logically.
- Ensure pin-1 and signal-flow orientations minimize trace crossings.
Decoupling & Power Integrity
- All decoupling capacitors sit right beside their IC power pins.
- Bulk caps are close to input filters and power rails.
- Ferrites/PTCs and TVS are in the correct series/order.
Signal-Path Lengths & Routing Quality
- Critical nets (UART, USB, high-speed clocks) have short, direct routes with controlled impedance if needed.
- Differential pairs (e.g., USB D+/D–) are length-matched.
- No long loops or unnecessary vias on sensitive traces.
Thermal & Mechanical Constraints
- Hot parts (voltage regulators, PTCs) have room for heat dissipation or thermal vias.
- Mounting holes clear all copper and sit at correct coordinates for your enclosure.
- Component heights respect your 6 cm box limit.
DRC & Manufacturability Checks
- Run a full DRC: clearance, minimum annular ring, drill sizes.
- Look for air-wires or missing footprints.
- Verify panelization rules (if applicable).