Footprint Verification Request

flux

Below is the summary review of the updated pad dimensions versus your design goals:

Table

ParameterTarget from Datasheet/Design GoalsUpdated ValueAssessment
Pad Spacing3.00 mm (center-to-center)UnchangedThe pad spacing remains aligned with the datasheet and design goals.
Pad Size X (Width)Originally set greater (e.g., ~4.25 mm typical) but revised for denser design or specific routing needs2.5 mmThe updated width of 2.5 mm meets your directive; verify that this width still allows sufficient solder fillet and electrical connectivity based on manufacturing requirements.
Pad Size Y (Length)As per previous (mechanical drawing)UnchangedNo changes were made to the length; ensure it still satisfies the datasheet recommendations.
Review Notes:
  • The reduction of Size X to 2.5 mm appears to achieve a denser layout but should be double-checked for solderability and robustness in the footprint review.
  • Ensure that the overall solder mask and silkscreen clearances remain acceptable with the new pad width.
If these parameters meet the intended design criteria and manufacturing guidelines, your updated pad dimensions are aligned with your design goals. Please let me know if additional adjustments are required.
G

geoffw

Confirm the pad size adjustments in the PCB editor.

flux

All selected pads now have their Size X property set to 2.5 mm in the PCB editor. This adjustment aligns with your design goals for pad dimensions. Please verify in your PCB editor if the change meets your layout requirements and let me know if any further modifications are needed.
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