I can’t execute auto-layout right now because the account has no available ACUs.
What’s already been completed:
RS-485 edge links 3–6 were wired from the MAX14830 UART bridges through THVD1450 transceivers to the edge connectors.
Missing edge 2 RS-485 A/B connector wiring was completed.
All six MP5016 protected 5 V edge power-switch branches were wired.
Six 1 µF MP5016 input decoupling capacitors were added and placed near their switches.
ERC/DRC was run; edge-link and power-switch wiring is present.
Current board state:
The PCB still needs layout work.
DRC showed many airwires, so trace routing is definitely needed.
There are also overlapping copper/layout issues, and at least one placement concern around edge power-switch decoupling, so placement cleanup is also needed before routing.
Recommended next actions once ACUs are available:
Run placement cleanup / auto-layout for the full board.
Magnetic Hex-Futhark Tile is a modular 3D-printed regular hexagonal tile system. Each tile mechanically aligns with neighboring tiles using neodymium magnets and keyed shear-collar features, while electrical power and data are carried by spring-loaded pogo contacts. This project is the Earth source tile, the power/control origin tile that contains a LiPo battery, charging/power electronics, and a microcontroller.
Intended Use
Prototype/validation build for modular “Technomancy” tiles.
Tiles snap together magnetically in a tabletop physical array.
The Earth tile powers the array and broadcasts discovery/pulse messages to connected tiles.
Intended for low-voltage battery-powered interactive objects, not for safety-critical or outdoor use in this revision.
What the Device Should Do
Provide regulated power to neighboring tiles through edge pogo contacts.
Detect and communicate with attached tiles over robust edge-to-edge differential links.
Broadcast a repeating source/pulse message from the Earth tile.
Support firmware development and debug access.
Fit inside the specified hollow 100 mm flat-to-flat hex shell.
Main Features
Single-cell LiPo battery input.
USB-C charging input recommended for prototype convenience.
Selected architecture: independent point-to-point half-duplex RS-485 differential link on each edge.
Rationale: a shared passive CAN bus is electrically awkward in arbitrary hex meshes because the topology becomes branches/loops/stubs with no stable pair of termination endpoints. Per-edge differential links keep each physical connection simple and let firmware route packets across the tile graph.
Edge pinout becomes: 5V, GND, RS485_A, RS485_B.
Each edge gets its own RS-485 transceiver and local termination option.
The MCU reaches six edge UARTs through external multi-UART bridge ICs over SPI.
Firmware must use framing, CRC, deduplication, and hop-count/TTL to prevent routing loops.
Edge Interconnect
Six edge connectors, each with four pogo contacts:
5V_EDGE_n
GND
RS485_A_n
RS485_B_n
Magnets are mechanical alignment only and must not carry current.
Edge 1: male shear collar, North magnet pocket.
Edge 2: female recessed pocket, South magnet pocket.
Edges 3–6 require a final alternating/keying scheme before mechanical CAD/layout.
Protection
Exposed pogo contacts should receive ESD protection for RS485_A/RS485_B and edge power.
Each 5 V edge branch should include current-limited switching and reverse-current protection to prevent one damaged/misaligned edge from collapsing the whole mesh.
Multiple Earth/source tiles must not directly parallel boost outputs without ideal-diode/load-switch policy.
Interfaces and Connections
Table
Interface
Signals
Notes
USB-C charge/program input
VBUS, GND, CC1, CC2, USB D+/D−
Sink-only charging input; native USB programming if routed to ESP32-S3.
LiPo battery
BAT+, BAT−
Single-cell LiPo; connector and capacity TBD.
Edge ports x6
5V_EDGE_n, GND, RS485_A_n, RS485_B_n
Four contacts per side, independent data link per edge.
Programming/debug
3V3, GND, EN, BOOT, USB or UART
Final depends on selected MCU/module implementation.
Power and Runtime Expectations
Battery: single-cell LiPo, capacity TBD.
Edge rail: 5 V output for neighboring tiles.
Logic rail: 3.3 V.
Runtime target: TBD after battery capacity and downstream tile loads are defined.
Sleep current is not optimized in the first proof-of-concept unless requested.
Power Tree and Power Budget
Initial sizing assumptions for draft schematic:
Table
Rail
Load
Typical
Peak
3.3 V
ESP32-S3 module
80–240 mA
500 mA burst
3.3 V
2x quad-UART bridges
10–40 mA
TBD
3.3 V
6x RS-485 transceivers
6–60 mA
TBD
5 V_EDGE
Downstream tiles
TBD
TBD
Preliminary decision: design the boost path as a 5 V, at least 1 A-capable prototype rail until real downstream tile current is measured. At LiPo minimum 3.0 V and 85% boost efficiency, a 5 V / 1 A load requires about 1.96 A from the cell before MCU overhead. Battery, boost converter, switch, connector, and protection parts must be rated accordingly.
Manufacturing and Assembly Expectations
Prototype-first design.
SMD default for compact fit inside the tile.
Use real library parts where available; generic passives are acceptable for resistors/capacitors/inductors.
Provide test points for BAT, 5V_EDGE, each per-edge 5 V branch, 3V3, GND, RS485_A/B, EN/BOOT, and charge status.
Firmware-Relevant Hardware Requirements
SPI from MCU to UART bridge ICs.
Six half-duplex UART/RS-485 links with DE/RE direction control.
Boot/reset access.
Battery voltage measurement recommended through resistor divider into ADC.
Optional charge-status and edge-fault GPIOs.
Pulse/discovery protocol uses a framed packet protocol over per-edge half-duplex links.
Assign a unique tile ID in firmware or via future hardware ID option.
Physical Design Expectations
Regular hexagon, flat-to-flat width: 100 mm.
Height: 12 mm.
Uniform outer wall thickness: 2.5 mm, forming a hollow internal electronics bay.
Top face: engraved Uruz rune geometry, 1.5 mm line width, 1.2 mm inlay depth.
Bottom shell floor: four recessed structural screw pillars for self-tapping M2x6 mm screws.
Edge 1: 30 mm wide x 1.5 mm deep solid rectangular shear collar centered on height profile; 3.2 mm diameter x 2.0 mm deep North magnet pocket at midpoint; four 2.5 mm pogo holes flanking magnet left/right by 8 mm.
Edge 2: 30.4 mm wide x 1.7 mm deep female pocket; matching 3.2 mm South magnet pocket and four 2.5 mm pogo holes.
Exact interpretation of “four holes flanking left/right by exactly 8 mm” must be clarified in CAD: likely a 4-contact row centered around the edge midpoint with magnet in the center.
Important Design Decisions
Magnets are not electrical conductors; they are alignment/keying only.
Robust bus choice: per-edge point-to-point RS-485, replacing single-ended Data IN/Data OUT naming with RS485_A/RS485_B.
The six edge data ports are electrically independent and are routed in firmware; they are not tied into one passive bus.
Use local termination options on each point-to-point edge link rather than global bus termination.
Exposed 5 V contacts should be individually protected/current-limited per edge before final layout.
Start with a prototype-current assumption of 5 V / 1 A total edge output until tile load measurements exist.
Assumptions
The Earth tile should be rechargeable over USB-C.
The MCU may be an ESP32-S3 module unless the user prefers Arduino Nano Every or another MCU.
Wireless is optional and not required for rev A functionality, but an ESP32 module introduces RF layout/regulatory considerations.
All six edges should ultimately support electrical mating, but only edge 1 and edge 2 mechanical details are currently specified.
The initial schematic may use standard board connectors to represent edge pogo interfaces until exact pogo connector MPNs are selected.
Open Items
Confirm final edge 3–6 mechanical/keying pattern.
Select exact LiPo cell capacity, connector type, and charge current.
Select exact boost current limit based on maximum number of downstream tiles.
Finalize per-edge high-side switch / eFuse part and current limit.
Choose exact pogo-pin connector MPN/footprint.
Decide whether firmware programming is via native USB, USB-UART, or external serial header.
Change Notes
Initial specification created from the two pasted user notes.
Bus architecture updated after review from shared CAN to per-edge point-to-point RS-485 for arbitrary mesh robustness.
Earth tile schematic direction defined: LiPo + USB-C power-path charging + 5 V boost + 3.3 V logic + ESP32-S3 module + dual quad-UART bridges + six RS-485 edge links.
Project Overview
Intended Use
What the Device Should Do
Main Features
System Architecture
Hardware Subsystems
Power
Compute
Tile Communication
Edge Interconnect
Protection
Interfaces and Connections
Power and Runtime Expectations
Power Tree and Power Budget
Manufacturing and Assembly Expectations
Firmware-Relevant Hardware Requirements
Physical Design Expectations
Important Design Decisions
Assumptions
Open Items
Change Notes
Reviews
Documents
Project Specification
Assets
No assets added.
Magnetic Hex Tile Earth Source
Earth source tile for a magnetic modular hex-tile system with LiPo power, MCU control, pogo-pin edge interconnects, and a robust low-speed tile communication bus.
Properties
Properties describe core aspects of the project.
Pricing & Availability
Distributor
Qty 1
Arrow
$42.81–$55.69
Digi-Key
$5.46
HQonline
$3.50
LCSC
$50.57
Mouser
$110.20
TME
$15.39
Verical
$44.04–$102.98
Controls
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