Magnetic Tile System

I can’t execute auto-layout right now because the account has no available ACUs.
What’s already been completed:
  • RS-485 edge links 3–6 were wired from the MAX14830 UART bridges through THVD1450 transceivers to the edge connectors.
  • Missing edge 2 RS-485 A/B connector wiring was completed.
  • All six MP5016 protected 5 V edge power-switch branches were wired.
  • Six 1 µF MP5016 input decoupling capacitors were added and placed near their switches.
  • ERC/DRC was run; edge-link and power-switch wiring is present.
Current board state:
  • The PCB still needs layout work.
  • DRC showed many airwires, so trace routing is definitely needed.
  • There are also overlapping copper/layout issues, and at least one placement concern around edge power-switch decoupling, so placement cleanup is also needed before routing.
Recommended next actions once ACUs are available:
  1. Run placement cleanup / auto-layout for the full board.
  2. Resolve overlapping copper/component placement issues.
  3. Auto-route remaining airwires.
  4. Re-run ERC/DRC and fix remaining violations.
  5. Finish schematic open items: MAX14830 clock circuits, ESD-array wiring, and intentional no-connects for unused pins.
Review layout violations
Locate overlaps
Finish schematic items
Manual placement strategy

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Project Specification
Project Overview
Status: Draft
Magnetic Hex-Futhark Tile is a modular 3D-printed regular hexagonal tile system. Each tile mechanically aligns with neighboring tiles using neodymium magnets and keyed shear-collar features, while electrical power and data are carried by spring-loaded pogo contacts. This project is the Earth source tile, the power/control origin tile that contains a LiPo battery, charging/power electronics, and a microcontroller.
Intended Use
  • Prototype/validation build for modular “Technomancy” tiles.
  • Tiles snap together magnetically in a tabletop physical array.
  • The Earth tile powers the array and broadcasts discovery/pulse messages to connected tiles.
  • Intended for low-voltage battery-powered interactive objects, not for safety-critical or outdoor use in this revision.
What the Device Should Do
  • Provide regulated power to neighboring tiles through edge pogo contacts.
  • Detect and communicate with attached tiles over robust edge-to-edge differential links.
  • Broadcast a repeating source/pulse message from the Earth tile.
  • Support firmware development and debug access.
  • Fit inside the specified hollow 100 mm flat-to-flat hex shell.
Main Features
  • Single-cell LiPo battery input.
  • USB-C charging input recommended for prototype convenience.
  • 5 V edge power rail for downstream tiles.
  • 3.3 V logic rail for MCU and communication ICs.
  • Six identical edge electrical ports.
  • Mechanical magnet pockets, pogo-pin holes, keyed male/female collar geometry, M2 screw pillars, and Uruz rune engraving.
System Architecture

Diagram


USB-C 5 V Input Power-Path LiPo Charger Single-cell LiPo System/Battery Rail 5 V Boost Regulator Per-Edge Protected 5 V Distribution Six Edge Ports 3.3 V Regulator ESP32-S3-class MCU Module 2x Quad-UART Bridge over SPI 6x Half-Duplex RS-485 Transceivers USB / Boot / Reset Access
Hardware Subsystems
Power
  • Single-cell LiPo battery powers the tile.
  • USB-C 5 V input charges the LiPo through a power-path/load-sharing charger, not a basic charger tied directly to the system load.
  • A boost regulator creates the 5 V edge power bus.
  • A 3.3 V regulator powers the MCU, UART bridges, and RS-485 transceivers.
  • Edge 5 V output should be split into per-edge protected branches with current limiting and reverse-current blocking before physical prototype release.
Compute
  • ESP32-S3-class module preferred for rapid prototyping, native USB, many GPIOs, Arduino/ESP-IDF support, and optional Wi-Fi/BLE.
  • Firmware drives packet routing, topology discovery, edge-port state, and pulse broadcasting.
Tile Communication
  • Selected architecture: independent point-to-point half-duplex RS-485 differential link on each edge.
  • Rationale: a shared passive CAN bus is electrically awkward in arbitrary hex meshes because the topology becomes branches/loops/stubs with no stable pair of termination endpoints. Per-edge differential links keep each physical connection simple and let firmware route packets across the tile graph.
  • Edge pinout becomes: 5V, GND, RS485_A, RS485_B.
  • Each edge gets its own RS-485 transceiver and local termination option.
  • The MCU reaches six edge UARTs through external multi-UART bridge ICs over SPI.
  • Firmware must use framing, CRC, deduplication, and hop-count/TTL to prevent routing loops.
Edge Interconnect
  • Six edge connectors, each with four pogo contacts:
    1. 5V_EDGE_n
    2. GND
    3. RS485_A_n
    4. RS485_B_n
  • Magnets are mechanical alignment only and must not carry current.
  • Edge 1: male shear collar, North magnet pocket.
  • Edge 2: female recessed pocket, South magnet pocket.
  • Edges 3–6 require a final alternating/keying scheme before mechanical CAD/layout.
Protection
  • Exposed pogo contacts should receive ESD protection for RS485_A/RS485_B and edge power.
  • Each 5 V edge branch should include current-limited switching and reverse-current protection to prevent one damaged/misaligned edge from collapsing the whole mesh.
  • Multiple Earth/source tiles must not directly parallel boost outputs without ideal-diode/load-switch policy.
Interfaces and Connections

Table


InterfaceSignalsNotes
USB-C charge/program inputVBUS, GND, CC1, CC2, USB D+/D−Sink-only charging input; native USB programming if routed to ESP32-S3.
LiPo batteryBAT+, BAT−Single-cell LiPo; connector and capacity TBD.
Edge ports x65V_EDGE_n, GND, RS485_A_n, RS485_B_nFour contacts per side, independent data link per edge.
Programming/debug3V3, GND, EN, BOOT, USB or UARTFinal depends on selected MCU/module implementation.
Power and Runtime Expectations
  • Battery: single-cell LiPo, capacity TBD.
  • Edge rail: 5 V output for neighboring tiles.
  • Logic rail: 3.3 V.
  • Runtime target: TBD after battery capacity and downstream tile loads are defined.
  • Sleep current is not optimized in the first proof-of-concept unless requested.
Power Tree and Power Budget
Initial sizing assumptions for draft schematic:

Table


RailLoadTypicalPeak
3.3 VESP32-S3 module80–240 mA500 mA burst
3.3 V2x quad-UART bridges10–40 mATBD
3.3 V6x RS-485 transceivers6–60 mATBD
5 V_EDGEDownstream tilesTBDTBD
Preliminary decision: design the boost path as a 5 V, at least 1 A-capable prototype rail until real downstream tile current is measured. At LiPo minimum 3.0 V and 85% boost efficiency, a 5 V / 1 A load requires about 1.96 A from the cell before MCU overhead. Battery, boost converter, switch, connector, and protection parts must be rated accordingly.
Manufacturing and Assembly Expectations
  • Prototype-first design.
  • SMD default for compact fit inside the tile.
  • Use real library parts where available; generic passives are acceptable for resistors/capacitors/inductors.
  • Provide test points for BAT, 5V_EDGE, each per-edge 5 V branch, 3V3, GND, RS485_A/B, EN/BOOT, and charge status.
Firmware-Relevant Hardware Requirements
  • SPI from MCU to UART bridge ICs.
  • Six half-duplex UART/RS-485 links with DE/RE direction control.
  • Boot/reset access.
  • Battery voltage measurement recommended through resistor divider into ADC.
  • Optional charge-status and edge-fault GPIOs.
  • Pulse/discovery protocol uses a framed packet protocol over per-edge half-duplex links.
  • Assign a unique tile ID in firmware or via future hardware ID option.
Physical Design Expectations
  • Regular hexagon, flat-to-flat width: 100 mm.
  • Height: 12 mm.
  • Uniform outer wall thickness: 2.5 mm, forming a hollow internal electronics bay.
  • Top face: engraved Uruz rune geometry, 1.5 mm line width, 1.2 mm inlay depth.
  • Bottom shell floor: four recessed structural screw pillars for self-tapping M2x6 mm screws.
  • Edge 1: 30 mm wide x 1.5 mm deep solid rectangular shear collar centered on height profile; 3.2 mm diameter x 2.0 mm deep North magnet pocket at midpoint; four 2.5 mm pogo holes flanking magnet left/right by 8 mm.
  • Edge 2: 30.4 mm wide x 1.7 mm deep female pocket; matching 3.2 mm South magnet pocket and four 2.5 mm pogo holes.
  • Exact interpretation of “four holes flanking left/right by exactly 8 mm” must be clarified in CAD: likely a 4-contact row centered around the edge midpoint with magnet in the center.
Important Design Decisions
  • Magnets are not electrical conductors; they are alignment/keying only.
  • Robust bus choice: per-edge point-to-point RS-485, replacing single-ended Data IN/Data OUT naming with RS485_A/RS485_B.
  • The six edge data ports are electrically independent and are routed in firmware; they are not tied into one passive bus.
  • Use local termination options on each point-to-point edge link rather than global bus termination.
  • Exposed 5 V contacts should be individually protected/current-limited per edge before final layout.
  • Start with a prototype-current assumption of 5 V / 1 A total edge output until tile load measurements exist.
Assumptions
  • The Earth tile should be rechargeable over USB-C.
  • The MCU may be an ESP32-S3 module unless the user prefers Arduino Nano Every or another MCU.
  • Wireless is optional and not required for rev A functionality, but an ESP32 module introduces RF layout/regulatory considerations.
  • All six edges should ultimately support electrical mating, but only edge 1 and edge 2 mechanical details are currently specified.
  • The initial schematic may use standard board connectors to represent edge pogo interfaces until exact pogo connector MPNs are selected.
Open Items
  • Confirm final edge 3–6 mechanical/keying pattern.
  • Select exact LiPo cell capacity, connector type, and charge current.
  • Select exact boost current limit based on maximum number of downstream tiles.
  • Finalize per-edge high-side switch / eFuse part and current limit.
  • Choose exact pogo-pin connector MPN/footprint.
  • Decide whether firmware programming is via native USB, USB-UART, or external serial header.
Change Notes
  • Initial specification created from the two pasted user notes.
  • Bus architecture updated after review from shared CAN to per-edge point-to-point RS-485 for arbitrary mesh robustness.
  • Earth tile schematic direction defined: LiPo + USB-C power-path charging + 5 V boost + 3.3 V logic + ESP32-S3 module + dual quad-UART bridges + six RS-485 edge links.
  • Project Overview

  • Intended Use

  • What the Device Should Do

  • Main Features

  • System Architecture

  • Hardware Subsystems

  • Power

  • Compute

  • Tile Communication

  • Edge Interconnect

  • Protection

  • Interfaces and Connections

  • Power and Runtime Expectations

  • Power Tree and Power Budget

  • Manufacturing and Assembly Expectations

  • Firmware-Relevant Hardware Requirements

  • Physical Design Expectations

  • Important Design Decisions

  • Assumptions

  • Open Items

  • Change Notes

Documents

  • Project Specification

Assets

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Magnetic Hex Tile Earth Source

Magnetic Hex Tile Earth Source thumbnail
Earth source tile for a magnetic modular hex-tile system with LiPo power, MCU control, pogo-pin edge interconnects, and a robust low-speed tile communication bus.

Properties

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