U1 vs IC1 Comparison
Table
| Category | U1 | IC1 | Main difference |
|---|---|---|---|
| Part | U1 | IC1 | Different vendors: NXP vs TI |
| Function | LIN transceiver | LIN transceiver | Same basic role |
| LIN standard support | LIN 2.x / ISO 17987-4:2016 / SAE J2602 | LIN 2.0 / 2.1 / 2.2 / 2.2A / ISO 17987-4 / SAE J2602-1 | Very similar compliance; IC1 explicitly lists more LIN revisions |
| Automotive qualification | Not explicitly called out in the extracted section | AEC-Q100 Grade 1, Functional Safety-Capable | IC1 is more explicitly automotive-qualified |
| Operating supply voltage | 5.5 V to 27 V on VBAT | 4.5 V to 36 V on VSUP | IC1 has a much wider operating supply range |
| Absolute max supply voltage | -0.3 V to +40 V | -0.3 V to +45 V | IC1 tolerates higher supply stress |
| Recommended LIN bus voltage | Static characteristics given for VBAT 5.5 V to 27 V | 0 V to 36 V | IC1 supports wider bus operating voltage |
| Absolute max LIN bus voltage | -40 V to +40 V | -45 V to +45 V | IC1 is more fault-tolerant on LIN |
| Load dump / fault tolerance | ISO 7637 transient protection, short-circuit proof to battery and ground | Explicit 42 V load dump support, ยฑ45 V LIN fault tolerant | IC1 is stronger on published fault tolerance |
| Logic input compatibility | Compatible with 3.3 V and 5 V devices | Logic pins specified for 0 V to 5.25 V | U1 explicitly calls out 3.3 V compatibility; IC1 gives tighter logic-voltage limits |
| RXD output | Open-drain, 1.5 mA min low-level sink | Open-drain, 1.5 mA low-level sink, 0.6 V max low level | Similar drive capability |
| INH output current | -50 mA to +15 mA absolute max | 4 mA absolute max | U1 can drive a much heavier INH load |
| INH behavior | Switch resistance VBAT-to-INH: 20 typ / 50 max ohms | INH high-level drop vs VSUP: 0.5 V to 1 V at -0.5 mA | Different output characterization; U1 looks more suitable for stronger regulator-enable sourcing |
| Sleep current | 2 typ / 7 typ? / 10 max uA listed as 2 / 7 / 10 uA depending on min/typ/max | INH leakage in sleep -0.5 to 0.5 uA; full sleep supply current not in extracted section | U1 has more complete low-power current data in the extracted content |
| Standby current | 150 / 450 / 1000 uA recessive | Not captured in extracted section | U1 gives clearer standby current numbers here |
| Normal-mode supply current | 300 / 800 / 1600 uA recessive, 1 / 2 / 4 mA dominant | Not captured in extracted section | U1 has more extracted current-consumption detail |
| TXD logic thresholds | VIH 2 V to 7 V, VIL -0.3 V to 0.8 V, hysteresis 50 / 200 / 400 mV | VIH 2 V min, VIL 0.8 V max, pull-down 125 / 350 / 800 kOhm | Very similar digital thresholds; U1 gives explicit hysteresis spread |
| Enable / sleep control pin | ~SLP~ active-low sleep control | EN enable / sleep control | Same function class, different polarity and naming |
| WAKE pin thresholds | VIH VBAT - 1 V to VBAT + 0.3 V, VIL -0.3 V to VBAT - 3.3 V | VIH VSUP - 1.8 V, VIL VSUP - 3.85 V | Thresholds differ; firmware and interface assumptions may not port 1:1 |
| LIN pull-up / termination | Integrated termination resistor, extracted values 20 / 30 / 47 kOhm | Integrated pull-up 20 / 45 / 60 kOhm, feature summary says 45 kOhm nominal | Pull-up network values differ |
| LIN capacitance | 30 pF max | 25 pF | IC1 is slightly lower |
| Data rate | Up to 20 kBd | TX up to 20 kbps, RX up to 100 kbps | IC1 explicitly supports faster receive path |
| Temperature range | Junction / virtual junction -40 C to +150 C | Junction -40 C to +150 C operating, abs max to 165 C | Similar operating range; IC1 has higher absolute max junction rating |
| ESD robustness | Explicit: +-6 kV IEC 61000-4-2 on LIN/VBAT/WAKE, stronger HBM/CDM detail | Protection features listed, but less ESD detail in extracted section | U1 provides more explicit ESD numbers |
| Package / footprint style in project | 8-pin device with dual GND pins in the symbol | 8-pin device plus EP on pin 9 in the symbol | Pin-count presentation differs in your schematic symbols |
Table
| Pin # | U1 | IC1 | Difference |
|---|---|---|---|
| 1 | RXD | RXD | Same |
| 2 | ~SLP~ | EN | Same control role class, but different naming and likely different logic interpretation |
| 3 | ~WAKE~ | WAKE | Similar purpose, naming polarity differs |
| 4 | TXD | TXD | Same |
| 5 | GND | GND | Same |
| 6 | LIN | LIN | Same |
| 7 | VBAT | VSUP | Same supply role, different naming |
| 8 | INH | INH | Same |
| 9 | GND | EP | Major package difference in the current symbols: U1 shows a second GND pin, while IC1 shows an exposed pad |
Table
| Topic | Summary |
|---|---|
| Best electrical robustness | IC1 |
| Best supply-voltage flexibility | IC1 with 4.5 V to 36 V operation |
| Stronger INH output capability | U1 |
| Better-extracted low-power current detail | U1 |
| More automotive-specific positioning | IC1 |
| Biggest practical migration risk | Control-pin semantics and the package/pad difference at pin 9 |
~SLP~ vs EN, and ~WAKE~ vs WAKE.To get started, talk to Flux or create a New Document.
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