U1 vs IC1 Comparison
1:37
Organizing project components.
Reviewing the bill of materials.
Analyzing the schematic.
Looking for "absolute maximum ratings, supply voltage range, LIN bus voltage range, output current, inhibit current, operating conditions, electrical characteristics, features, package pinout" in TJA1021.pdf
Looking for "absolute maximum ratings, supply voltage range, LIN bus voltage range, output current, inhibit current, operating conditions, electrical characteristics, features, package pinout" in tlin1021a-q1.pdf
Comparison of U1 vs IC1
| Category | U1 | IC1 | Main difference |
|---|---|---|---|
| Part | U1 | IC1 | Different vendors: NXP vs TI |
| Function | LIN transceiver | LIN transceiver | Same basic role |
| LIN standard support | LIN 2.x / ISO 17987-4:2016 / SAE J2602 | LIN 2.0 / 2.1 / 2.2 / 2.2A / ISO 17987-4 / SAE J2602-1 | Very similar compliance; IC1 explicitly lists more LIN revisions |
| Automotive qualification | Not explicitly called out in the extracted section | AEC-Q100 Grade 1, Functional Safety-Capable | IC1 is more explicitly automotive-qualified |
| Operating supply voltage | 5.5 V to 27 V on VBAT | 4.5 V to 36 V on VSUP | IC1 has a much wider operating supply range |
| Absolute max supply voltage | -0.3 V to +40 V | -0.3 V to +45 V | IC1 tolerates higher supply stress |
| Recommended LIN bus voltage | Static characteristics given for VBAT 5.5 V to 27 V | 0 V to 36 V | IC1 supports wider bus operating voltage |
| Absolute max LIN bus voltage | -40 V to +40 V | -45 V to +45 V | IC1 is more fault-tolerant on LIN |
| Load dump / fault tolerance | ISO 7637 transient protection, short-circuit proof to battery and ground | Explicit 42 V load dump support, ±45 V LIN fault tolerant | IC1 is stronger on published fault tolerance |
| Logic input compatibility | Compatible with 3.3 V and 5 V devices | Logic pins specified for 0 V to 5.25 V | U1 explicitly calls out 3.3 V compatibility; IC1 gives tighter logic-voltage limits |
| RXD output | Open-drain, 1.5 mA min low-level sink | Open-drain, 1.5 mA low-level sink, 0.6 V max low level | Similar drive capability |
| INH output current | -50 mA to +15 mA absolute max | 4 mA absolute max | U1 can drive a much heavier INH load |
| INH behavior | Switch resistance VBAT-to-INH: 20 typ / 50 max ohms | INH high-level drop vs VSUP: 0.5 V to 1 V at -0.5 mA | Different output characterization; U1 looks more suitable for stronger regulator-enable sourcing |
| Sleep current | 2 typ / 7 typ? / 10 max uA listed as 2 / 7 / 10 uA depending on min/typ/max | INH leakage in sleep -0.5 to 0.5 uA; full sleep supply current not in extracted section | U1 has more complete low-power current data in the extracted content |
| Standby current | 150 / 450 / 1000 uA recessive | Not captured in extracted section | U1 gives clearer standby current numbers here |
| Normal-mode supply current | 300 / 800 / 1600 uA recessive, 1 / 2 / 4 mA dominant | Not captured in extracted section | U1 has more extracted current-consumption detail |
| TXD logic thresholds | VIH 2 V to 7 V, VIL -0.3 V to 0.8 V, hysteresis 50 / 200 / 400 mV | VIH 2 V min, VIL 0.8 V max, pull-down 125 / 350 / 800 kOhm | Very similar digital thresholds; U1 gives explicit hysteresis spread |
| Enable / sleep control pin | ~SLP~ active-low sleep control | EN enable / sleep control | Same function class, different polarity and naming |
| WAKE pin thresholds | VIH VBAT - 1 V to VBAT + 0.3 V, VIL -0.3 V to VBAT - 3.3 V | VIH VSUP - 1.8 V, VIL VSUP - 3.85 V | Thresholds differ; firmware and interface assumptions may not port 1:1 |
| LIN pull-up / termination | Integrated termination resistor, extracted values 20 / 30 / 47 kOhm | Integrated pull-up 20 / 45 / 60 kOhm, feature summary says 45 kOhm nominal | Pull-up network values differ |
| LIN capacitance | 30 pF max | 25 pF | IC1 is slightly lower |
| Data rate | Up to 20 kBd | TX up to 20 kbps, RX up to 100 kbps | IC1 explicitly supports faster receive path |
| Temperature range | Junction / virtual junction -40 C to +150 C | Junction -40 C to +150 C operating, abs max to 165 C | Similar operating range; IC1 has higher absolute max junction rating |
| ESD robustness | Explicit: +-6 kV IEC 61000-4-2 on LIN/VBAT/WAKE, stronger HBM/CDM detail | Protection features listed, but less ESD detail in extracted section | U1 provides more explicit ESD numbers |
| Package / footprint style in project | 8-pin device with dual GND pins in the symbol | 8-pin device plus EP on pin 9 in the symbol | Pin-count presentation differs in your schematic symbols |
Pinout comparison
| Pin # | U1 | IC1 | Difference |
|---|---|---|---|
| 1 | RXD | RXD | Same |
| 2 | ~SLP~ | EN | Same control role class, but different naming and likely different logic interpretation |
| 3 | ~WAKE~ | WAKE | Similar purpose, naming polarity differs |
| 4 | TXD | TXD | Same |
| 5 | GND | GND | Same |
| 6 | LIN | LIN | Same |
| 7 | VBAT | VSUP | Same supply role, different naming |
| 8 | INH | INH | Same |
| 9 | GND | EP | Major package difference in the current symbols: U1 shows a second GND pin, while IC1 shows an exposed pad |
Main takeaways
| Topic | Summary |
|---|---|
| Best electrical robustness | IC1 |
| Best supply-voltage flexibility | IC1 with 4.5 V to 36 V operation |
| Stronger INH output capability | U1 |
| Better-extracted low-power current detail | U1 |
| More automotive-specific positioning | IC1 |
| Biggest practical migration risk | Control-pin semantics and the package/pad difference at pin 9 |
The biggest differences are:
- IC1 is electrically wider-range and more fault-tolerant.
- U1 has a much stronger INH output capability.
- The control pins are not a drop-in semantic match:
~SLP~vsEN, and~WAKE~vsWAKE. - Your symbols also differ at pin 9: U1 has a second ground pin, while IC1 has an exposed pad.
If you want, I can also make a second table that is strictly parameter-by-parameter with only numeric electrical specs side by side.
Numeric-only comparison table
Check symbol mismatches
Compare standby behavior
11 days
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