Updated power-part properties and net metadata for current, temperature, thermal, and layout constraints.
Updated the Design Notes with the full power-section review and required fixes.
Important findings:
The existing 33µH inductor and SS34 diode are marginal for a robust 24V/3A industrial LM2596 design.
The schematic still needs explicit PTC fuse, reverse-polarity protection diode or ideal-diode MOSFET stage, and real LM2596 VIN/5V bulk capacitors.
The 3.3V LDO is electrically valid, but thermally risky above a few hundred mA continuous because it dissipates (5V − 3.3V) × IOUT. For a heavy RP2350B/W5500/USB-hub system, a 3.3V buck or buck-plus-LDO architecture is safer.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant