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Documents are markdown text files which describe project goals, capture details, or even simulation outputs.
Assets
oshpark-4l.png
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[4-layer] OSHPARK Constraints - Midas
Use this template if you're planning to get your board manufactured in OSHPARK. It has the via min/max and trace width constraints already baked as global rules. #project-template #template#manufacturer-design-rules
OSHpark 4-layer stackup specs:
Top overlay or silkscreen: 1 mil thick
Top solder mask or solder resist: 1 mil thick
Top copper: 1.7 mil thick on 1 oz copper
Dielectric: 7.96 mil thick FR408HG 2113
Mid layer 1: 0.68 mil thick on 0.5 oz copper
Dielectric core: 39 mil thick FR408HR
Mid layer 2: 0.68 mil thick on 0.5 oz copper
Dielectric: 7.96 mil thick FR408HG 2113
Bottom copper: 1.7 mil thick on 1 oz copper
Bottom solder mask or solder resist: 1 mil thick Bottom overlay or silkscreen: 1 mil thick
Properties
Properties describe core aspects of the project.
Pricing & Availability
Distributor
Qty 1
Controls
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