USB-C Sensor Node
Worked for 4 mins 26 sec
Implemented the schematic for the USB-C powered Wi‑Fi/BLE temperature/humidity node. It uses a SiWG917 Wi‑Fi/BLE 5.4 module, SHT41 T/RH sensor, USB-C sink input, TPS25940 true reverse-blocking eFuse with OVP/UVLO/OCP/soft-start, MP28301 3.3 V buck regulator, ESD protection, reset/ISP/SWD debug, I2C pull-ups, and status LED.
Created project files:
Open items:
- PCB layout/routing is not done yet, so airwire DRC errors are expected.
- Generic passives still need final manufacturer MPNs before manufacturing export.
- Layout must enforce the SiWG917 antenna keepout and thermal isolation around the SHT41.
Suggested next steps:
- Set board size/stackup and move into PCB placement.
- Place U1 at the board edge with antenna keepout and U4 away from heat sources.
- Route power, buck, I2C, SWD/UART, and USB-C protection paths.
- Assign final passive MPNs and run full DRC/manufacturing checks.
Thought for 8 sec
I can prepare the PCB for assembly—placement, routing, DRC, BOM, pick-and-place, Gerbers, and assembly notes—but I cannot physically manufacture or solder it.
So far, the 46-component schematic and supporting documentation are complete. PCB layout/routing, final passive MPN selection, validation, and manufacturing exports remain. I can’t execute those steps right now because the account has no available ACUs; once ACUs are available, the next step is PCB placement with the RF antenna keepout and thermally isolated SHT41 sensor.
Plan PCB layout
Finalize passive MPNs
Document layout constraints
Replenish ACUs
