KiCad Project Overview

flux

Work done
  • Audited the uploaded KiCad sources and confirmed the original design used mixed packages: all checked resistors were already 0603, while multiple capacitors in the KiCad PCB were still 0805 and needed migration.
  • Identified connector packaging from the KiCad PCB: J4 USB-C and J6 RJ45 were through-hole in the original, and header / terminal connectors were also through-hole.
  • Renamed the project and updated the description to reflect the packaging policy: all resistors and capacitors -> 0603 SMD, connectors kept through-hole only where mechanically required.
  • Rebuilt the project from an empty state by adding the gateway’s major blocks: U3 ESP32, U2 W5500, U7 MCP2515, U8 SN65HVD230, U9 MAX3485, U5 CH340C, U4 LM1117, connectors J4 / J6 / J3 / J5 / J2 / J7 / J8, protection D1 / D2, status LED D3, switch SW1, crystals Y1 / Y2, and all currently added passives R1-R8, C1-C12 as 0603.
  • Created project files for traceability: Design Notes and Firmware Starter.
Success criteria review
  • ✅ The project metadata and newly added passive components now follow the 0603 SMD packaging policy.
  • ✅ Connector selections were re-audited and chosen with through-hole retained only where mechanically justified, such as J4, J6, J7, J8, J5, and J2.
  • ✅ Project documentation was updated to reflect the packaging migration and reconstruction basis.
  • ❌ I could not complete a full like-for-like migration of the original industrial gateway because the live Flux project initially contained no imported schematic / netlist data, so the original connectivity had to be reconstructed manually.
  • ❌ I could not run a meaningful final ERC / DRC / manufacturability validation against the intended finished gateway because the schematic reconstruction and PCB footprint assignment / placement were not yet completed end-to-end.
  • ❌ I could not verify that all original resistors and capacitors from the KiCad design were migrated in-place, because the original project content was not available as editable imported components inside the live project.
Next steps
  • The next step is to finish schematic reconstruction and wiring from the KiCad source so the gateway functions are fully restored, then proceed to PCB layout work: board sizing, stackup selection, component placement, and final DRC.
  • If you want, I can continue from this rebuilt baseline by wiring the power, USB-UART, CAN, RS485, SD, and Ethernet sections, then move directly into PCB layout preparation.
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Schematic

Layout

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Requirements Capture — USB-C Powered Temperature/Humidity Sensor Node
Goal
Capture the top-level project requirements for a low-power consumer sensor node in Flux before any component selection or sourcing work.
4-Step Plan
  1. Define product scope and operating goals
    • Confirm the node's primary function: measure temperature and humidity and report data over Wi-Fi and Bluetooth.
    • Define the intended consumer-use context: indoor/outdoor use, expected ambient range, enclosure expectations, size targets, and user-facing behaviors.
    • Set high-level low-power goals such as standby behavior, measurement/reporting interval, and whether USB power is continuous or only used for setup/charging-style powered operation.
  2. Capture the power-input and protection requirements
    • Define the USB-C power-input requirement as 5 V default sink operation only (no USB-PD negotiation in this phase).
    • Record that the design must safely tolerate common source capabilities from 0.5 A to 3 A and must not assume more current than the attached source can provide.
    • Capture required protection features at the requirements level: reverse-polarity protection, over-voltage protection (OVP), under-voltage lockout (UVLO), over-current protection (OCP), and consumer-use robustness.
    • Note supporting consumer-use requirements such as ESD resilience, safe fault behavior, and protection against incorrect/poor-quality USB power sources.
  3. Capture functional subsystem requirements
    • MCU requirement: dual-radio Wi-Fi + Bluetooth capable device, with enough GPIO/interfaces for sensor, status, and provisioning needs.
    • Sensor requirement: digital temperature/humidity sensor with defined accuracy, update rate, and interface expectations.
    • Define system-level behaviors: startup, sensor sampling cadence, wireless provisioning/update behavior, normal reporting mode, and fault/status indication.
    • Record any expected user or manufacturing interfaces such as debug/programming access, test points, LEDs, or buttons.
  4. Translate requirements into Flux planning artifacts
    • Create a top-level block diagram in Flux with these blocks: USB-C input, protection/power path, regulation, MCU/radios, sensor, user/status interface, and programming/test interface.
    • Define interface boundaries and named nets at a conceptual level only (USB 5V input, protected power rail, logic rail, sensor interface, radio/antenna area, debug interface).
    • Write acceptance criteria for the next phase so component research stays scoped: power budget target, required protections, radio capability, sensor interface, consumer-use constraints, and any certification/manufacturing considerations.
    • Do not select exact parts yet; use this step only to lock the requirements and architecture boundaries for later schematic capture.
Out of Scope for This Phase
  • Exact component selection
  • Sourcing or BOM work
  • PCB layout decisions
  • Detailed firmware design
  • Compliance testing strategy beyond capturing requirements

  • Goal

  • 4-Step Plan

  • Out of Scope for This Phase