Component Selection Sources


Worked for 3 mins 31 sec
Thought for 23 sec — Assessing wire connections
Reading schematic details for J1, U1, U2 and 8 more.
Thought for 39 sec — Considering debug options
Added D3 and D4.
Thought for 3 sec — Considering wiring options
Connected J1:VBUS, J1:VBUS__1, U2:IN and 30 more.
Thought for 14 sec — Continuing configuration process
Connected U2:OUT, C3:P1, U3:VIN1 and 24 more.
Thought for 12 sec
Connected U3:SW, L1:1, L1:2 and 18 more.
Thought for 13 sec
Connected U1:VBATT, U1:ULP_IO_VDD, U1:IOVDD and 31 more.
Thought for 18 sec
Connected U4:VDD, C15:P1, R9:P2 and 14 more.
Thought for 17 sec
Connected U1:POC_OUT, R13:P1, U1:POC_IN and 23 more.
Thought for 15 sec — Debugging header pins
Connected J2:1, J2:3, J2:5 and 9 more.
Thought for 11 sec
Wired pins.
Thought for 14 sec
Updated GND, VBUS_RAW, VBUS_PROT and 5 more.
Thought for 13 sec
Referenced guidance.
Reading project docs.
Getting a schematic overview.
Thought for 14 sec — Updating tasks
5/6 Create firmware/regulatory/bring-up project files

Rename project, create specification, and record initial requirements/power budget

Select library parts for MCU, T/RH sensor, USB-C input, regulator, and protection

Add main components and supporting passives to the schematic

Wire USB-C power/protection, 3.3 V rail, MCU boot/debug, USB data, I2C sensor, and indicators

Create firmware/regulatory/bring-up project files

Run schematic/design checks and fix actionable issues

Thought for a moment
Planning firmware documentation
I need to create documentation for the firmware starter. Since the SIWG917 isn’t an ESP32, there’s no common Arduino framework here. I’ll use the Silicon Labs Simplicity SDK instead. I might need to write C starter code with the Gecko SDK, which can be tricky to compile. I'll create the main C file, incorporating the em_i2c while using the WiseConnect SDK as well. It’s essential to include SHT4x low-level I2C and consider regulatory documents like the TCF.
Organizing regulatory documentation
I’m wondering if creating four documents might be overkill. What's the minimum regulatory documentation we actually need? It looks like I should produce a top-level Technical Construction File that includes checklists, RF notes, and a block diagram. I also consider adding a Preliminary Safety/FMEA, but given that this device is USB powered and doesn’t deal with mains or battery charging, it might not be needed. I can produce deliverable documents like the Declaration of Conformity and a user manual outline. Overall, I need to create concise
I have a question for you, how do you search components? Like how do you know which ones to pick from? Where is your database from?
I select parts by matching requirements—electrical limits, interfaces, package, availability, certifications, and datasheet recommendations—against Flux’s component library and verified manufacturer data.
For this project, no additional component search or design edits were completed in this turn, and the project remains in its prior state. Execution stopped because your ACUs ran out.
Ask about library sources
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Project Specification — USB-C WiFi BLE TH Sensor
Project Overview
Status: Draft schematic in progress.
A consumer USB-C powered temperature and relative humidity sensor node with Wi-Fi and Bluetooth Low Energy connectivity. The board uses a protected USB-C 5 V sink input, local 3.3 V regulation, a low-power Wi-Fi/BLE MCU module, and a digital I2C T/RH sensor.
Intended Use
  • Indoor consumer environmental monitoring node.
  • Powered from USB-C 5 V chargers, hubs, or ports.
  • Designed for prototype-to-production learning; not medical, industrial safety, or outdoor/weatherproof use unless later specified.
What the Device Should Do
  • Measure ambient temperature and relative humidity.
  • Connect over 2.4 GHz 802.11 b/g/n Wi-Fi.
  • Support BLE 5.x provisioning or local telemetry.
  • Power from USB-C default 5 V sources.
  • Survive common consumer input faults with reverse-current, overvoltage, undervoltage, and overcurrent protection.
Main Features
  • USB-C receptacle configured as sink-only with independent CC1/CC2 5.1 kΩ Rd resistors.
  • Protected 5 V input sized for 0.5–3 A capable sources, while the node itself is expected to draw well below 500 mA average.
  • 3.3 V logic rail for MCU and sensor.
  • Native USB data/programming path where supported by the selected MCU.
  • Boot/reset controls, debug/programming access, and status LED.
System Architecture

Diagram


I2C USB D+/D- USB-C Receptacle node_5V Sink VBUS Protection OVP UVLO OCP Reverse Blocking 3.3V Regulator WiFi/BLE MCU Module Digital T/RH Sensor Status LED
Hardware Subsystems
  • Power input: USB-C receptacle, CC pull-downs, VBUS ESD/TVS, protected power switch/eFuse or load switch with OVP/UVLO/OCP/reverse-current blocking.
  • Regulation: 5 V to 3.3 V rail sized for Wi-Fi transmit current peaks.
  • Compute/radio: certified ESP32-family module preferred to avoid custom RF matching and simplify regulatory work.
  • Sensor: digital I2C temperature/humidity sensor with local decoupling and one shared I2C pull-up pair.
  • User/debug: reset and boot controls, status LED, USB programming, optional exposed test/debug header.
Interfaces and Connections
  • External: USB-C 5 V power and USB 2.0 D+/D- for programming/debug.
  • Internal: 3.3 V rail, GND, I2C SDA/SCL, boot/reset, status LED GPIO.
  • RF: integrated 2.4 GHz antenna module; PCB layout must provide the module antenna keepout.
Power and Runtime Expectations
  • Source: USB-C 5 V default power only; no battery in this revision.
  • Source capability planning: tolerate 0.5 A, 1.5 A, and 3 A capable USB-C sources. Do not assume the device may draw 3 A unless CC current advertisement is measured/implemented.
  • Low-power behavior: firmware should sleep between samples and radio transmissions, but USB-powered operation makes absolute sleep current less critical than thermal and regulatory behavior.
Power Tree and Power Budget

Table


RailLoadSleepTypical activePeak
3.3 VWi-Fi/BLE MCU module~10–100 µA deep sleep~80–240 mA radio active~500 mA short Wi-Fi TX burst
3.3 VT/RH sensor<1 µA standby~0.5–1 mA measuring~1 mA
3.3 VStatus LED0 mA off~2 mA on~5 mA configured max
3.3 VPull-ups/leakage~1–2 mA worst when lines lownegligible average~1.4 mA for two 4.7 kΩ pull-ups low
Estimated 3.3 V rail sizing target: 250 mA typical active, 510 mA transient peak. For an LDO from 5 V, input current is approximately output current; thermal at 250 mA is about (5.25 V - 3.3 V) × 0.25 A = 0.49 W, so a small SOT-23 LDO may be marginal during sustained Wi-Fi. Preferred choices are a high-current low-Iq regulator in a thermally capable package or a quiet buck regulator if sustained radio current/thermal limits demand it.
Manufacturing and Assembly Expectations
  • Default assembly: SMD, production-intent consumer PCB.
  • Use stocked, non-EOL parts where available.
  • Add test points for 5 V protected rail, 3.3 V, GND, reset/boot, and I2C if space permits.
Firmware-Relevant Hardware Requirements
  • Define actual GPIO pins for I2C SDA/SCL and status LED.
  • Provide USB programming or serial/JTAG path.
  • Support Wi-Fi + BLE provisioning, periodic sensor reads, and telemetry output.
  • Include boot/reset access for field recovery.
Physical Design Expectations
  • ESP32 module antenna must be placed at board edge with no copper/traces/components in the keepout on all layers.
  • Sensor should be isolated from regulator/MCU heat sources and exposed to ambient airflow.
  • USB-C connector should be board-edge mounted and mechanically reinforced.
Important Design Decisions
  • Use an ESP32-family certified module rather than a bare RF SoC.
  • Use a digital I2C humidity/temperature sensor.
  • Use USB-C sink-only 5 V; no USB-PD negotiation in this revision.
  • Include a protected VBUS front end instead of relying on a fuse alone.
Assumptions
  • Indoor consumer use, ambient operating range roughly 0–50 °C unless later expanded.
  • No enclosure dimensions or board size provided yet.
  • No cloud protocol specified; firmware examples will print readings and include Wi-Fi/BLE placeholders.
Change Notes
  • Initial requirements captured from user request on 2026-07-17.
  • Project Overview

  • Intended Use

  • What the Device Should Do

  • Main Features

  • System Architecture

  • Hardware Subsystems

  • Interfaces and Connections

  • Power and Runtime Expectations

  • Power Tree and Power Budget

  • Manufacturing and Assembly Expectations

  • Firmware-Relevant Hardware Requirements

  • Physical Design Expectations

  • Important Design Decisions

  • Assumptions

  • Change Notes