4-Layer PCB Design for Servo Controller


I’ll replace U3 and update R19, but first I need to identify the intended replacement parts/values from the project state and any uploaded reference. I’ll inspect U3/R19, check available replacements, then preserve or restore their connections after the swap.
I inspected U3 and R19. U3 is currently TXS0102DCTR wired as the 3.3 V ↔ 5.1 V I2C level shifter, and R19 is the 4.7 kΩ SDA_5V pull-up to 5V1_LOGIC.
I’m blocked because replacing U3 requires the exact new level-shifter part/MPN, and replacing R19 requires the intended resistor value/package or whether it should be removed. Send the replacement part for U3 and the intended change for R19 — for example: “replace U3 with PCA9306” and “change R19 to 10 kΩ / remove R19.”
remove both and place new one
I’ll remove the existing level shifter and pull-up resistor, then add a fresh level-shifter component back in place and restore its I2C/power connections without the R19 pull-up.
Done. Removed the old U3 and R19, added a fresh U3 TXS0102DCTR, restored its SDA/SCL, power, OE, and GND connections, and placed it back in the interface cluster near J1/J2 and the related resistors.
Note: R19 is now removed, so the SDA_5V pull-up is gone; SCL_5V still has R20. The focused check did not report U3/R19-related issues, but the broader project may still have the previous layout/routing issues.
Add SDA pull-up
Check level shifter
Check pull-up values
Move R20 closer

Implementation Status
Placement cleanup completed
  • Board remains configured as a 120 mm x 70 mm, 4-layer rectangle.
  • Servo output connectors J3 and Servo1-Servo16 were re-arranged into a single bottom-edge connector bank for cable access.
  • The 6 V servo rail connector J20 was moved adjacent to the servo connector bank on the bottom edge.
  • All inspected major components remain on the top layer.
  • U1/U2 PCA9685 controller blocks remain near their PWM resistor/decoupling support components, and U3 remains near the Raspberry Pi and STM32 header control block.
Verification
  • Placement checks report no component overlap, no out-of-bounds components, no unplaced components, no spacing problems, and top-layer-only placement is maintained.
  • Layout density is low: approximately 26.1% component fill on the 120 mm x 70 mm board, so routing space remains generous.
Remaining before routing/manufacturing
  • The post-placement electrical/layout review still reports unresolved routed-copper issues from the previous partial routing state: airwires, dangling trace segments, and copper overlaps around moved connectors/traces.
  • These are not component-placement failures; they are stale/partial routing artifacts that need a route cleanup/rip-up and fresh routing pass before the design can be considered DRC-clean.
  • Stackup copper thickness still appears as 0.035 mm in the current stackup listing; update fabrication stackup if the target is 2 oz copper (~0.07 mm).
  • Placement cleanup completed

  • Verification

  • Remaining before routing/manufacturing