Placement is locked — do not move components. Make these two fixes:
FIX 1 — Via layer span (clears all 52 "Invalid Layer" errors): All 52 Smart Vias were created with a Through-hole L1→L4 span, but this board is 2-layer. Redefine the via span for these vias to Top Copper → Bottom Copper (the only two copper layers). Apply to all 52 invalid vias. Do not move or delete the vias — only correct their layer span.
FIX 2 — Clear the pad overrides on C_5V (clears the 2 Component Override warnings): Remove the pad-level keepout/minKeepout overrides on C_5V pads P1 (+5V) and P2 (GND) so the pads use the normal board design rules. Do not move C_5V.
Then re-run DRC and report the remaining error count by type.
Fixed all 52 Invalid Layer via errors by changing the Smart Vias from invalid L1→L4 span to valid Top→Bottom for the 2-layer board.
Removed inline C_5V pad keepOut, minKeepOut, and active rules without moving C_5V or any components.
Latest DRC counts:
Invalid Layer: 0
Overlapping copper: 0
Airwires: 34
Floating copper: 20
Component Override warnings: 2 still remain on C_5V P1/P2
Other checked categories: no open protected-intrusion, under-connected-via, pad-access, outside-board, or component-body-overlap items reported.
Remaining:
The two C_5V override warnings are separate override-ruleset objects (active=false !important) that the current edit tool did not allow me to delete directly.
ACUs are now unavailable, so I can’t continue further in this turn.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant