ESP32C6 BNO055 PCB

I’ll redesign for the fixed 10 × 30 mm target by replacing the ESP32 module with a smaller nRF52840 solution and swapping the JST-PH for LiPo solder pads, then re-check fit.
Blocked: the account has no available ACUs, so I can’t continue executing validation/layout placement.
Accomplished so far:
  • Replaced the ESP32-C6 module with bare nRF52840-QFAA-F-R.
  • Replaced JST-PH with direct LiPo solder pads BAT+ / BAT-.
  • Added compact TDK ANT016008LCS2442MA2 chip antenna and RF matching placeholders.
  • Added required 32 MHz Epson FA-128 crystal, load caps, nRF DEC capacitors, and SWD programming pads.
  • Rewired BNO086 I2C/control, RGB LED, motor GPIO, power, ground, and battery input to the nRF architecture.
  • Removed unused BNO environmental-bus pullups to save space.
Remaining work:
  • Re-run ERC to confirm the latest nRF no-connect/DEC fixes are clean.
  • Re-place the 10 × 30 mm PCB with BNO086 centered.
  • Check whether the current BNO086 footprint/courtyard is still oversized versus the real 3.8 × 5.2 mm LGA.
  • Run DRC/density checks and decide whether more part/package reductions are needed.
Review and place
Run ERC
Check BNO086 footprint
Place compact layout
Find smaller passives

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10x30mm Layout Feasibility Note
Date: 2026-07-13
Requested constraint
  • Board outline: 10 mm x 30 mm
  • BNO086 at exact center
  • ESP32-C6, BNO086, RGB LED, vibration motor, JST-PH 2P LiPo input, and 3.3 V regulation on board
Changes applied
  • PCB outline set to 10 mm x 30 mm rectangle with 0.5 mm corner radius.
  • Best-effort placement was attempted with bottom-side passives allowed.
  • BNO086 was then moved toward the board center, but the layout engine clamped it because the current library footprint/courtyard is wider than the 10 mm board.
Feasibility findings
  • Total component footprint area: 608 mm^2.
  • Board area: 300 mm^2.
  • Fill ratio: 202.7% before routing; this exceeds the physical board area and is not manufacturable/routable as-is.
  • Placement engine recommendation: at least 13 mm x 39 mm for the current architecture.
  • Current large blockers:
    • ESP32-C6-MINI-1-N4 module footprint: approximately 13.3 mm x 16.65 mm, larger than the 10 mm board width.
    • JST-PH SMD connector footprint: approximately 9.2 mm x 10.2 mm, nearly the full board width before clearance.
    • SMD vibration motor footprint: approximately 6.1 mm x 12.85 mm.
    • Current BNO086 layout footprint/courtyard reports approximately 17.44 mm x 7.2 mm, so it cannot be legally centered inside a 10 mm wide board using the current footprint representation.
Current project state
  • The schematic contains 38 physical components and 27 nets.
  • The board outline is now 10 mm x 30 mm.
  • Most components remain outside the board because fitting them into 10 mm x 30 mm is infeasible with the selected footprints.
  • ERC currently reports expected unused ESP32 GPIO floating-pin warnings; no power-pin errors were reported in the sampled review.
  1. Increase board size to at least 13 mm x 39 mm for the current ESP32-C6-MINI module architecture, then rerun placement.
  2. If 10 mm x 30 mm is non-negotiable, redesign around smaller parts:
    • bare ESP32-C6 QFN instead of ESP32-C6-MINI module,
    • smaller battery connector or solder pads instead of JST-PH,
    • smaller vibration motor or off-board motor connector,
    • verify/correct the BNO086 footprint/courtyard to the actual bare LGA dimensions.
  3. Consider separating the battery connector or motor off-board to preserve the narrow sensor form factor.
  • Requested constraint

  • Changes applied

  • Feasibility findings

  • Current project state

  • Recommended paths

Assets

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ESP32-C6 BNO086 Sensor Board

ESP32-C6 BNO086 Sensor Board thumbnail
Battery-powered narrow ESP32-C6 sensor board with centered BNO086 IMU, RGB status LED, SMD vibration motor, and JST-PH LiPo input regulated to 3.3V.

Properties

Properties describe core aspects of the project.

Pricing & Availability

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Digi-Key

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Mouser

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TME

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Verical

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