Steps 1–6 of the implementation plan (project description, system architecture, ICs, active/passive parts, connectors/peripherals) have been finished.
Tasks remaining
7. Make all net connections
8. Review schematic for completeness
9. Footprint review
10. Define 2-layer PCB stackup
11. Set board size to 50 mm × 35 mm
12. Assign copper layers for VCC and GND planes
13. Enable ground fills on both layers
14. Add four M2 mounting holes (3 mm from edges)
15. Pause for review of dimensions, mounting holes, and stackup
Success criteria have not yet been met; the netlist and layout preparation are still pending.
Recommended next step
Proceed with step 7: wire up all power, signal, and ground nets in the schematic.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant