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Thought for 7 sec — Determining layout skills
Looking up How should thermal relief be applied to top-layer ....
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flux

  • Set P1's thermalRelief to "Relief connect"
  • Set P1's thermalRelief to "Relief connect"
  • Set GND's thermalRelief to "Relief connect"
  • Set P1's thermalRelief to "Relief connect"
  • Set VSS's thermalRelief to "Relief connect"
  • Set K's thermalRelief to "Relief connect"
  • Set 1's thermalRelief to "Relief connect"
  • Set P1's thermalRelief to "Relief connect"
  • Set S's thermalRelief to "Relief connect"
  • Set P2's thermalRelief to "Relief connect"
  • Set PIN2's thermalRelief to "Relief connect"
  • Set SHIELD's thermalRelief to "Relief connect"
  • Set SHIELD's thermalRelief to "Relief connect"
  • Set SHIELD's thermalRelief to "Relief connect"
  • Set GND's thermalRelief to "Relief connect"
  • Set SHIELD's thermalRelief to "Relief connect"
  • Set SHIELD's thermalRelief to "Relief connect"
  • Set SHIELD's thermalRelief to "Relief connect"
  • Set P1's thermalRelief to "Relief connect"
  • Set P1's thermalRelief to "Relief connect"
  • Set 5's thermalRelief to "Relief connect"
  • Set 4's thermalRelief to "Relief connect"
  • Set S's thermalRelief to "Relief connect"
  • Set THR's thermalRelief to "Relief connect"
  • Set GND's thermalRelief to "Relief connect"
  • Set +'s thermalRelief to "Relief connect"

flux

Updated 26 top-layer pads connected to the GND net to use thermalRelief = Relief connect. Verified the updated GND pads now compute as thermalReliefType: Relief connect; component placement, routing, and net connectivity were not changed. DRC still reports existing dangling/floating/overlapping copper issues, but no new thermal-relief-specific issue was reported.
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Schematic

Layout

3D View

R8
Resistance
Resistance
R10
Resistance
Resistance
R7
Resistance
Resistance
R9
Resistance
Resistance
C4
Capacitance
Capacitance
Q1

NF-Universal Alarm

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