Reviewed the current schematic and layout state for U1, U2, P1, P2, passives, test points, and mounting holes.
Confirmed the actual blocker in the layout: the board still contains many legacy route segments on invalid inner layers from an older 4-layer state, plus overlapping and floating copper.
Reapplied conservative board-level layout rules for the current 2-layer board and removed one stale layout-level layer override.
Verified that manufacturing MPN and footprint checks are clean, but PCB DRC is still not clean.
Success criteria review
✅ Identified the root cause of the remaining PCB issues.
✅ Verified the project is using a 2-layer stackup in the active layout view.
❌ Component placement was not completed in this session.
❌ Airwires, floating copper, and overlapping copper were not cleared.
❌ The antenna keepout and final silkscreen placement were not completed.
Next steps
The next step is to remove or regenerate the legacy invalid-layer route segments, then place U1 at the board edge with antenna clearance, place the remaining components per the placement plan, and re-run DRC until airwires and copper errors are resolved. I cannot continue that execution in this session.
Production-grade 2-layer SELV logic board for an ESP8266 smart relay controller.
Locked requirements
MCU module: ESP-12F
Input rail: 5 V SELV
Local regulation: MCP1700-3302E, 5 V to 3.3 V
Board size: 55 mm x 45 mm
Layer count: 2
Placement: all components on top side
Bottom copper: solid ground pour
RF: ESP-12F antenna keepout required
Mechanical: 4 x M3 mounting holes
User access: exact 2x7 connector pinout, 4-pin programming header, GPIO0 flash test point
Indicators: active-low status LED on GPIO2
Validation: test points on power rails and used GPIOs
Marking: silkscreen labels for connectors, test points, and board/version ID
Safety intent
Logic board remains SELV only.
No mains or hazardous voltages are routed on this board.
External interfacing should remain within SELV limits.
Design defaults selected
Use 10 kOhm bootstrap pulls for ESP8266 boot-critical pins.
Use 100 nF local decoupling near ESP module supply pins.
Use 10 uF bulk capacitance on 5 V input and 3.3 V rail.
Use UART header exposing 3.3 V, GND, TXD0, RXD0.
Place the ESP-12F at a board edge with copper exclusion under the antenna zone.
Scope
Locked requirements
Safety intent
Design defaults selected
Reviews
Documents
design-notes
Project Specification
Assets
Assets are files uploaded to this project which can be used in various ways.
2-layer SELV ESP8266 smart relay logic board using an ESP-12F module, MCP1700-3302E 5V-to-3.3V LDO, exact 2x7 relay/control connector pinout, 4-pin UART programming header, GPIO0 flash test point, active-low GPIO2 status LED, power and GPIO test points, 55x45 mm board outline, top-side assembly, bottom solid ground pour, ESP-12F antenna keepout, 4 M3 mounting holes, and silkscreen connector labels for production use.
Properties
Properties describe core aspects of the project.
Pricing & Availability
Distributor
Qty 1
Arrow
$2.67–$247.95
Digi-Key
$2.76–$707.06
LCSC
$6.26–$81.33
Mouser
$4.59–$486.15
TME
$0.84
Verical
$2.53–$75.21
Controls
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