Project Documentation


Created 7 project docs

Project Specification

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Project Specification Project Overview
Status: Review
A compact, battery-powered tinyML audio and environmental data-collection board based on the RP2040. The device records digital microphone data to microSD, can attach a DHT11/DHT22 sensor, and reports status or summarized data over LoRaWAN through a LoRa-E5 module. It supports USB or solar-assisted charging of a single-cell Li-ion/Li-polymer battery and is packaged in a two-piece FDM enclosure.
Intended Use
  • Community development and field data collection for tinyML audio applications.
  • Local audio capture and storage where Wi-Fi is unavailable.
  • Periodic low-bandwidth LoRaWAN telemetry rather than streaming raw audio over LoRa.
  • Prototype and validation platform; the current revision is not yet production-qualified.

Power Budget

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Power Budget Status and Method
Status: Preliminary engineering budget for review. It is grounded in the live schematic, but several load currents are planning allowances because the exact SD card, DHT sensor, firmware duty cycle, battery, and solar panel are not selected.
The power path is:
Confirmed Electrical Facts
  • Main regulated system rail: +3V3.
  • Internal RP2040 core rail: +1V1, generated by the RP2040 internal regulator.
  • Battery rail: VBAT, a single Li-ion/Li-polymer cell charged to 4.2 V by U5.
  • Charge-current intent: approximately 900 mA according to the schematic annotation and R7 = 2 kOhm.
  • U4 RT8059 is rated in project component data as a 1 A buck converter with 2.8 V to 5.5 V input.

Firmware Getting Started

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Firmware Getting Started Platform and Toolchain
  • MCU: RP2040 U1
  • Framework: Arduino-Pico
  • Build system: PlatformIO
  • Debug: USB serial for logs, SWD through J8 for recovery and source-level debugging
  • Flash: W25Q128JVSIQ external QSPI, 16 MiB
Pin Mapping Recommended Firmware State Machine PlatformIO Configuration
The exact Arduino-Pico release and SDIO/I2S libraries must be pinned after a compile-tested implementation. The microSD wiring is 4-bit SD, not conventional SPI; do not silently substitute an SPI example without rewiring hardware.
Initial Bring-Up Source
This source is intentionally limited to peripherals that can be initialized with stable Arduino-Pico APIs from the confirmed schematic: USB logging, user LED, DHT, LoRa UART/reset,...

Board Bring-Up Plan

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Board Bring-Up Plan Prerequisites
  • Current-limited bench supply, battery simulator or protected single-cell battery, DMM, oscilloscope, logic analyzer, USB cable, SWD probe, known-good microSD card, LoRa antenna, and optional DHT11/DHT22.
  • Start without battery, SD card, antenna pigtail stress, or external sensor fitted unless the step requires it.
  • Use ESD precautions for U1, U2, U6, MK3, and RF connector J4.
  • Never transmit U6 without an appropriate antenna connected.
  • Initial current limit: 100 mA for static rail checks; raise only after the rail is verified.
1. Visual and Unpowered Inspection
  • Verify orientation and solder quality of U1, U2, U4, U5, U6, D1, Q2, LEDs, and polarized connectors.
Show 3 More
Created and verified seven detailed project files grounded in the current schematic, BOM, PCB layout, firmware history, and enclosure design:
Open items
  • Battery capacity, protection, and permitted charge rate remain unspecified.
  • Solar-panel rating, recording duty cycle, LoRa interval, and runtime target are unspecified.
  • The buck-only 3.3 V supply may lose regulation as the Li-ion cell discharges.
  • SDIO and I²S firmware still require compile-tested library implementations.
  • Charge current, power consumption, thermal behavior, RF performance, and enclosure fit require physical measurements.
Suggested next steps
  1. Select the battery and solar panel, then finalize the power budget.
  2. Run a complete schematic/ERC and power-path review.
  3. Implement and compile-test the audio and SDIO firmware.
  4. Execute the board bring-up and validation plans on assembled hardware.

Project Specification
Project Overview
Status: Review
A compact, battery-powered tinyML audio and environmental data-collection board based on the RP2040. The device records digital microphone data to microSD, can attach a DHT11/DHT22 sensor, and reports status or summarized data over LoRaWAN through a LoRa-E5 module. It supports USB or solar-assisted charging of a single-cell Li-ion/Li-polymer battery and is packaged in a two-piece FDM enclosure.
Intended Use
  • Community development and field data collection for tinyML audio applications.
  • Local audio capture and storage where Wi-Fi is unavailable.
  • Periodic low-bandwidth LoRaWAN telemetry rather than streaming raw audio over LoRa.
  • Prototype and validation platform; the current revision is not yet production-qualified.
  • Indoor or sheltered outdoor deployment only until ingress, condensation, UV, thermal, and battery safety testing is completed.
What the Device Should Do
  • Boot from external QSPI flash and expose USB device/serial functionality.
  • Acquire mono digital audio from the ICS-43434 I2S microphone.
  • Store recordings, features, logs, and configuration on microSD.
  • Communicate with the LoRa-E5 module using UART and hardware reset.
  • Optionally read a DHT11 or DHT22 through the external sensor connector.
  • Indicate user, source, and charging states through LEDs.
  • Operate from a single-cell battery and charge from USB or a solar source.
  • Support SWD debugging, reset, and bootloader entry.
Main Features

Table


AreaImplemented hardware
ComputeRP2040 dual-core MCU, 12 MHz crystal, 128 Mbit W25Q128 QSPI flash
AudioICS-43434 digital I2S microphone with acoustic opening in enclosure
StoragemicroSD connector using a 4-bit SD interface
WirelessSeeed LoRa-E5 module, UART control, reset, IPEX/U.FL antenna connector
EnvironmentFour-pin DHT11/DHT22 connector with data pull-up
PowerMicro-USB input, solar terminal, CN3063 single-cell charger, battery connector, RT8059 3.3 V buck regulator
Debug/UISWD header, BOOT and RESET switches, user and power/charge LEDs
Mechanics42 x 57 mm, 4-layer PCB; 50 x 65 x 13.52 mm PETG enclosure with four M2-class board mounts
Mechanical System Architecture

Diagram


"External environment" "Bottom acoustic grille" "PCB microphone" "PETG base\nPCB supports and bosses" "42 x 57 mm PCB" "PETG lid\nports buttons and LED windows" "USB SD sensor battery solar and debug access" "External LoRa antenna" "IPEX pigtail exit"
Mechanical baseline:
  • Enclosure envelope: 50 x 65 x 13.52 mm, rounded rectangular shell.
  • PCB envelope: 42 x 57 mm, 1.52 mm nominal thickness.
  • Four mounting locations at approximately (+/-17.66, +/-25.18) mm from the PCB datum.
  • Current enclosure is designed for PETG FDM with a 0.40 mm nozzle.
  • Physical fit, cable insertion, connector latch access, antenna strain relief, water ingress, and acoustic response remain validation gates.
Electrical System Architecture

Diagram


"Micro USB 5 V" "Source OR and protection" "Solar input" "CN3063 Li-ion charger" "Single-cell battery" "RT8059 3.3 V buck" "3.3 V rail" "RP2040" "LoRa-E5" "ICS-43434 microphone" "microSD" "DHT connector" "W25Q128 QSPI flash"
Hardware Subsystems
Power input and charging
  • J3 provides Micro-USB power and USB 2.0 data.
  • J5 accepts an external solar source.
  • Q2 and D1 form the input-selection path into VIN_CHARG.
  • U5 CN3063 charges one Li-ion/Li-polymer cell on VBAT.
  • R7 is 2 kOhm and the schematic note states a nominal 900 mA charge-current intent.
  • D4 and D5 indicate charge and done states.
  • Battery chemistry, capacity, protection-board presence, NTC strategy, and solar panel rating are not specified and must be selected before release.
3.3 V supply
  • U4 RT8059 with L2 generates +3V3 from VBAT.
  • U3 SY6280 is placed between the buck output and the system rail as a current-limited load switch.
  • The rail powers U1, U2, U6, MK3, J1, and J6.
  • Critical risk: this is a buck-only architecture. As a single-cell battery falls near or below the required 3.3 V rail plus converter headroom, the rail can drop out of regulation. Firmware brownout behavior and usable battery cutoff must be characterized.
Compute and memory
  • U1 RP2040 at up to 133 MHz.
  • Y1 12 MHz crystal with 15 pF load capacitors.
  • U2 W25Q128JVSIQ, 128 Mbit external QSPI NOR flash.
  • Native USB D+ and D- are routed through 27.4 ohm series resistors.
Audio
  • MK3 ICS-43434 digital microphone.
  • I2S connections: GPIO9 MIC_WS, GPIO10 microphone data, GPIO11 microphone clock.
  • R15 selects the microphone left/right channel state.
  • The enclosure has a central direct acoustic bore plus six radial through-slots; no dust or water membrane is fitted.
Storage
  • J1 is a microSD socket wired as a 4-bit SD bus.
  • GPIO17 clock, GPIO18 command, GPIO19-22 data 0-3.
  • The specific card family, filesystem, sustained write rate, and worst-case current are not specified.
Wireless
  • U6 LoRa-E5 communicates by UART: GPIO0 receives from the module and GPIO1 transmits to it.
  • GPIO12 controls LORA_NRST.
  • RF exits through J4, a 50 ohm IPEX/U.FL-style connector.
  • Raw audio must not be treated as a practical LoRaWAN payload; send metadata, events, features, or short summaries.
External sensor
  • J6 supplies 3.3 V and ground and exposes DHT_DATA on GPIO16.
  • R5 is a 5 kOhm pull-up.
  • Connector pin 3 is not connected in the present netlist.
Debug and controls
  • J8 exposes SWD, SWCLK, and GND.
  • SW2 pulls RUN low for reset.
  • SW1 participates in the boot circuit; validate its complete connection during bring-up.
  • D2 is the MCU-controlled user LED on GPIO25.
Interfaces and Connections

Table


InterfaceConnector or partElectrical mapping
USB 2.0 device and powerJ3VUSB, USB_D+, USB_D-, GND
BatteryJ2Pin 1 VBAT, pin 2 GND
Solar inputJ5Pin 1 VSOLAR, pin 2 GND
microSDJ1SD_CLK, SD_CMD, SD_DATA0-3, 3.3 V, GND
LoRa antennaJ450 ohm RF signal and two grounds
DHT sensorJ63.3 V, DHT_DATA, NC, GND
SWDJ8SWD, GND, SWCLK
AudioMK3I2S WS, SCK, SD, channel select
Power and Runtime Expectations
  • Source: single-cell Li-ion/Li-polymer battery, USB charging, and solar-assisted charging.
  • Confirmed battery capacity: not specified.
  • Confirmed solar panel rating: not specified.
  • Confirmed runtime target: not specified.
  • Design objective: firmware-controlled duty cycling with LoRa and SD inactive whenever possible.
  • Runtime is scenario-dependent and shall be calculated from measured average current after battery and activity profiles are selected.
Power Tree and Power Budget
See the dedicated power budget file. Current first-pass planning values are:
  • Approximate 3.3 V peak design allowance: 430 mA.
  • Approximate continuous recording allowance: 170 mA.
  • Standby target: below 3 mA at the battery, pending measurement of the whole board.
  • U6 can draw 111 mA at maximum 22 dBm transmit power for the 868/470 MHz versions.
  • U6 sleep current is specified as 2.1 uA with WDT enabled.
  • RP2040 typical average DVDD current in dormant mode is 0.18 mA; this does not include all board-level 3.3 V loads.
Manufacturing and Assembly Expectations
  • Four-layer, 42 x 57 mm PCB with all electrical components on the top side.
  • Prototype assembly is suitable for professional SMT assembly; connectors and mounting hardware require mechanical inspection.
  • Preserve controlled 90 ohm USB differential routing and 50 ohm RF routing.
  • Add or retain accessible measurement points for VUSB, VSOLAR, VIN_CHARG, VBAT, +3V3, +1V1, GND, RUN, SWD, SWCLK, LoRa UART, and SD clock.
  • Production release requires BOM lifecycle/stock audit, impedance and RF review, final ERC/DRC, programming test, and manufacturing panel review.
Firmware-Relevant Hardware Requirements
  • PlatformIO with Arduino-Pico is the current development direction.
  • USB serial diagnostics must start before peripheral initialization.
  • Initialize safe GPIO states before enabling peripherals.
  • Control LoRa reset and verify AT response before joining a network.
  • Mount and benchmark the SD card before starting audio capture.
  • Use DMA/Pio-based I2S capture and buffered SD writes to prevent data loss.
  • Store configuration and fault logs; recover cleanly after card removal or brownout.
  • Implement watchdog, brownout-safe file closing, and explicit low-battery policy.
  • Support SWD recovery even if USB firmware is broken.
Physical Design Expectations
  • Maintain the current 42 x 57 mm R3 board outline and four mounting points unless the enclosure is revised concurrently.
  • Preserve connector and button access defined by the enclosure CAD.
  • Keep the microphone acoustic path clear and validate response with the device placed on its intended surface.
  • Provide external strain relief for the IPEX pigtail.
  • The enclosure is not sealed and must not be marketed with an IP rating.
Important Design Decisions
  • RP2040 selected for low-cost audio/tinyML experimentation and flexible PIO/DMA.
  • LoRa-E5 selected for long-range low-data-rate connectivity.
  • Local microSD storage carries bulk audio; LoRaWAN carries summaries and events.
  • Single-cell solar/USB charging uses CN3063.
  • A buck regulator is used for 3.3 V, accepting limited battery utilization near end-of-discharge unless the power architecture changes.
  • Enclosure uses two FDM-printed PETG solids and direct user access rather than moving button plungers.
Assumptions
  • Region is provisionally 868 MHz unless the deployment region specifies 915/470/434 MHz.
  • DHT sensor and microSD card are optional external loads and may vary widely.
  • Battery includes appropriate cell protection or an external protection PCB; this is not visible in the schematic.
  • No raw audio is transmitted over LoRaWAN.
  • Power values not directly specified by datasheets are marked as planning allowances and must be replaced by measurements.
Acceptance Criteria
  • All rails start reliably from USB, solar-assisted input, and battery across the intended voltage range.
  • No regulator or protection component exceeds thermal limits during charge, SD write, and LoRa TX overlap.
  • USB enumerates and SWD detects the MCU.
  • Audio capture has no dropped buffers during sustained SD writes.
  • LoRa joins and transmits through the selected regional band and antenna.
  • The enclosure allows all intended cables/cards and does not obstruct the microphone.
  • Measured standby, recording, and transmit currents are documented and meet the selected runtime target.
Change Notes
  • Initial comprehensive specification created from the live Rev 1 schematic, BOM, PCB layout, prior firmware discussion, and current R3 enclosure record.
  • Unknown battery, panel, schedule, reporting interval, and runtime values remain explicit release inputs rather than invented specifications.
  • Project Overview

  • Intended Use

  • What the Device Should Do

  • Main Features

  • Mechanical System Architecture

  • Electrical System Architecture

  • Hardware Subsystems

  • Power input and charging

  • 3.3 V supply

  • Compute and memory

  • Audio

  • Storage

  • Wireless

  • External sensor

  • Debug and controls

  • Interfaces and Connections

  • Power and Runtime Expectations

  • Power Tree and Power Budget

  • Manufacturing and Assembly Expectations

  • Firmware-Relevant Hardware Requirements

  • Physical Design Expectations

  • Important Design Decisions

  • Assumptions

  • Acceptance Criteria

  • Change Notes