Molex material number 1042240820, order number 104224-0820; official sales drawing revision A.
Symbol and terminal assignment
Completed
All ten mapped physical terminals were checked against the Molex drawing. S5 was corrected as described below.
Recommended land pattern
Completed, no geometry mutation
No confirmed footprint discrepancy was found; existing copper geometry was retained.
3D package model
Completed
Inflated/misaligned STEP was replaced by a real-mm, footprint-aligned Build123d model.
ERC / design verification
Completed for this part project
No open ERC errors or warnings remain. Standalone part projects do not provide the consuming board's BLE-module body-overlap check.
Authoritative pin assignment
The official Molex drawing assigns S1=VCC, S2=RST, S3=CLK, S4=GND, S5=VPP, S6=I/O, with G1–G4=GND.
S5 / VPP correction
Restored terminal label VPP and preserved pin number S5.
Restored the element's Part Type to Terminal.
Set Pin Type to Not Connected (a supported Flux terminal type).
Added pin description Program voltage; unused.
The physical pad remains present and has no net connection.
No other terminal electrical types were changed: the Molex drawing identifies contact functions, but does not define EDA driver-direction classifications for the passive socket. Changing the remaining Unspecified types would therefore be inference rather than correction of a confirmed datasheet mismatch.
Footprint / land-pattern audit
The footprint contains 12 copper lands: six SIM contacts S1–S6, four mapped shell/ground lands G1–G4, and two unbound PCB-retention lands 11 and 12. The S1–S6 and G1–G4 numbering/naming matches the official assignment.
The six signal lands measure 0.9906 × 0.8128 mm, matching the drawing's 1.0 × 0.8 mm recommended value within its stated ±0.05 mm layout tolerance. The existing signal-row positions, 1.2 mm spacing, shell lands, retention lands, insertion-side orientation, origin, and footprint outline were retained because no confirmed mismatch was found.
Evidence limitation: several dimensions are graphical callouts in the sales drawing and were not machine-extractable with claim-level validation. They were inspected against the existing footprint, but are not restated here as independently verified numeric claims.
3D model correction
The previous model node used 1042240820.stp, position 0 -6 0.1, and rotation 90 0 0. It was replaced with a validated, source-editable package model:
3D Model
Verified generated bounds are 11.2 × 13.1976 × 1.11 mm. The 1.11 mm connector height is specified by the Molex drawing. The model includes the shell/body, six signal tails, four shell feet, and two retention tabs aligned to the actual footprint land centres.
The model node now reads:
Asset: molex-104224-0820.build123d
Position: 0 mm, 0 mm, 0 mm
Rotation: 0°, 0°, 0°
3D scale: 1, 1, 1
Z axis up: true
PCB seating plane: z=0
This removes the previously reported approximately 27.38 × 26.2 mm inflated rendered envelope at the part source.
Verification evidence
Re-read S5: VPP, pin S5, Pin Type=Not Connected, Part Type=Terminal, no nets.
Re-read model node: new asset resolved, zero position/rotation, unity scale, Z-up.
Asset pipeline compiled the model and reported 11.2 × 13.1976 × 1.11 mm bounds.
Top/front/isometric renders completed successfully and show a seated, low-profile socket with lands aligned around the body.
ERC query returned no ERROR, WARNING, OPEN, or UNCERTAIN findings; the prior floating/missing-power symptom for S5 is absent.
Remaining limitation
The false collision with a separate BLE module occurs in a consuming PCB project, not in this standalone part project. The model-bound root cause is corrected here, but that board's overlap check must refresh after updating to this part revision; it cannot be directly rerun from this part project.