I’ll proceed with post-substitution layout cleanup, then route the PCB and run DRC/airwire checks. I’ll keep this to the routing phase and report any manufacturing blockers separately.
Routed the PCB: auto-routing completed and added 558 trace/via nodes while preserving the portrait board, centered vertical display stack, and isolated magnetometer placement.
Open blocker:
The board is not yet JLC-ready because U3’s STM32 footprint has duplicate exposed-pad thermal sub-pads overlapping the grounded center pad. Final checks show 9 overlapping-copper errors and 1 remaining GND airwire, all tied to that U3 footprint issue.
Suggested next steps:
Replace/correct U3’s footprint with a clean STM32L031 UFQFPN/QFN-32 exposed-pad footprint.
Re-run DRC and route cleanup after the footprint fix.
Re-check JLC/LCSC BOM status before manufacturing export.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant